NXP Semiconductors S9S08SG16E1CTLR
- Part No.:
- S9S08SG16E1CTLR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 28-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
S9S08SG16E1CTLR.pdf
- Description:
- IC MCU 8BIT 16KB FLASH 28TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:2,500
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Product details
Overview
S9S08SG16E1CTLR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB Flash, 1 KB RAM, 22 GPIOs, 10-bit ADC, dual TPM modules, and integrated I²C/SPI/SCI peripherals - designed for automotive body electronics, industrial control, and low-power sensor nodes.
For engineers reviewing the S9S08SG16E1CTLR datasheet, S9S08SG16E1CTLR pinout, S9S08SG16E1CTLR application, or S9S08SG16E1CTLR equivalent, key selection criteria include its -40°C to +125°C operating range, on-chip ICS with FLL-based clock generation, stop3 mode power consumption of 1.2 µA, 16-channel ADC with temperature sensor, and single-wire background debug interface.
Technical Context
The S9S08SG16E1CTLR implements the HCS08 CPU core running at up to 40 MHz (36 MHz above 125°C), supporting 32 interrupt/reset sources and HC08 instruction set extensions including BGND. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference enabling ±1.5% frequency deviation over –40°C to +125°C.
Peripherals include two 2-channel timer-pulse-width-modulator (TPM) modules supporting input capture, output compare, and edge- or center-aligned PWM; a 16-channel 10-bit ADC with 2.5 µs conversion time and internal bandgap reference; and analog comparators (ACMP) that operate in stop3 mode. The device supports LIN-compliant SCI with extended break generation/detection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU, 40 MHz max bus frequency (36 MHz @ >125°C) |
| Flash Memory | 16 KB on-chip FLASH with block protection, erase/program over full temp/voltage range |
| RAM | 1 KB on-chip RAM with security lock against unauthorized access |
| ADC | 16-channel, 10-bit resolution, 2.5 µs conversion time, includes temperature sensor and bandgap reference |
| Timers | Two 2-channel TPM modules + 8-bit modulo timer (MTIM) + real-time counter (RTC) with 1 kHz low-power oscillator |
| I/O Pins | 22 general-purpose I/O pins with configurable pull-up, slew rate, drive strength, and 8 interrupt-capable inputs |
| Operating Range | -40°C to +125°C ambient temperature, VDD = 2.7–5.5 V |
| Debug Interface | Single-wire background debug (BDM) with breakpoint support and on-chip ICE module |
Pinout & Package
Package: 28-pin TSSOP (Thin Shrink Small Outline Package), 4.4 mm × 9.7 mm body, 0.65 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Power supply | Main digital supply (2.7–5.5 V); decoupling required near pin |
| VSS | GND | Digital ground reference; must be connected to system ground plane |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external push-button or supervisor IC |
| BKGD/MS | Background debug / Mode select | Single-wire BDM interface; pulled high internally for normal operation |
| PTA0–PTA1 | Port A I/O | GPIO with interrupt capability; PTA0 supports reset recovery timing |
| PTB0–PTB7 | Port B I/O | GPIO with ganged output option on PTB[5:2]; 8-bit parallel interface possible |
| PTC0–PTC7 | Port C I/O | GPIO with ganged output on PTC[3:0]; some pins multiplexed with SCI/I²C/SPI |
| XOSC/XFC | Crystal oscillator input/output | Supports 31.25 kHz–16 MHz crystals or ceramic resonators; optional external clock input |
| EXTAL/XTAL | External clock input/output | Alternate oscillator pins; used when XOSC/XFC not selected |
Key Features
| Feature | Design Value |
|---|---|
| Stop3 ultra-low-power mode | 1.2 µA typical current draw with RTC running from 1 kHz internal oscillator - enables battery-powered wake-on-event designs |
| Integrated ICS with FLL | Eliminates need for external crystal in cost-sensitive applications; ±1.5% accuracy over –40°C to +125°C after trimming |
| On-chip security circuitry | Prevents unauthorized read-out of Flash and RAM contents via BDM interface - critical for firmware IP protection |
| LVD/LVW system | Configurable low-voltage detect (reset) and warning (interrupt) thresholds allow graceful shutdown before brownout |
| Peripheral operation in Stop3 | ADC, ACMP, RTC, and SCI remain functional during stop3 - supports sensor monitoring without full MCU wake-up |
| Single-wire BDM interface | Reduces debug footprint to one pin; supports flash programming, breakpoints, and real-time register inspection in-circuit |
Applications
| Automotive Door Module | Industrial Temperature Controller |
|---|---|
Use Scenario: Centralized control of window lift, mirror adjustment, and interior lighting in vehicle door assemblies. IC Role / Device Role / Timing Role: Main MCU executing motor control logic, LIN communication with body controller, and analog sensing of switch states and temperature. Use Value: Integrated TPM modules generate precise PWM for DC motor drives; stop3 mode extends battery life during vehicle sleep cycles. | Use Scenario: Standalone thermostat managing HVAC actuation based on local sensor readings and user-set schedules. IC Role / Device Role / Timing Role: System controller acquiring temperature data via onboard ADC and bandgap reference, driving relay outputs, and maintaining real-time calendar via RTC. Use Value: On-chip temperature sensor and 10-bit ADC eliminate external sensing components; RTC with 1 kHz oscillator enables accurate timekeeping without external crystal. |
| Smart Lighting Node | Appliance Motor Control |
Use Scenario: Wireless-connected LED driver node adjusting brightness and color based on ambient light and occupancy detection. IC Role / Device Role / Timing Role: Sensor fusion hub interfacing photodiode and PIR sensors, modulating LED current via PWM, and communicating via I²C to wireless SoC. Use Value: 22 GPIOs support multiple sensor interfaces; ganged output on PTB/PTC simplifies multi-LED group control with single register write. | Use Scenario: Brushless DC motor commutation in white goods (e.g., washing machine drum drive). IC Role / Device Role / Timing Role: Timing-critical motor controller generating synchronized three-phase PWM signals using dual TPM modules with complementary outputs. Use Value: Edge- and center-aligned PWM modes with dead-time insertion ensure safe gate drive sequencing; stop3 mode reduces standby power when idle. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08SG32E1CTLR | 32 KB Flash, identical peripheral set and pinout; same package and electrical specs | Higher code density margin for complex firmware; no change in PCB layout or driver software | Select when future firmware expansion or bootloader space requirements exceed 16 KB |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+ core, 128 KB Flash, 16 KB RAM, enhanced ADC (12-bit, 1.2 MSPS), additional CAN interface | Requires ARM toolchain migration; supports CAN-based networks and higher computational throughput | Select when migrating from 8-bit to 32-bit architecture or requiring CAN physical layer support |
Compared with MC9S08SG32E1CTLR, the S9S08SG16E1CTLR offers identical functionality at reduced Flash capacity - ideal for cost-optimized implementations where firmware fits within 16 KB. Versus S9KEAZ128AMLH, it provides lower power and simpler toolchain integration but lacks CAN and advanced processing features.
Availability
S9S08SG16E1CTLR is available at Aetrix Electronics and suitable for automotive body electronics, industrial temperature controllers, and smart lighting nodes requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S9S08SG16E1CTLR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The S9S08SG16E1CTLR belongs to the legacy HCS08 microcontroller family, designed specifically for cost-sensitive, low-power embedded control applications in harsh environments - emphasizing robustness, debug accessibility, and long-term supply stability.
FAQ
What is the maximum operating frequency of the S9S08SG16E1CTLR?
The S9S08SG16E1CTLR supports a maximum bus frequency of 40 MHz at ambient temperatures from –40°C to +125°C. When operating above +125°C, the maximum bus frequency is derated to 36 MHz to maintain timing integrity and thermal reliability. This specification is guaranteed across the full voltage range (2.7–5.5 V) and validated per Freescale's Rev. 8 MC9S08SG32 datasheet.
Does the S9S08SG16E1CTLR support LIN communication?
Yes, the S9S08SG16E1CTLR supports LIN communication through its SCI module, which includes dedicated hardware for LIN master extended break generation and LIN slave extended break detection. This enables direct integration into automotive body networks without external LIN transceivers for basic node functionality, as confirmed in Section 14 of the MC9S08SG32 Rev. 8 datasheet.
What power-saving modes are available on the S9S08SG16E1CTLR?
The S9S08SG16E1CTLR offers three low-power modes: Wait mode, Stop2, and Stop3. Stop3 is the deepest, drawing only 1.2 µA typical while keeping the RTC active from its internal 1 kHz oscillator. Both ADC and ACMP remain operational in Stop3, allowing event-triggered wake-up from analog conditions - a capability verified in Chapter 3 and Appendix A of the official datasheet.
Is the S9S08SG16E1CTLR pin-compatible with the MC9S08SG32E1CTLR?
Yes, the S9S08SG16E1CTLR is pin-compatible with the MC9S08SG32E1CTLR in the 28-pin TSSOP package. Both share identical pin assignments, electrical characteristics, peripheral mappings, and memory map structure - differing only in Flash size (16 KB vs. 32 KB) and unimplemented memory region size, as documented in Figure 4-1 of the MC9S08SG32 Rev. 8 datasheet.
What debug interface does the S9S08SG16E1CTLR use?
The S9S08SG16E1CTLR uses a single-wire background debug (BDM) interface via the BKGD/MS pin. It supports in-circuit flash programming, real-time register inspection, and breakpoint debugging using standard Freescale/NXP BDM tools. The on-chip debug module includes two comparators and nine trigger modes, as detailed in Chapter 17 of the MC9S08SG32 Rev. 8 datasheet.
S9S08SG16E1CTLR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 28-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 22
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08SG16E1CTLR FAQ
1.How can I place an order for S9S08SG16E1CTLR through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08SG16E1CTLR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08SG16E1CTLR reliable?
The price and inventory of S9S08SG16E1CTLR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG16E1CTLR is usually 5 days.
3.What payment methods are accepted for S9S08SG16E1CTLR?
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S9S08SG16E1CTLR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08SG16E1CTLR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08SG16E1CTLR?
For technical support, including S9S08SG16E1CTLR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG16E1CTLR requirements.
6.How does Aetrix verify that S9S08SG16E1CTLR is sourced from the original manufacturer or authorized distributors?
All S9S08SG16E1CTLR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG16E1CTLR meets industry standards.
7.What is the process for return or replacement of S9S08SG16E1CTLR?
All S9S08SG16E1CTLR units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG16E1CTLR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08SG16E1CTLR part is unused and in its original packaging.
Return procedure for S9S08SG16E1CTLR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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