NXP Semiconductors S9S08SG16E1MTGR
- Part No.:
- S9S08SG16E1MTGR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 16-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
S9S08SG16E1MTGR.pdf
- Description:
- IC MCU 8BIT 16KB FLASH 16TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:2,887
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S9S08SG16E1MTGR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB on-chip FLASH, 1 KB RAM, and integrated peripherals including 10-bit ADC, dual TPM timers, SCI, SPI, I²C, ACMP, and RTC. It operates at up to 40 MHz bus frequency, supports -40°C to +125°C temperature range, and targets cost-sensitive industrial control and automotive body electronics.
For engineers reviewing the S9S08SG16E1MTGR datasheet, S9S08SG16E1MTGR pinout, S9S08SG16E1MTGR application, or S9S08SG16E1MTGR equivalent, key selection criteria include FLASH size vs. MC9S08SG32, TSSOP-16 package constraints, stop-mode power consumption, internal clock source accuracy (±1.5% over -40°C to 125°C), and background debug interface compatibility.
Technical Context
The S9S08SG16E1MTGR implements the HCS08 CPU core with HC08 instruction set extension, supporting up to 32 interrupt/reset sources and single-wire background debug. Its memory map allocates 16,384 bytes of FLASH (0x1860–0x7FFF), 1,024 bytes of RAM (0x0080–0x047F), and 26,528 unimplemented bytes - distinct from the SG32 variant's 32 KB FLASH layout.
Peripherals include a 16-channel 10-bit ADC with 2.5 µs conversion time and internal bandgap reference, two 2-channel TPM modules supporting edge-aligned PWM, and an RTC with free-running 1 kHz low-power oscillator that operates in all MCU modes including stop3. The ICS module provides bus frequencies from 2 MHz to 20 MHz using FLL with factory-trimmed internal reference.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS08 8-bit CPU with 40 MHz max bus frequency; enables deterministic real-time control in resource-constrained systems. |
| FLASH Memory | 16 KB (16,384 bytes); sufficient for firmware with moderate peripheral driver footprint and bootloader space. |
| RAM Size | 1 KB (1,024 bytes); supports stack depth and data buffers for sensor acquisition and communication stacks. |
| ADC Resolution | 10-bit with 16 input channels; delivers ±1 LSB INL for precision analog sensing in motor control or battery monitoring. |
| Operating Temperature | -40°C to +125°C; qualified for under-hood automotive and industrial environments without derating. |
| Package | 16-pin TSSOP (4.4 mm × 5.0 mm); surface-mount compatible with automated assembly and compact PCB layouts. |
| Debug Interface | Single-wire background debug (BKGD/MS pin); enables in-circuit programming and breakpoint debugging with minimal pin overhead. |
Pinout & Package
16-pin Thin Shrink Small Outline Package (TSSOP), 0.65 mm pitch, JEDEC MO-153 compliant. Exposed pad not present; thermal resistance 113 °C/W (single-layer board, 200 ft/min airflow).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Power supply | Primary 2.7–5.5 V supply rail; powers core, FLASH, and I/O; requires local 100 nF decoupling. |
| VSS | Ground | Digital ground reference; must be connected to system GND plane with low-inductance path. |
| XTAL | Oscillator input | Connects to crystal or ceramic resonator (1–16 MHz); used with XOSC module for precise timing. |
| EXTAL | Oscillator output | Drives external crystal; forms Pierce oscillator with XTAL; unused when ICS internal clock selected. |
| RESET | Active-low reset input | Asynchronous reset assertion clears CPU registers and initiates boot sequence from vector table. |
| BKGD/MS | Background debug / mode select | Single-wire debug interface pin; also selects active background mode during reset. |
| PTA0–PTA1 | GPIO / peripheral function | Port A pins support SCI RX/TX, TPM channel, or general-purpose I/O with configurable pull-up/slew rate. |
| PTB0–PTB5 | GPIO / peripheral function | Port B includes ADC inputs, TPM outputs, and interrupt-capable pins with edge/level sensitivity. |
| PTC0–PTC3 | GPIO / peripheral function | Port C supports I²C SDA/SCL, SPI MOSI/MISO, and ganged output for PTB[5:2]/PTC[3:0]. |
Key Features
| Feature | Design Value |
|---|---|
| Stop3 ultra-low-power mode | Enables RTC wake-up with <1 µA current draw, allowing battery-powered operation for months without recharge. |
| Internal Clock Source (ICS) | FLL-based clock generation with ±1.5% accuracy over full temperature range eliminates need for external crystal in cost-sensitive designs. |
| Flash block protection | Hardware-enforced write/erase lock on FLASH sectors prevents accidental firmware corruption during field updates. |
| Low-voltage warning (LVW) | Generates interrupt before LVD threshold breach, enabling graceful shutdown or data save prior to reset. |
| On-chip security circuitry | Prevents unauthorized read-out of FLASH and RAM contents via background debug interface, protecting IP. |
Applications
| Automotive Body Control Module | Industrial Sensor Node |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, and interior lighting in entry-level vehicles. IC Role / Device Role / Timing Role: Main system controller executing CAN/LIN gateway logic, PWM motor drive, and ADC-based position feedback sampling. Use Value: 16 KB FLASH accommodates LIN protocol stack and application code; stop3 mode extends battery life during vehicle sleep states. |
Use Scenario: Wireless temperature/humidity node with local display and RS-485 backhaul in factory automation. IC Role / Device Role / Timing Role: Sensor interface hub managing ADC conversions, RTC timestamping, and SPI-driven display refresh. Use Value: Integrated 10-bit ADC and RTC eliminate external components; TSSOP-16 footprint fits compact enclosure designs. |
| Smart Appliance Motor Controller | Medical Diagnostic Handheld |
Use Scenario: Brushless DC motor commutation and fault monitoring in HVAC blowers or washing machine pumps. IC Role / Device Role / Timing Role: Real-time PWM generator with ADC current sensing and TPM-based timing for six-step commutation. Use Value: Dual TPM modules provide independent 3-phase PWM outputs; 2.5 µs ADC conversion enables fast current-loop response. |
Use Scenario: Portable blood glucose meter with LCD, button interface, and USB charging detection. IC Role / Device Role / Timing Role: System manager handling button interrupts, LCD SPI interface, battery voltage monitoring, and USB enumeration. Use Value: Single-wire debug simplifies production programming; 1 KB RAM supports GUI state machine and calibration data storage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08SG32E1MTGR | 32 KB FLASH, identical pinout and peripheral set; same 16-TSSOP package and electrical specs. | Supports larger firmware images, bootloader + application separation, and enhanced diagnostics without PCB change. | Select when future firmware growth or field upgrade capability is required; no hardware redesign needed. |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+ core, 128 KB FLASH, 16 KB RAM, higher performance but different architecture and toolchain. | Requires migration from HCS08 assembly/C to ARM GCC; suitable for next-generation designs needing >40 MHz throughput or USB. | Choose for new designs requiring scalability beyond 8-bit limits; not drop-in compatible with S9S08SG16E1MTGR. |
Compared with MC9S08SG32E1MTGR, S9S08SG16E1MTGR trades FLASH capacity for lower unit cost and smaller code footprint; versus S9KEAZ128AMLH, it offers proven toolchain continuity and lower power in simple control tasks without architectural migration overhead.
Availability
S9S08SG16E1MTGR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart appliance motor controllers, and portable medical devices requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S9S08SG16E1MTGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The S9S08SG16E1MTGR belongs to the legacy HCS08 microcontroller family designed for cost-effective, low-power embedded control in automotive and industrial applications where deterministic real-time response and long-term supply stability are critical.
FAQ
What is the maximum bus frequency supported by the S9S08SG16E1MTGR?
The S9S08SG16E1MTGR supports a maximum bus frequency of 40 MHz when operating within its specified voltage and temperature range. This frequency is achieved using the Internal Clock Source (ICS) module with FLL enabled and proper trimming. At temperatures above 125°C, the maximum bus frequency is reduced to 36 MHz to maintain reliability. The S9S08SG16E1MTGR datasheet specifies these limits in the Electrical Characteristics section under ICS Frequency Specifications.
Does the S9S08SG16E1MTGR support in-system programming via its background debug interface?
Yes, the S9S08SG16E1MTGR supports in-system programming through its single-wire background debug (BKGD/MS) interface. This allows firmware updates and debugging without removing the device from the target PCB. Programming requires a compatible debugger such as the NXP Multilink or OSJTAG, and the S9S08SG16E1MTGR must be in active background mode, initiated by asserting BKGD/MS during reset. The interface supports flash erase, program, and verify operations per the S9S08SG16E1MTGR Flash Programming User Guide.
What is the ADC resolution and conversion time for the S9S08SG16E1MTGR?
The S9S08SG16E1MTGR features a 10-bit successive approximation ADC with 16 input channels and a typical conversion time of 2.5 µs. It includes an internal bandgap reference and temperature sensor channel. The ADC operates in run, wait, and stop3 modes, enabling low-power sensing. Full specifications-including INL, DNL, and voltage reference accuracy-are detailed in the S9S08SG16E1MTGR datasheet Section 9 (Analog-to-Digital Converter) and Appendix A (Electrical Characteristics).
Can the S9S08SG16E1MTGR operate without an external crystal?
Yes, the S9S08SG16E1MTGR can operate without an external crystal by using its Internal Clock Source (ICS) module. The ICS employs a frequency-locked loop (FLL) with a factory-trimmed internal reference oscillator, delivering bus frequencies from 2 MHz to 20 MHz with ±1.5% accuracy over -40°C to +125°C. External crystals (1–16 MHz) are optional and used only when higher timing precision is required, such as for LIN or UART communication with strict baud rate tolerance.
What power-saving modes does the S9S08SG16E1MTGR support, and what is the lowest current draw?
The S9S08SG16E1MTGR supports multiple low-power modes: wait mode, stop2, and stop3. In stop3 mode-with RTC enabled and all clocks gated-the typical current draw is less than 1 µA at 25°C. This mode retains RAM content and allows wake-up via RTC overflow, external interrupt, or low-voltage warning. The S9S08SG16E1MTGR datasheet Table 3-2 (Current Consumption Summary) and Section 3.6.1 specify these values under defined supply and temperature conditions.
S9S08SG16E1MTGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 16-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 12
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08SG16E1MTGR FAQ
1.How can I place an order for S9S08SG16E1MTGR through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08SG16E1MTGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08SG16E1MTGR reliable?
The price and inventory of S9S08SG16E1MTGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG16E1MTGR is usually 5 days.
3.What payment methods are accepted for S9S08SG16E1MTGR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08SG16E1MTGR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S08SG16E1MTGR?
S9S08SG16E1MTGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08SG16E1MTGR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08SG16E1MTGR?
For technical support, including S9S08SG16E1MTGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG16E1MTGR requirements.
6.How does Aetrix verify that S9S08SG16E1MTGR is sourced from the original manufacturer or authorized distributors?
All S9S08SG16E1MTGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG16E1MTGR meets industry standards.
7.What is the process for return or replacement of S9S08SG16E1MTGR?
All S9S08SG16E1MTGR units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG16E1MTGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08SG16E1MTGR part is unused and in its original packaging.
Return procedure for S9S08SG16E1MTGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S9S08SG16E1MTGR Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

