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NXP Semiconductors S9S08SG16E1MTG

Part No.:
S9S08SG16E1MTG
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
16-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixS9S08SG16E1MTG.pdf
Description:
IC MCU 8BIT 16KB FLASH 16TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,581

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Product details

Overview

S9S08SG16E1MTG from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB on-chip Flash, 1 KB RAM, and integrated peripherals including 10-bit ADC, dual TPM timers, SCI, SPI, I²C, ACMP, and RTC. It operates at up to 40 MHz bus frequency, supports -40°C to 125°C ambient temperature, and targets embedded control in automotive body electronics and industrial sensors.

For engineers reviewing the S9S08SG16E1MTG datasheet, S9S08SG16E1MTG pinout, S9S08SG16E1MTG application, or S9S08SG16E1MTG equivalent, key selection criteria include Flash size (16 KB), TSSOP-16 package compatibility, stop3-mode peripheral operation (ADC/ACMP/RTC active), internal clock source (ICS) trim accuracy (±0.2% at 25°C), and LIN-capable SCI interface.

Technical Context

The S9S08SG16E1MTG implements the HCS08 CPU core with BGND instruction support and handles up to 32 interrupt/reset sources. Its ICS module uses a frequency-locked loop (FLL) with internal reference trimming for stable 2–20 MHz bus frequencies across voltage and temperature.

Peripherals include a 16-channel 10-bit ADC with 2.5 µs conversion time and internal temperature sensor, two 2-channel TPM modules supporting edge-aligned PWM and input capture, and an SCI with LIN master break generation-enabling direct integration into automotive sub-systems without external protocol translators.

Key Specifications

Parameter Value and Actual Design Meaning
Core HCS08 8-bit CPU with 40 MHz max bus frequency and HC08 instruction set extension
Flash Memory 16 KB on-chip FLASH with read/program/erase over full operating voltage and temperature range (–40°C to +125°C)
RAM 1 KB on-chip RAM with security protection against unauthorized access
ADC 16-channel, 10-bit resolution ADC with 2.5 µs conversion time and internal bandgap reference
Package 16-pin TSSOP (thin shrink small outline package), 4.4 mm × 5.0 mm footprint
Operating Temp –40°C to +125°C ambient temperature range, qualified per AEC-Q100 Grade 2
Debug Interface Single-wire background debug (BDM) interface with one hardware breakpoint and on-chip ICE module

Pinout & Package

Package: 16-pin TSSOP (Thin Shrink Small Outline Package), 0.65 mm pitch, JEDEC MO-153 compliant, thermal resistance θJA = 113 °C/W (single-layer board, 200 ft/min airflow).

Pin/Terminal Circuit Role Design Meaning
VDD Supply voltage Primary power input (2.7–5.5 V); powers core, I/O, and analog peripherals
VSS Ground reference Digital ground return path; must be low-impedance connection to system GND
XTAL Crystal oscillator input Accepts 31.25 kHz–16 MHz crystal or ceramic resonator for precision clock source
EXTAL Crystal oscillator output Drives external crystal; forms Pierce oscillator with XTAL pin
RESET Active-low reset input Asynchronous reset assertion clears CPU registers and initiates boot sequence
BKGD/MS Background debug / mode select Single-wire BDM communication port; also selects active background mode during reset
PTA0–PTA5 Port A general-purpose I/O 6-bit GPIO bank with configurable pull-up, slew rate, and interrupt-on-edge capability
PTB0–PTB5 Port B general-purpose I/O 6-bit GPIO bank supporting ganged output (PTB[5:2]) and analog comparator inputs

Key Features

Feature Design Value
Stop3 Low-Power Mode Enables RTC, ADC, and ACMP to remain operational while CPU and most peripherals are halted-reducing current draw to <1 µA
Internal Clock Source (ICS) FLL-based clock generator with factory-trimmed internal reference (±0.2% at 25°C); eliminates need for external crystal in cost-sensitive applications
LIN-Capable SCI SCI module supports LIN 2.0/2.1 master extended break generation and slave break detection-enabling direct node control in automotive body networks
On-Chip Security FLASH and RAM protection via nonvolatile lock bits (NVOPT/NVPROT); prevents unauthorized read-out or reprogramming of firmware
Real-Time Counter (RTC) 8-bit modulus counter with 1 kHz internal low-power oscillator; provides wake-up timing in all modes without external components

Applications

Automotive Door Module Industrial Temperature Sensor Node

Use Scenario: Centralized control of window lift, mirror adjustment, and interior lighting in vehicle door assemblies.

IC Role / Device Role / Timing Role: Main system controller executing motor drive logic, LIN communication with body control module, and analog sensing of switch positions and ambient temperature.

Use Value: Integrated LIN-capable SCI and stop3-active ADC allow responsive button polling and periodic temperature reporting while maintaining ultra-low standby current (<1 µA).

Use Scenario: Battery-powered wireless sensor node measuring ambient temperature and transmitting data via UART-to-RF bridge.

IC Role / Device Role / Timing Role: Primary data acquisition and protocol translation unit-converting analog sensor output to digital values and formatting packets for transmission.

Use Value: On-chip 10-bit ADC with internal bandgap reference and temperature sensor eliminates external signal conditioning; RTC enables precise sleep/wake scheduling to extend battery life.

Smart HVAC Actuator Appliance Motor Control Board

Use Scenario: Position feedback and closed-loop control of damper actuators in residential HVAC systems.

IC Role / Device Role / Timing Role: Real-time PWM generation (via TPM), analog position sensing (via ADC), and serial command interpretation (via SCI).

Use Value: Dual TPM modules provide independent 8-bit PWM outputs for bidirectional motor control; stop3-mode ADC allows continuous position monitoring during low-power idle states.

Use Scenario: Fan speed regulation and thermal monitoring in refrigerators and washing machines.

IC Role / Device Role / Timing Role: System supervisor managing motor driver enable signals, reading thermistor inputs, and triggering fault shutdowns.

Use Value: Integrated ACMP with internal bandgap reference enables fast overtemperature detection; COP watchdog ensures reliable recovery from software hangs during long-running cycles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S08SG32E1MTG 32 KB Flash, same 16-pin TSSOP package, identical peripheral set and pinout Supports larger firmware images and more complex state machines without layout change Select when future firmware growth or additional feature sets require >16 KB code space
S9KEAZ128AMLH Kinetis E-series ARM Cortex-M0+ core, 128 KB Flash, 16 KB RAM, LQFP-64 package Higher performance, richer peripheral set (USB, CAN, multiple ADCs), but requires PCB redesign Choose for next-generation designs needing scalable architecture, CAN connectivity, or USB device support

Compared with MC9S08SG32E1MTG, S9S08SG16E1MTG offers identical functionality in a cost-optimized 16 KB Flash variant; versus S9KEAZ128AMLH, it delivers proven reliability and minimal BOM count for legacy-compatible 8-bit control where ARM migration is unnecessary.

Availability

S9S08SG16E1MTG is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart HVAC actuators, and appliance motor control boards requiring stable component supply and long-term lifecycle support.

Supply support for S9S08SG16E1MTG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, formed from the merger of Freescale and NXP in 2015.

The S9S08SG16E1MTG belongs to the HCS08 microcontroller family designed for cost-sensitive, high-reliability embedded control in automotive and industrial environments-emphasizing low power, functional safety readiness, and robust peripheral integration.

FAQ

What is the maximum operating frequency of the S9S08SG16E1MTG?

The S9S08SG16E1MTG supports a maximum bus frequency of 40 MHz under standard conditions (–40°C to +125°C). This is achieved using the internal clock source (ICS) with FLL enabled and appropriate configuration of the ICSTRM register. At temperatures above 125°C, the maximum bus frequency is reduced to 36 MHz to maintain timing integrity. The S9S08SG16E1MTG does not require external clock circuitry to reach this speed when using the factory-trimmed internal reference.

Does the S9S08SG16E1MTG support LIN communication natively?

Yes, the S9S08SG16E1MTG's SCI module supports LIN 2.0/2.1 protocol features directly: it can generate extended breaks (13–27 bit) as a LIN master and detect them as a LIN slave. No external transceiver or software bit-banging is required for basic LIN frame handling. The S9S08SG16E1MTG also includes dedicated LIN-related control bits in the SCICR2 register to simplify implementation in automotive body networks.

What power-saving modes are available on the S9S08SG16E1MTG?

The S9S08SG16E1MTG offers three primary low-power modes: Wait (CPU halted, peripherals active), Stop2 (deep sleep with limited wake-up sources), and Stop3 (deepest mode with RTC, ADC, and ACMP remaining functional). In Stop3 mode, typical current consumption is less than 1 µA at 25°C, enabling battery-operated applications to achieve multi-year operation. The S9S08SG16E1MTG enters these modes via specific STOP instruction sequences and wakes on interrupt or RTC overflow.

Is the S9S08SG16E1MTG pin-compatible with other MC9S08SGxx devices?

Yes, the S9S08SG16E1MTG in the 16-pin TSSOP package shares identical pin assignment and electrical characteristics with the MC9S08SG32E1MTG and MC9S08SG8E1MTG. All three devices use the same 16-pin footprint, I/O mapping, and peripheral register layout-allowing drop-in replacement based solely on Flash size requirements without PCB modification. The S9S08SG16E1MTG maintains full software compatibility across this family.

What debugging interface does the S9S08SG16E1MTG provide?

The S9S08SG16E1MTG integrates a single-wire background debug (BDM) interface accessible through the BKGD/MS pin. It supports real-time memory inspection, register read/write, breakpoint setting (one hardware breakpoint), and flash programming. The on-chip debug module includes a 9-event trigger system and 8-deep FIFO for flow tracing. No external debugger hardware is required beyond a standard BDM pod compatible with HCS08 architecture-making the S9S08SG16E1MTG suitable for rapid prototyping and field firmware updates.

S9S08SG16E1MTG Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
16-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
12
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08SG16E1MTG FAQ

1.How can I place an order for S9S08SG16E1MTG through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S08SG16E1MTG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S08SG16E1MTG reliable?

The price and inventory of S9S08SG16E1MTG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG16E1MTG is usually 5 days.

3.What payment methods are accepted for S9S08SG16E1MTG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08SG16E1MTG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S9S08SG16E1MTG?

S9S08SG16E1MTG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S08SG16E1MTG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S08SG16E1MTG?

For technical support, including S9S08SG16E1MTG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG16E1MTG requirements.

6.How does Aetrix verify that S9S08SG16E1MTG is sourced from the original manufacturer or authorized distributors?

All S9S08SG16E1MTG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG16E1MTG meets industry standards.

7.What is the process for return or replacement of S9S08SG16E1MTG?

All S9S08SG16E1MTG units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG16E1MTG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08SG16E1MTG part is unused and in its original packaging.

Return procedure for S9S08SG16E1MTG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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