NXP Semiconductors S9S08SG16E1MTG
- Part No.:
- S9S08SG16E1MTG
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 16-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
S9S08SG16E1MTG.pdf
- Description:
- IC MCU 8BIT 16KB FLASH 16TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:2,581
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S9S08SG16E1MTG from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB on-chip Flash, 1 KB RAM, and integrated peripherals including 10-bit ADC, dual TPM timers, SCI, SPI, I²C, ACMP, and RTC. It operates at up to 40 MHz bus frequency, supports -40°C to 125°C ambient temperature, and targets embedded control in automotive body electronics and industrial sensors.
For engineers reviewing the S9S08SG16E1MTG datasheet, S9S08SG16E1MTG pinout, S9S08SG16E1MTG application, or S9S08SG16E1MTG equivalent, key selection criteria include Flash size (16 KB), TSSOP-16 package compatibility, stop3-mode peripheral operation (ADC/ACMP/RTC active), internal clock source (ICS) trim accuracy (±0.2% at 25°C), and LIN-capable SCI interface.
Technical Context
The S9S08SG16E1MTG implements the HCS08 CPU core with BGND instruction support and handles up to 32 interrupt/reset sources. Its ICS module uses a frequency-locked loop (FLL) with internal reference trimming for stable 2–20 MHz bus frequencies across voltage and temperature.
Peripherals include a 16-channel 10-bit ADC with 2.5 µs conversion time and internal temperature sensor, two 2-channel TPM modules supporting edge-aligned PWM and input capture, and an SCI with LIN master break generation-enabling direct integration into automotive sub-systems without external protocol translators.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU with 40 MHz max bus frequency and HC08 instruction set extension |
| Flash Memory | 16 KB on-chip FLASH with read/program/erase over full operating voltage and temperature range (–40°C to +125°C) |
| RAM | 1 KB on-chip RAM with security protection against unauthorized access |
| ADC | 16-channel, 10-bit resolution ADC with 2.5 µs conversion time and internal bandgap reference |
| Package | 16-pin TSSOP (thin shrink small outline package), 4.4 mm × 5.0 mm footprint |
| Operating Temp | –40°C to +125°C ambient temperature range, qualified per AEC-Q100 Grade 2 |
| Debug Interface | Single-wire background debug (BDM) interface with one hardware breakpoint and on-chip ICE module |
Pinout & Package
Package: 16-pin TSSOP (Thin Shrink Small Outline Package), 0.65 mm pitch, JEDEC MO-153 compliant, thermal resistance θJA = 113 °C/W (single-layer board, 200 ft/min airflow).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Supply voltage | Primary power input (2.7–5.5 V); powers core, I/O, and analog peripherals |
| VSS | Ground reference | Digital ground return path; must be low-impedance connection to system GND |
| XTAL | Crystal oscillator input | Accepts 31.25 kHz–16 MHz crystal or ceramic resonator for precision clock source |
| EXTAL | Crystal oscillator output | Drives external crystal; forms Pierce oscillator with XTAL pin |
| RESET | Active-low reset input | Asynchronous reset assertion clears CPU registers and initiates boot sequence |
| BKGD/MS | Background debug / mode select | Single-wire BDM communication port; also selects active background mode during reset |
| PTA0–PTA5 | Port A general-purpose I/O | 6-bit GPIO bank with configurable pull-up, slew rate, and interrupt-on-edge capability |
| PTB0–PTB5 | Port B general-purpose I/O | 6-bit GPIO bank supporting ganged output (PTB[5:2]) and analog comparator inputs |
Key Features
| Feature | Design Value |
|---|---|
| Stop3 Low-Power Mode | Enables RTC, ADC, and ACMP to remain operational while CPU and most peripherals are halted-reducing current draw to <1 µA |
| Internal Clock Source (ICS) | FLL-based clock generator with factory-trimmed internal reference (±0.2% at 25°C); eliminates need for external crystal in cost-sensitive applications |
| LIN-Capable SCI | SCI module supports LIN 2.0/2.1 master extended break generation and slave break detection-enabling direct node control in automotive body networks |
| On-Chip Security | FLASH and RAM protection via nonvolatile lock bits (NVOPT/NVPROT); prevents unauthorized read-out or reprogramming of firmware |
| Real-Time Counter (RTC) | 8-bit modulus counter with 1 kHz internal low-power oscillator; provides wake-up timing in all modes without external components |
Applications
| Automotive Door Module | Industrial Temperature Sensor Node |
|---|---|
|
Use Scenario: Centralized control of window lift, mirror adjustment, and interior lighting in vehicle door assemblies. IC Role / Device Role / Timing Role: Main system controller executing motor drive logic, LIN communication with body control module, and analog sensing of switch positions and ambient temperature. Use Value: Integrated LIN-capable SCI and stop3-active ADC allow responsive button polling and periodic temperature reporting while maintaining ultra-low standby current (<1 µA). |
Use Scenario: Battery-powered wireless sensor node measuring ambient temperature and transmitting data via UART-to-RF bridge. IC Role / Device Role / Timing Role: Primary data acquisition and protocol translation unit-converting analog sensor output to digital values and formatting packets for transmission. Use Value: On-chip 10-bit ADC with internal bandgap reference and temperature sensor eliminates external signal conditioning; RTC enables precise sleep/wake scheduling to extend battery life. |
| Smart HVAC Actuator | Appliance Motor Control Board |
|
Use Scenario: Position feedback and closed-loop control of damper actuators in residential HVAC systems. IC Role / Device Role / Timing Role: Real-time PWM generation (via TPM), analog position sensing (via ADC), and serial command interpretation (via SCI). Use Value: Dual TPM modules provide independent 8-bit PWM outputs for bidirectional motor control; stop3-mode ADC allows continuous position monitoring during low-power idle states. |
Use Scenario: Fan speed regulation and thermal monitoring in refrigerators and washing machines. IC Role / Device Role / Timing Role: System supervisor managing motor driver enable signals, reading thermistor inputs, and triggering fault shutdowns. Use Value: Integrated ACMP with internal bandgap reference enables fast overtemperature detection; COP watchdog ensures reliable recovery from software hangs during long-running cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08SG32E1MTG | 32 KB Flash, same 16-pin TSSOP package, identical peripheral set and pinout | Supports larger firmware images and more complex state machines without layout change | Select when future firmware growth or additional feature sets require >16 KB code space |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+ core, 128 KB Flash, 16 KB RAM, LQFP-64 package | Higher performance, richer peripheral set (USB, CAN, multiple ADCs), but requires PCB redesign | Choose for next-generation designs needing scalable architecture, CAN connectivity, or USB device support |
Compared with MC9S08SG32E1MTG, S9S08SG16E1MTG offers identical functionality in a cost-optimized 16 KB Flash variant; versus S9KEAZ128AMLH, it delivers proven reliability and minimal BOM count for legacy-compatible 8-bit control where ARM migration is unnecessary.
Availability
S9S08SG16E1MTG is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart HVAC actuators, and appliance motor control boards requiring stable component supply and long-term lifecycle support.
Supply support for S9S08SG16E1MTG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, formed from the merger of Freescale and NXP in 2015.
The S9S08SG16E1MTG belongs to the HCS08 microcontroller family designed for cost-sensitive, high-reliability embedded control in automotive and industrial environments-emphasizing low power, functional safety readiness, and robust peripheral integration.
FAQ
What is the maximum operating frequency of the S9S08SG16E1MTG?
The S9S08SG16E1MTG supports a maximum bus frequency of 40 MHz under standard conditions (–40°C to +125°C). This is achieved using the internal clock source (ICS) with FLL enabled and appropriate configuration of the ICSTRM register. At temperatures above 125°C, the maximum bus frequency is reduced to 36 MHz to maintain timing integrity. The S9S08SG16E1MTG does not require external clock circuitry to reach this speed when using the factory-trimmed internal reference.
Does the S9S08SG16E1MTG support LIN communication natively?
Yes, the S9S08SG16E1MTG's SCI module supports LIN 2.0/2.1 protocol features directly: it can generate extended breaks (13–27 bit) as a LIN master and detect them as a LIN slave. No external transceiver or software bit-banging is required for basic LIN frame handling. The S9S08SG16E1MTG also includes dedicated LIN-related control bits in the SCICR2 register to simplify implementation in automotive body networks.
What power-saving modes are available on the S9S08SG16E1MTG?
The S9S08SG16E1MTG offers three primary low-power modes: Wait (CPU halted, peripherals active), Stop2 (deep sleep with limited wake-up sources), and Stop3 (deepest mode with RTC, ADC, and ACMP remaining functional). In Stop3 mode, typical current consumption is less than 1 µA at 25°C, enabling battery-operated applications to achieve multi-year operation. The S9S08SG16E1MTG enters these modes via specific STOP instruction sequences and wakes on interrupt or RTC overflow.
Is the S9S08SG16E1MTG pin-compatible with other MC9S08SGxx devices?
Yes, the S9S08SG16E1MTG in the 16-pin TSSOP package shares identical pin assignment and electrical characteristics with the MC9S08SG32E1MTG and MC9S08SG8E1MTG. All three devices use the same 16-pin footprint, I/O mapping, and peripheral register layout-allowing drop-in replacement based solely on Flash size requirements without PCB modification. The S9S08SG16E1MTG maintains full software compatibility across this family.
What debugging interface does the S9S08SG16E1MTG provide?
The S9S08SG16E1MTG integrates a single-wire background debug (BDM) interface accessible through the BKGD/MS pin. It supports real-time memory inspection, register read/write, breakpoint setting (one hardware breakpoint), and flash programming. The on-chip debug module includes a 9-event trigger system and 8-deep FIFO for flow tracing. No external debugger hardware is required beyond a standard BDM pod compatible with HCS08 architecture-making the S9S08SG16E1MTG suitable for rapid prototyping and field firmware updates.
S9S08SG16E1MTG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 16-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 12
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08SG16E1MTG FAQ
1.How can I place an order for S9S08SG16E1MTG through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08SG16E1MTG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08SG16E1MTG reliable?
The price and inventory of S9S08SG16E1MTG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG16E1MTG is usually 5 days.
3.What payment methods are accepted for S9S08SG16E1MTG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08SG16E1MTG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S08SG16E1MTG?
S9S08SG16E1MTG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08SG16E1MTG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08SG16E1MTG?
For technical support, including S9S08SG16E1MTG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG16E1MTG requirements.
6.How does Aetrix verify that S9S08SG16E1MTG is sourced from the original manufacturer or authorized distributors?
All S9S08SG16E1MTG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG16E1MTG meets industry standards.
7.What is the process for return or replacement of S9S08SG16E1MTG?
All S9S08SG16E1MTG units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG16E1MTG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08SG16E1MTG part is unused and in its original packaging.
Return procedure for S9S08SG16E1MTG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S9S08SG16E1MTG Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

