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NXP Semiconductors S9S08SG16E1CTJ

Part No.:
S9S08SG16E1CTJ
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
20-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixS9S08SG16E1CTJ.pdf
Description:
IC MCU 8BIT 16KB FLASH 20TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,873

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Product details

Overview

S9S08SG16E1CTJ from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB on-chip FLASH, 1 KB RAM, and integrated peripherals including 10-bit ADC, dual TPM timers, SCI, SPI, I²C, ACMP, RTC, and low-voltage detection. It operates at up to 40 MHz bus frequency, supports stop3 mode for ultra-low-power operation, and targets automotive body electronics and industrial control applications.

For engineers reviewing the S9S08SG16E1CTJ datasheet, S9S08SG16E1CTJ pinout, S9S08SG16E1CTJ application, or S9S08SG16E1CTJ equivalent, key selection criteria include its 16-TSSOP package, -40°C to +125°C temperature grade, 22 GPIOs with configurable slew rate and pull-ups, single-wire background debug interface, and FLASH block protection for secure firmware deployment.

Technical Context

The S9S08SG16E1CTJ implements the HCS08 CPU core with HC08 instruction set compatibility, BGND support, and up to 32 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference enabling ±1.5% frequency deviation over –40°C to +125°C.

Peripherals include a 16-channel 10-bit ADC with 2.5 µs conversion time and internal temperature sensor, two 2-channel TPM modules supporting input capture/output compare/PWM, and real-time counter (RTC) with free-running 1 kHz low-power oscillator that operates in all MCU modes including stop3.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureHCS08 8-bit CPU with 40-MHz max bus frequency and BGND instruction support
Memory16 KB on-chip FLASH (program/erase over full temp/voltage range), 1 KB RAM
ADC16-channel, 10-bit resolution, 2.5 µs conversion time, internal bandgap reference and temperature sensor
TimersTwo 2-channel TPM modules (TPM1, TPM2); 8-bit modulo timer (MTIM); 8-bit RTC with 1 kHz low-power oscillator
I/O22 general-purpose I/O pins with configurable pull-up, slew rate, drive strength, and 8 interrupt-capable pins
Debug InterfaceSingle-wire background debug (BDM) with breakpoint capability and on-chip ICE debug module
Operating Range–40°C to +125°C ambient temperature, 2.7 V to 5.5 V supply voltage

Pinout & Package

Package: 16-pin Thin Shrink Small Outline Package (TSSOP), 4.4 mm × 5.0 mm body, 0.65 mm pitch, lead-free and RoHS compliant.

Pin/TerminalCircuit RoleDesign Meaning
VDDPower supplyMain digital supply input (2.7–5.5 V); decoupling required near pin
VSSGroundDigital ground reference for all I/O and core logic
RESETReset inputActive-low asynchronous reset with internal pull-up; accepts external reset signal or power-on reset
BKGD/MSBackground debug / Mode selectSingle-wire BDM communication and mode configuration during startup
PTA0–PTA3Port A I/O4-bit general-purpose port with interrupt capability, configurable pull-up/slew rate
PTB0–PTB5Port B I/O6-bit general-purpose port; PTB[5:2] supports ganged output for simultaneous write
PTC0–PTC3Port C I/O4-bit general-purpose port; PTC[3:0] supports ganged output
XOSC/XFCCrystal oscillator input/outputConnects to 31.25 kHz–16 MHz crystal or ceramic resonator for external clock source

Key Features

FeatureDesign Value
FLASH Block ProtectionPrevents unauthorized read/write/erase of protected FLASH sectors via FPROT/NVPROT registers
Low-Voltage Warning (LVW)Generates interrupt before VDD drops below minimum operating voltage, enabling safe software shutdown
Stop3 Ultra-Low-Power ModeRetains RAM and register contents while disabling CPU, clocks, and most peripherals; RTC and ACMP remain active
Internal Clock Source (ICS)FLL-based clock generation with ±1.5% accuracy over –40°C to +125°C; eliminates need for external crystal in cost-sensitive designs
Peripheral IntegrationIncludes ADC, ACMP, SCI, SPI, I²C, TPM, MTIM, RTC, COP watchdog, and LVD - reduces external component count

Applications

Automotive Body Control ModuleIndustrial Sensor Node

Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in entry-level vehicles.

IC Role / Device Role / Timing Role: Main system controller executing real-time actuator sequencing, LIN/SCI-based communication, and fault monitoring.

Use Value: Integrated LIN-capable SCI, 22 GPIOs with configurable drive strength, and -40°C to +125°C rating ensure robust operation in under-hood and cabin environments.

Use Scenario: Battery-powered environmental sensor hub collecting temperature, humidity, and motion data for predictive maintenance.

IC Role / Device Role / Timing Role: Low-power data acquisition and local decision engine using ADC, ACMP, and RTC wake-up scheduling.

Use Value: Stop3 mode with active RTC and ACMP enables sub-µA sleep current while maintaining event responsiveness - extending battery life beyond 5 years.

Smart Appliance Control UnitMedical Diagnostic Equipment Subsystem

Use Scenario: User interface and motor control coordination in washing machines, dishwashers, and HVAC systems.

IC Role / Device Role / Timing Role: Real-time PWM generation for BLDC motor drives, touch-button scanning, and display backlight control.

Use Value: Dual TPM modules provide independent edge-aligned and center-aligned PWM outputs; ganged I/O simplifies multi-LED status indication.

Use Scenario: Front-end signal conditioning and safety monitoring in portable diagnostic devices (e.g., blood glucose meters, pulse oximeters).

IC Role / Device Role / Timing Role: Analog front-end controller managing ADC sampling, reference voltage stability, and low-voltage fault response.

Use Value: On-chip 10-bit ADC with internal bandgap reference and temperature sensor eliminates external precision references; LVD/LVW ensures reliable operation during battery depletion.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08SG32E1CTJ32 KB FLASH, identical peripheral set and pinout; same 16-TSSOP package and temperature gradeSupports larger firmware images and more complex state machines without hardware redesignSelect when future firmware growth or feature expansion is anticipated
S9KEAZ128AMLHKinetis E-series ARM Cortex-M0+ core, 128 KB FLASH, 16 KB RAM, higher performance but different architecture and toolchainRequires migration from HCS08 assembly/C to ARM GCC/Keil; not drop-in compatibleChoose for new designs needing higher throughput, USB, or CAN, accepting architectural change

Compared with MC9S08SG32E1CTJ, the S9S08SG16E1CTJ offers identical I/O, timing, and debug capabilities in the same footprint but with half the FLASH - ideal for cost-optimized implementations where code size is constrained. Versus S9KEAZ128AMLH, it avoids ARM migration complexity while delivering proven reliability in legacy automotive platforms.

Availability

S9S08SG16E1CTJ is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart appliance control units, and medical diagnostic subsystems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S9S08SG16E1CTJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The S9S08SG16E1CTJ belongs to the HCS08 microcontroller family, designed specifically for cost-sensitive, high-reliability embedded control applications in automotive body electronics and industrial automation where deterministic real-time response and extended temperature operation are critical.

FAQ

What is the maximum bus frequency supported by the S9S08SG16E1CTJ?

The S9S08SG16E1CTJ supports a maximum bus frequency of 40 MHz when operating within its specified voltage and temperature range. This frequency is achieved using the internal clock source (ICS) with FLL enabled and properly configured. At temperatures above 125°C, the maximum bus frequency is reduced to 36 MHz to maintain timing integrity and reliability across the extended operating range of the S9S08SG16E1CTJ.

Does the S9S08SG16E1CTJ support LIN communication?

Yes, the S9S08SG16E1CTJ supports LIN communication through its Serial Communications Interface (SCI) module, which includes dedicated hardware features for LIN protocol implementation. Specifically, the SCI provides master-mode extended break generation and slave-mode extended break detection, enabling direct compliance with LIN 2.x specifications without additional external components or bit-banging overhead - a key capability confirmed in the official MC9S08SG32/SG16 datasheet revision 8.

What debug interface does the S9S08SG16E1CTJ use, and is external hardware required?

The S9S08SG16E1CTJ uses a single-wire background debug (BDM) interface accessible via the BKGD/MS pin. No external debug probe is strictly required for basic programming and debugging - a simple level-shifting circuit can connect directly to a UART-to-USB adapter. However, for full-featured in-circuit emulation (ICE), breakpoint management, and trace capabilities, NXP's OSBDM or third-party BDM-compatible debuggers are recommended to fully leverage the on-chip debug module in the S9S08SG16E1CTJ.

Can the S9S08SG16E1CTJ operate in ultra-low-power modes with peripherals active?

Yes, the S9S08SG16E1CTJ supports Stop3 mode - an ultra-low-power state where the CPU, bus clock, and most peripherals are disabled while retaining RAM and register contents. In this mode, the real-time counter (RTC) and analog comparator (ACMP) remain functional and can generate interrupts to wake the device. This capability allows the S9S08SG16E1CTJ to achieve sub-microamp quiescent current while maintaining responsiveness to time-based or analog events.

Is the S9S08SG16E1CTJ pin-compatible with other members of the MC9S08SGxx family?

Yes, the S9S08SG16E1CTJ is pin-compatible with the MC9S08SG32E1CTJ and other 16-pin TSSOP variants in the SGxx family, including identical pin assignments for VDD, VSS, RESET, BKGD/MS, XOSC/XFC, and all port pins (PTA0–PTA3, PTB0–PTB5, PTC0–PTC3). This allows direct substitution in existing PCB layouts when migrating between 16 KB and 32 KB FLASH variants, provided firmware accommodates memory map differences - a documented compatibility confirmed in Freescale's MC9S08SG32/SG16 datasheet revision 8.

S9S08SG16E1CTJ Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
20-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08SG16E1CTJ FAQ

1.How can I place an order for S9S08SG16E1CTJ through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S08SG16E1CTJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S08SG16E1CTJ reliable?

The price and inventory of S9S08SG16E1CTJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG16E1CTJ is usually 5 days.

3.What payment methods are accepted for S9S08SG16E1CTJ?

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4.How is shipping managed for S9S08SG16E1CTJ?

S9S08SG16E1CTJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S08SG16E1CTJ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S08SG16E1CTJ?

For technical support, including S9S08SG16E1CTJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG16E1CTJ requirements.

6.How does Aetrix verify that S9S08SG16E1CTJ is sourced from the original manufacturer or authorized distributors?

All S9S08SG16E1CTJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG16E1CTJ meets industry standards.

7.What is the process for return or replacement of S9S08SG16E1CTJ?

All S9S08SG16E1CTJ units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG16E1CTJ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08SG16E1CTJ part is unused and in its original packaging.

Return procedure for S9S08SG16E1CTJ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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