NXP Semiconductors S9S08SG16E1CTJ
- Part No.:
- S9S08SG16E1CTJ
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
S9S08SG16E1CTJ.pdf
- Description:
- IC MCU 8BIT 16KB FLASH 20TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:3,873
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S9S08SG16E1CTJ from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB on-chip FLASH, 1 KB RAM, and integrated peripherals including 10-bit ADC, dual TPM timers, SCI, SPI, I²C, ACMP, RTC, and low-voltage detection. It operates at up to 40 MHz bus frequency, supports stop3 mode for ultra-low-power operation, and targets automotive body electronics and industrial control applications.
For engineers reviewing the S9S08SG16E1CTJ datasheet, S9S08SG16E1CTJ pinout, S9S08SG16E1CTJ application, or S9S08SG16E1CTJ equivalent, key selection criteria include its 16-TSSOP package, -40°C to +125°C temperature grade, 22 GPIOs with configurable slew rate and pull-ups, single-wire background debug interface, and FLASH block protection for secure firmware deployment.
Technical Context
The S9S08SG16E1CTJ implements the HCS08 CPU core with HC08 instruction set compatibility, BGND support, and up to 32 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference enabling ±1.5% frequency deviation over –40°C to +125°C.
Peripherals include a 16-channel 10-bit ADC with 2.5 µs conversion time and internal temperature sensor, two 2-channel TPM modules supporting input capture/output compare/PWM, and real-time counter (RTC) with free-running 1 kHz low-power oscillator that operates in all MCU modes including stop3.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS08 8-bit CPU with 40-MHz max bus frequency and BGND instruction support |
| Memory | 16 KB on-chip FLASH (program/erase over full temp/voltage range), 1 KB RAM |
| ADC | 16-channel, 10-bit resolution, 2.5 µs conversion time, internal bandgap reference and temperature sensor |
| Timers | Two 2-channel TPM modules (TPM1, TPM2); 8-bit modulo timer (MTIM); 8-bit RTC with 1 kHz low-power oscillator |
| I/O | 22 general-purpose I/O pins with configurable pull-up, slew rate, drive strength, and 8 interrupt-capable pins |
| Debug Interface | Single-wire background debug (BDM) with breakpoint capability and on-chip ICE debug module |
| Operating Range | –40°C to +125°C ambient temperature, 2.7 V to 5.5 V supply voltage |
Pinout & Package
Package: 16-pin Thin Shrink Small Outline Package (TSSOP), 4.4 mm × 5.0 mm body, 0.65 mm pitch, lead-free and RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Power supply | Main digital supply input (2.7–5.5 V); decoupling required near pin |
| VSS | Ground | Digital ground reference for all I/O and core logic |
| RESET | Reset input | Active-low asynchronous reset with internal pull-up; accepts external reset signal or power-on reset |
| BKGD/MS | Background debug / Mode select | Single-wire BDM communication and mode configuration during startup |
| PTA0–PTA3 | Port A I/O | 4-bit general-purpose port with interrupt capability, configurable pull-up/slew rate |
| PTB0–PTB5 | Port B I/O | 6-bit general-purpose port; PTB[5:2] supports ganged output for simultaneous write |
| PTC0–PTC3 | Port C I/O | 4-bit general-purpose port; PTC[3:0] supports ganged output |
| XOSC/XFC | Crystal oscillator input/output | Connects to 31.25 kHz–16 MHz crystal or ceramic resonator for external clock source |
Key Features
| Feature | Design Value |
|---|---|
| FLASH Block Protection | Prevents unauthorized read/write/erase of protected FLASH sectors via FPROT/NVPROT registers |
| Low-Voltage Warning (LVW) | Generates interrupt before VDD drops below minimum operating voltage, enabling safe software shutdown |
| Stop3 Ultra-Low-Power Mode | Retains RAM and register contents while disabling CPU, clocks, and most peripherals; RTC and ACMP remain active |
| Internal Clock Source (ICS) | FLL-based clock generation with ±1.5% accuracy over –40°C to +125°C; eliminates need for external crystal in cost-sensitive designs |
| Peripheral Integration | Includes ADC, ACMP, SCI, SPI, I²C, TPM, MTIM, RTC, COP watchdog, and LVD - reduces external component count |
Applications
| Automotive Body Control Module | Industrial Sensor Node |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in entry-level vehicles. IC Role / Device Role / Timing Role: Main system controller executing real-time actuator sequencing, LIN/SCI-based communication, and fault monitoring. Use Value: Integrated LIN-capable SCI, 22 GPIOs with configurable drive strength, and -40°C to +125°C rating ensure robust operation in under-hood and cabin environments. | Use Scenario: Battery-powered environmental sensor hub collecting temperature, humidity, and motion data for predictive maintenance. IC Role / Device Role / Timing Role: Low-power data acquisition and local decision engine using ADC, ACMP, and RTC wake-up scheduling. Use Value: Stop3 mode with active RTC and ACMP enables sub-µA sleep current while maintaining event responsiveness - extending battery life beyond 5 years. |
| Smart Appliance Control Unit | Medical Diagnostic Equipment Subsystem |
Use Scenario: User interface and motor control coordination in washing machines, dishwashers, and HVAC systems. IC Role / Device Role / Timing Role: Real-time PWM generation for BLDC motor drives, touch-button scanning, and display backlight control. Use Value: Dual TPM modules provide independent edge-aligned and center-aligned PWM outputs; ganged I/O simplifies multi-LED status indication. | Use Scenario: Front-end signal conditioning and safety monitoring in portable diagnostic devices (e.g., blood glucose meters, pulse oximeters). IC Role / Device Role / Timing Role: Analog front-end controller managing ADC sampling, reference voltage stability, and low-voltage fault response. Use Value: On-chip 10-bit ADC with internal bandgap reference and temperature sensor eliminates external precision references; LVD/LVW ensures reliable operation during battery depletion. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08SG32E1CTJ | 32 KB FLASH, identical peripheral set and pinout; same 16-TSSOP package and temperature grade | Supports larger firmware images and more complex state machines without hardware redesign | Select when future firmware growth or feature expansion is anticipated |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+ core, 128 KB FLASH, 16 KB RAM, higher performance but different architecture and toolchain | Requires migration from HCS08 assembly/C to ARM GCC/Keil; not drop-in compatible | Choose for new designs needing higher throughput, USB, or CAN, accepting architectural change |
Compared with MC9S08SG32E1CTJ, the S9S08SG16E1CTJ offers identical I/O, timing, and debug capabilities in the same footprint but with half the FLASH - ideal for cost-optimized implementations where code size is constrained. Versus S9KEAZ128AMLH, it avoids ARM migration complexity while delivering proven reliability in legacy automotive platforms.
Availability
S9S08SG16E1CTJ is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart appliance control units, and medical diagnostic subsystems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S9S08SG16E1CTJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The S9S08SG16E1CTJ belongs to the HCS08 microcontroller family, designed specifically for cost-sensitive, high-reliability embedded control applications in automotive body electronics and industrial automation where deterministic real-time response and extended temperature operation are critical.
FAQ
What is the maximum bus frequency supported by the S9S08SG16E1CTJ?
The S9S08SG16E1CTJ supports a maximum bus frequency of 40 MHz when operating within its specified voltage and temperature range. This frequency is achieved using the internal clock source (ICS) with FLL enabled and properly configured. At temperatures above 125°C, the maximum bus frequency is reduced to 36 MHz to maintain timing integrity and reliability across the extended operating range of the S9S08SG16E1CTJ.
Does the S9S08SG16E1CTJ support LIN communication?
Yes, the S9S08SG16E1CTJ supports LIN communication through its Serial Communications Interface (SCI) module, which includes dedicated hardware features for LIN protocol implementation. Specifically, the SCI provides master-mode extended break generation and slave-mode extended break detection, enabling direct compliance with LIN 2.x specifications without additional external components or bit-banging overhead - a key capability confirmed in the official MC9S08SG32/SG16 datasheet revision 8.
What debug interface does the S9S08SG16E1CTJ use, and is external hardware required?
The S9S08SG16E1CTJ uses a single-wire background debug (BDM) interface accessible via the BKGD/MS pin. No external debug probe is strictly required for basic programming and debugging - a simple level-shifting circuit can connect directly to a UART-to-USB adapter. However, for full-featured in-circuit emulation (ICE), breakpoint management, and trace capabilities, NXP's OSBDM or third-party BDM-compatible debuggers are recommended to fully leverage the on-chip debug module in the S9S08SG16E1CTJ.
Can the S9S08SG16E1CTJ operate in ultra-low-power modes with peripherals active?
Yes, the S9S08SG16E1CTJ supports Stop3 mode - an ultra-low-power state where the CPU, bus clock, and most peripherals are disabled while retaining RAM and register contents. In this mode, the real-time counter (RTC) and analog comparator (ACMP) remain functional and can generate interrupts to wake the device. This capability allows the S9S08SG16E1CTJ to achieve sub-microamp quiescent current while maintaining responsiveness to time-based or analog events.
Is the S9S08SG16E1CTJ pin-compatible with other members of the MC9S08SGxx family?
Yes, the S9S08SG16E1CTJ is pin-compatible with the MC9S08SG32E1CTJ and other 16-pin TSSOP variants in the SGxx family, including identical pin assignments for VDD, VSS, RESET, BKGD/MS, XOSC/XFC, and all port pins (PTA0–PTA3, PTB0–PTB5, PTC0–PTC3). This allows direct substitution in existing PCB layouts when migrating between 16 KB and 32 KB FLASH variants, provided firmware accommodates memory map differences - a documented compatibility confirmed in Freescale's MC9S08SG32/SG16 datasheet revision 8.
S9S08SG16E1CTJ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 16
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08SG16E1CTJ FAQ
1.How can I place an order for S9S08SG16E1CTJ through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08SG16E1CTJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08SG16E1CTJ reliable?
The price and inventory of S9S08SG16E1CTJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG16E1CTJ is usually 5 days.
3.What payment methods are accepted for S9S08SG16E1CTJ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08SG16E1CTJ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S08SG16E1CTJ?
S9S08SG16E1CTJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08SG16E1CTJ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08SG16E1CTJ?
For technical support, including S9S08SG16E1CTJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG16E1CTJ requirements.
6.How does Aetrix verify that S9S08SG16E1CTJ is sourced from the original manufacturer or authorized distributors?
All S9S08SG16E1CTJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG16E1CTJ meets industry standards.
7.What is the process for return or replacement of S9S08SG16E1CTJ?
All S9S08SG16E1CTJ units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG16E1CTJ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08SG16E1CTJ part is unused and in its original packaging.
Return procedure for S9S08SG16E1CTJ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S9S08SG16E1CTJ Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

