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NXP Semiconductors S9S08SG16E1CTGR

Part No.:
S9S08SG16E1CTGR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
16-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixS9S08SG16E1CTGR.pdf
Description:
IC MCU 8BIT 16KB FLASH 16TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,556

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Product details

Overview

S9S08SG16E1CTGR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB on-chip Flash, 1 KB RAM, and integrated peripherals including 10-bit ADC, dual TPM timers, SCI, SPI, I²C, ACMP, and RTC. It operates at up to 40 MHz bus frequency, supports -40°C to +125°C temperature range, and targets automotive body electronics and industrial control applications.

For engineers reviewing the S9S08SG16E1CTGR datasheet, S9S08SG16E1CTGR pinout, S9S08SG16E1CTGR application, or S9S08SG16E1CTGR equivalent, key selection criteria include Flash size (16 KB), TSSOP-16 package, 22 GPIOs, stop3 mode operation for ultra-low-power wake-up, and AEC-Q100 qualification suitability for automotive environments.

Technical Context

The S9S08SG16E1CTGR implements the HCS08 CPU core with HC08 instruction set extension, featuring a frequency-locked loop (FLL)-based Internal Clock Source (ICS) supporting 2–20 MHz bus frequencies. Its memory architecture includes 16 KB of on-chip Flash with block protection, 1 KB RAM, and nonvolatile register space for trimming and configuration.

Peripherals are tightly coupled to the CPU via a unified memory map: the 16-channel 10-bit ADC supports temperature sensor and internal bandgap reference; dual 2-channel TPM modules provide input capture, output compare, and PWM; and the real-time counter (RTC) runs in all modes-including stop3-using a dedicated 1 kHz low-power oscillator.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureHCS08 8-bit CPU with 40-MHz max bus frequency and BGND instruction support
Flash Memory16 KB on-chip Flash with read/program/erase over full voltage and temperature range (-40°C to +125°C)
RAM Size1 KB on-chip RAM with security circuitry to prevent unauthorized access
ADC Resolution10-bit SAR ADC with 16 channels, 2.5 µs conversion time, and internal temperature sensor
Package Type16-pin TSSOP (Thin Shrink Small Outline Package), 4.4 mm × 5.0 mm footprint
Operating Voltage2.7 V to 5.5 V supply range with low-voltage detection (LVD) and warning (LVW) features
Temperature Range-40°C to +125°C ambient operating range, qualified per AEC-Q100 Grade 2 requirements

Pinout & Package

Package: 16-pin TSSOP (Thin Shrink Small Outline Package), 0.65 mm pitch, JEDEC MO-153 compliant, thermal resistance θJA = 113 °C/W (single-layer board, 200 ft/min airflow).

Pin/TerminalCircuit RoleDesign Meaning
VDDPower SupplyMain digital supply input (2.7–5.5 V); decoupling required near pin
VSSGroundDigital ground reference; must be connected to system ground plane
RESETReset InputActive-low asynchronous reset; internal pull-up; accepts external reset signal or power-on reset pulse
BKGD/MSDebug InterfaceSingle-wire background debug pin; also functions as mode select during reset
PTA0–PTA1GPIO / PeripheralPort A pins; support SCI RX/TX, TPM channel, or general-purpose I/O with configurable slew rate and pull-up
PTB0–PTB7GPIO / PeripheralPort B pins; include ADC inputs, TPM channels, and interrupt-capable inputs with edge/level sensitivity
PTC0–PTC3GPIO / PeripheralPort C pins; support I²C SDA/SCL, SPI MOSI/MISO/SCK, and ganged output capability (PTC[3:0])

Key Features

FeatureDesign Value
Stop3 Ultra-Low-Power ModeEnables RTC and ACMP to remain active while CPU and most peripherals halt; consumes <1 µA typical current
Integrated Real-Time Counter (RTC)8-bit modulus counter with binary/decimal prescaler; free-running on 1 kHz internal oscillator for cyclic wake-up without external components
On-Chip Security CircuitryPrevents unauthorized read-out of Flash and RAM contents via background debug interface or mass erase commands
Internal Clock Source (ICS)FLL-based clock generator with precision-trimmed internal reference (±0.2% resolution); supports 2–20 MHz bus frequencies across temperature
Peripheral IntegrationIncludes 10-bit ADC, dual 2-channel TPM, SCI (LIN-compliant), SPI, I²C, ACMP, and MTIM-all mapped into unified memory space

Applications

Automotive Body Control ModuleIndustrial Sensor Node

Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in passenger vehicles.

IC Role / Device Role / Timing Role: Main MCU executing real-time control logic, managing LIN/SCI communication with slave nodes, and sampling analog sensors (e.g., potentiometers, thermistors).

Use Value: Integrated 10-bit ADC and LIN-capable SCI eliminate external signal conditioning and transceivers; stop3 mode enables periodic wake-up for battery monitoring without external RTC.

Use Scenario: Battery-powered environmental sensor unit measuring temperature, humidity, and motion in factory automation or building management systems.

IC Role / Device Role / Timing Role: Low-power data acquisition controller interfacing with analog and digital sensors, performing local threshold comparisons via ACMP, and transmitting alerts via SPI or I²C to gateway MCU.

Use Value: On-chip 1 kHz RTC and stop3 mode allow sub-µA sleep current with deterministic wake-up intervals; internal bandgap reference ensures stable ADC accuracy across voltage and temperature.

Smart Actuator DriverAppliance Motor Control

Use Scenario: Compact actuator module for HVAC dampers or valve positioning requiring precise PWM timing and fault monitoring.

IC Role / Device Role / Timing Role: Dedicated motor driver MCU generating center-aligned PWM outputs via TPM modules, reading position feedback via ADC, and detecting overcurrent via ACMP.

Use Value: Dual TPM modules support simultaneous 2-channel PWM generation with dead-time insertion; ACMP output can be routed directly to TPM for hardware-triggered shutdown on overcurrent event.

Use Scenario: Brushless DC motor control in washing machines or refrigerators where cost, size, and reliability are critical.

IC Role / Device Role / Timing Role: System-level MCU managing commutation sequencing, speed regulation, and thermal protection using ADC, TPM, and RTC.

Use Value: 16 KB Flash accommodates field-upgradable firmware; ganged GPIO writes (PTB[5:2], PTC[3:0]) simplify multi-pin state changes for motor phase control signals.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08SG32E1CTGR32 KB Flash, identical peripheral set, same 16-pin TSSOP package and pinoutHigher Flash capacity supports larger firmware images and bootloader + application separationSelect when future firmware expansion or secure OTA updates require >16 KB code space
S9KEAZ128AMLHKinetis E-series ARM Cortex-M0+ core, 128 KB Flash, 16 KB RAM, enhanced analog and timing peripheralsHigher performance, richer peripheral set, and modern toolchain support-but requires PCB redesign due to different pin count and package (LQFP-64)Choose for new designs needing scalable performance, CAN interface, or long-term roadmap alignment beyond 8-bit architecture

Compared with MC9S08SG32E1CTGR, the S9S08SG16E1CTGR offers identical functionality in a cost-optimized 16 KB Flash variant; versus S9KEAZ128AMLH, it provides pin-compatible legacy support and lower BOM cost but lacks ARM ecosystem advantages and advanced peripherals like CAN or USB.

Availability

S9S08SG16E1CTGR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart actuators, and appliance motor control requiring stable component supply and long-lifecycle support.

Supply support for S9S08SG16E1CTGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, formed through the acquisition of Freescale Semiconductor in 2015.

The S9S08SG16E1CTGR belongs to the legacy HCS08 microcontroller family designed for cost-sensitive, high-reliability embedded control in automotive and industrial environments-emphasizing low power, robustness, and integration of essential analog and timing peripherals.

FAQ

What is the maximum bus frequency supported by the S9S08SG16E1CTGR?

The S9S08SG16E1CTGR supports a maximum bus frequency of 40 MHz when operating within its specified voltage and temperature range. This is achieved using the internal clock source (ICS) with frequency-locked loop (FLL) and appropriate external crystal or internal reference trimming. The actual achievable frequency depends on supply voltage and ambient temperature, with derating above 125°C per datasheet specifications.

Does the S9S08SG16E1CTGR include hardware security features?

Yes, the S9S08SG16E1CTGR includes on-chip security circuitry that prevents unauthorized access to Flash and RAM contents via the background debug interface or mass erase commands. This is implemented through nonvolatile protection bits (NVOPT and NVPROT) and lock bits that disable read-out once programmed. Security activation is irreversible and must be configured during firmware development.

Can the S9S08SG16E1CTGR operate in ultra-low-power modes with peripherals active?

Yes, the S9S08SG16E1CTGR supports Stop3 mode, where the CPU and most peripherals halt while the real-time counter (RTC), analog comparator (ACMP), and certain wakeup sources remain active. In this mode, typical current consumption is less than 1 µA, enabling battery-operated applications with long standby life and deterministic wake-up intervals using the internal 1 kHz oscillator.

What analog peripherals are integrated into the S9S08SG16E1CTGR?

The S9S08SG16E1CTGR integrates a 16-channel, 10-bit successive approximation register (SAR) ADC with 2.5 µs conversion time, internal temperature sensor, and internal bandgap reference channel. It also includes two analog comparators (ACMP) with selectable interrupt on rising/falling/both edges, optional routing to TPM for hardware-triggered actions, and comparison against fixed internal bandgap voltage.

Is the S9S08SG16E1CTGR pin-compatible with other devices in the MC9S08SGxx family?

Yes, the S9S08SG16E1CTGR is pin-compatible with the MC9S08SG32E1CTGR in the 16-pin TSSOP package, sharing identical pin assignments, electrical characteristics, and peripheral mapping. Both devices use the same silicon die with differing Flash sizes, enabling direct substitution where firmware fits within 16 KB without layout changes.

S9S08SG16E1CTGR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
16-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
12
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08SG16E1CTGR FAQ

1.How can I place an order for S9S08SG16E1CTGR through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S08SG16E1CTGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S08SG16E1CTGR reliable?

The price and inventory of S9S08SG16E1CTGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG16E1CTGR is usually 5 days.

3.What payment methods are accepted for S9S08SG16E1CTGR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08SG16E1CTGR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S9S08SG16E1CTGR?

S9S08SG16E1CTGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S08SG16E1CTGR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S08SG16E1CTGR?

For technical support, including S9S08SG16E1CTGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG16E1CTGR requirements.

6.How does Aetrix verify that S9S08SG16E1CTGR is sourced from the original manufacturer or authorized distributors?

All S9S08SG16E1CTGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG16E1CTGR meets industry standards.

7.What is the process for return or replacement of S9S08SG16E1CTGR?

All S9S08SG16E1CTGR units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG16E1CTGR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08SG16E1CTGR part is unused and in its original packaging.

Return procedure for S9S08SG16E1CTGR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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