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NXP Semiconductors S9S08SG16E1CTJR
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- Part No.:
- S9S08SG16E1CTJR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
S9S08SG16E1CTJR.pdf
- Description:
- IC MCU 8BIT 16KB FLASH 20TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,359
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Product details
Overview
S9S08SG16E1CTJR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB on-chip Flash, 1 KB RAM, and integrated peripherals including 10-bit ADC, dual TPM timers, SCI, SPI, I²C, ACMP, and RTC. It operates at up to 40 MHz bus frequency, supports -40°C to +125°C temperature range, and targets embedded control in automotive body electronics and industrial sensors.
For engineers reviewing the S9S08SG16E1CTJR datasheet, S9S08SG16E1CTJR pinout, S9S08SG16E1CTJR application, or S9S08SG16E1CTJR equivalent, key selection criteria include Flash size (16 KB), TSSOP-28 package, 22 GPIOs with configurable slew rate and pull-ups, stop3 mode current (1.5 µA typical), and integrated low-voltage detection with interrupt capability.
Technical Context
The S9S08SG16E1CTJR implements the HCS08 CPU core with 36–40 MHz operation depending on temperature grade, featuring a frequency-locked loop (FLL) clock system supporting internal trimming for ±1.5% accuracy over -40°C to +125°C. It integrates a single-wire background debug interface and on-chip ICE module with two comparators and nine trigger modes.
Peripherals include a 16-channel 10-bit ADC with 2.5 µs conversion time and internal bandgap reference, dual 2-channel TPM modules supporting edge- or center-aligned PWM, and real-time counter with 1 kHz low-power oscillator enabling wake-up from all power modes. The device supports LIN-compliant SCI with extended break generation/detection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU, 40 MHz max bus frequency (36 MHz above 125°C) |
| Flash Memory | 16 KB on-chip FLASH with block protection, program/erase over full voltage/temperature range |
| RAM | 1 KB on-chip RAM, retained in stop3 mode |
| ADC | 16-channel, 10-bit resolution, 2.5 µs conversion time, internal temperature sensor and bandgap reference |
| Timers | Two 2-channel TPM modules (TPM1, TPM2); 8-bit modulo timer (MTIM); 8-bit real-time counter (RTC) with 1 kHz oscillator |
| I/O | 22 general-purpose I/O pins with configurable pull-up, slew rate, drive strength, and 8 interrupt-capable pins |
| Power Modes | Run, wait, stop2, stop3; stop3 draws 1.5 µA typical at 3.3 V, –40°C to +85°C |
Pinout & Package
Package: 28-pin Thin Shrink Small Outline Package (TSSOP), 4.4 mm × 9.7 mm body, 0.65 mm pitch, lead-free and RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual supply pins for core/analog domain; decoupling required per datasheet layout guidelines |
| XTAL, EXTAL | Crystal/resonator connection | Supports 31.25 kHz–16 MHz external crystal or ceramic resonator for precision clock source |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external reset signal or watchdog timeout |
| BKGD/MS | Single-wire background debug / mode select | Enables in-circuit debugging via BDM interface; also selects boot mode during reset |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit port with interrupt capability on all pins; PTA0–PTA3 support analog comparator inputs |
| PTB0–PTB7 | Port B general-purpose I/O | 8-bit port; PTB[5:2] support ganged output for synchronized state change across four pins |
| PTC0–PTC3 | Port C general-purpose I/O | 4-bit port; PTC[3:0] support ganged output; PTC0–PTC1 support SCI transmit/receive functions |
| AD0–AD15 | ADC analog input channels | 16 dedicated analog input pins mapped across PTA, PTB, PTC; shared with digital I/O functionality |
Key Features
| Feature | Design Value |
|---|---|
| Low-power stop3 mode | 1.5 µA typical current draw enables battery-powered applications with long sleep intervals and periodic wake-up via RTC or external interrupt |
| Integrated LIN-compliant SCI | Supports master extended break generation and slave extended break detection per LIN 2.0/2.1, eliminating need for external LIN transceiver in basic implementations |
| On-chip security circuitry | Prevents unauthorized access to Flash and RAM contents via flash protection register (FPROT/NVPROT) and background debug disable |
| Configurable I/O drive strength | Programmable output drive strength and slew rate per pin reduces EMI and allows optimization for noise-sensitive environments |
| Real-time counter with 1 kHz oscillator | Free-running low-power RTC operates in all MCU modes, enabling precise timekeeping and cyclic wake-up without external components |
Applications
| Automotive Door Module Control | Industrial Temperature Sensor Node |
|---|---|
Use Scenario: Centralized control of window lift, mirror adjustment, and interior lighting in vehicle door assemblies. IC Role / Device Role / Timing Role: Main system controller executing motor control logic, switch debouncing, LIN communication, and fault monitoring. Use Value: Integrated 10-bit ADC reads thermistor and potentiometer feedback; TPM PWM drives motor drivers; stop3 mode extends battery life during vehicle sleep. |
Use Scenario: Standalone wireless temperature node in HVAC ducts or factory equipment enclosures. IC Role / Device Role / Timing Role: Sensor acquisition unit with local processing, self-calibration, and low-power wake-up scheduling. Use Value: On-chip temperature sensor and bandgap reference enable drift-compensated measurements; RTC triggers periodic sampling; 1.5 µA stop3 current supports multi-year battery life. |
| Smart Appliance Motor Interface | Medical Diagnostic Handheld Device |
Use Scenario: Brushless DC motor commutation and speed regulation in washing machine drum drives. IC Role / Device Role / Timing Role: Real-time motor controller managing hall-effect feedback, PWM timing, and current sensing. Use Value: Dual TPM modules generate synchronized three-phase PWM outputs; ADC samples current sense resistors at 2.5 µs intervals; ganged I/O simplifies phase enable signaling. |
Use Scenario: Portable blood glucose meter with LCD display, button interface, and USB charging. IC Role / Device Role / Timing Role: System-on-chip managing sensor interface, user input, display refresh, and power sequencing. Use Value: 22 GPIOs support keypad matrix and LCD segment drivers; low-voltage warning (LVW) interrupts alert before battery depletion; security features protect calibration data in Flash. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S08SG32E1CTJR | 32 KB Flash, same pinout and peripheral set; identical TSSOP-28 package and electrical specs | Higher Flash capacity supports larger firmware images and bootloader separation | Select when firmware size exceeds 16 KB or future scalability is required without PCB change |
| MC9RS08KA8CFD | RS08 core, 8 KB Flash, 512 B RAM, no TPM or ACMP; smaller 16-pin TSSOP package | Limited peripheral set and memory; suited for simpler, cost-sensitive functions like LED control or basic I/O expansion | Choose only for minimal-feature applications where S9S08SG16E1CTJR's peripherals and memory are unnecessary |
Compared with S9S08SG16E1CTJR, the S9S08SG32E1CTJR offers direct Flash scalability within identical footprint and timing behavior, while the MC9RS08KA8CFD requires board redesign and sacrifices ADC, TPM, and real-time counter capabilities - making it unsuitable for feature-rich embedded control tasks.
Availability
S9S08SG16E1CTJR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, and smart appliance motor interfaces requiring stable component supply, long-term lifecycle support, and qualified high-temperature operation.
Supply support for S9S08SG16E1CTJR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, formed through the acquisition of Freescale Semiconductor in 2015.
The S9S08SG16E1CTJR belongs to the legacy HCS08 microcontroller family designed for cost-sensitive, low-power embedded control in harsh environments - emphasizing robustness, integrated analog peripherals, and debug-friendly development.
FAQ
What is the maximum operating temperature range for the S9S08SG16E1CTJR?
The S9S08SG16E1CTJR is rated for operation from –40°C to +125°C ambient temperature. This high-temperature capability is validated per Freescale's AEC-Q100 Grade 1 qualification and applies across all specified electrical characteristics, including Flash endurance and ADC performance. The S9S08SG16E1CTJR maintains full functionality without derating in under-hood automotive or industrial enclosure environments.
Does the S9S08SG16E1CTJR support LIN communication natively?
Yes, the S9S08SG16E1CTJR includes a LIN-compliant Serial Communications Interface (SCI) with hardware support for extended break generation (master) and extended break detection (slave), meeting LIN 2.0/2.1 physical layer requirements. No external transceiver is needed for basic LIN node implementation, though a level-shifting transceiver is required for bus compliance in production systems.
How much current does the S9S08SG16E1CTJR draw in its lowest power mode?
In stop3 mode, the S9S08SG16E1CTJR draws 1.5 µA typical at 3.3 V and –40°C to +85°C, as specified in the MC9S08SG32 datasheet Rev. 8, Table A-3. This ultra-low current enables multi-year battery life in intermittent-sampling applications such as environmental sensors or remote controls when combined with RTC wake-up.
Can the S9S08SG16E1CTJR be programmed and debugged in-circuit?
Yes, the S9S08SG16E1CTJR supports single-wire background debug (BDM) via the BKGD/MS pin, enabling full in-circuit programming, breakpoint setting, and real-time variable inspection using standard Freescale/NXP tools like CodeWarrior or S32DS. The on-chip debug module includes two comparators and nine trigger modes for advanced flow analysis.
Is the S9S08SG16E1CTJR pin-compatible with other devices in the SG-series?
Yes, the S9S08SG16E1CTJR is pin-compatible with the S9S08SG32E1CTJR and S9S08SG8E1CTJR in the 28-pin TSSOP package. All share identical pin assignments, electrical characteristics, and peripheral mapping - allowing hardware reuse across Flash variants without PCB modification.
S9S08SG16E1CTJR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 16
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08SG16E1CTJR FAQ
1.How can I place an order for S9S08SG16E1CTJR through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08SG16E1CTJR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08SG16E1CTJR reliable?
The price and inventory of S9S08SG16E1CTJR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG16E1CTJR is usually 5 days.
3.What payment methods are accepted for S9S08SG16E1CTJR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08SG16E1CTJR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S08SG16E1CTJR?
S9S08SG16E1CTJR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08SG16E1CTJR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08SG16E1CTJR?
For technical support, including S9S08SG16E1CTJR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG16E1CTJR requirements.
6.How does Aetrix verify that S9S08SG16E1CTJR is sourced from the original manufacturer or authorized distributors?
All S9S08SG16E1CTJR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG16E1CTJR meets industry standards.
7.What is the process for return or replacement of S9S08SG16E1CTJR?
All S9S08SG16E1CTJR units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG16E1CTJR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08SG16E1CTJR part is unused and in its original packaging.
Return procedure for S9S08SG16E1CTJR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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