Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors S9S08SG16E1MTJ

Part No.:
S9S08SG16E1MTJ
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
20-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixS9S08SG16E1MTJ.pdf
Description:
IC MCU 8BIT 16KB FLASH 20TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,656

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S9S08SG16E1MTJ from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB on-chip Flash, 1 KB RAM, and integrated peripherals including 10-bit ADC, dual TPM timers, SCI, SPI, I²C, ACMP, and RTC. It operates at up to 40 MHz bus frequency, supports -40°C to +125°C temperature range, and targets embedded control in automotive body electronics and industrial sensors.

For engineers reviewing the S9S08SG16E1MTJ datasheet, S9S08SG16E1MTJ pinout, S9S08SG16E1MTJ application, or S9S08SG16E1MTJ equivalent, key selection criteria include Flash size (16 KB), TSSOP-16 package, 22 GPIOs, stop3 mode current (1.5 µA), and integrated low-voltage detection with interrupt capability.

Technical Context

The S9S08SG16E1MTJ implements the HCS08 CPU core with HC08 instruction set extension, supporting up to 32 interrupt/reset sources and single-wire background debug interface. Its internal clock source (ICS) includes a frequency-locked loop (FLL) with precision-trimmed internal reference enabling ±1.5% deviation over -40°C to +125°C.

Memory architecture comprises 16 KB Flash (with block protection and security circuitry), 1 KB RAM, and dedicated registers for FLASH control (FCDIV, FOPT, FPROT, FSTAT). Peripherals operate in Stop3 mode, including ADC, ACMP, RTC, and SCI wake-up functionality - critical for ultra-low-power sensor node applications.

Key Specifications

ParameterValue and Actual Design Meaning
CoreHCS08 8-bit CPU, 40 MHz max bus frequency - enables real-time control loops with sub-µs instruction timing
Flash Memory16 KB on-chip Flash - sufficient for firmware with bootloader, diagnostics, and communication stacks
RAM1 KB on-chip RAM - supports moderate variable storage and stack depth for nested interrupts
ADC16-channel, 10-bit resolution, 2.5 µs conversion - suitable for analog sensor interfacing with 1 mV LSB at 2.5 V reference
Operating Temp-40°C to +125°C - qualified for under-hood automotive and industrial ambient environments
Supply Voltage2.7 V to 5.5 V - compatible with 3.3 V and 5 V system rails without level translation
Stop3 Current1.5 µA typical - enables battery-powered operation for >1 year on coin cell with periodic wake-up
I/O Pins22 general-purpose I/O pins with configurable pull-up, slew rate, and drive strength - supports direct LED driving and switch sensing

Pinout & Package

Package: 16-pin TSSOP (Thin Shrink Small Outline Package), 4.4 mm × 5.0 mm body, 0.65 mm pitch, lead-free and RoHS compliant.

Pin/TerminalCircuit RoleDesign Meaning
VDDPower supply inputMain 2.7–5.5 V supply rail; decoupling capacitor required within 10 mm
VSSGround referenceDigital ground return path; must be connected to system GND plane
RESETActive-low reset inputAsynchronous reset assertion; internal pull-up ensures valid state on power-up
BKGD/MSSingle-wire debug and mode selectEnables background debug entry and selects active mode during reset
PTA0–PTA1Port A bidirectional I/OConfigurable as GPIO or alternate functions (SCI RX/TX, TPM1 CH0/CH1)
PTB0–PTB5Port B bidirectional I/OIncludes interrupt-capable pins; PTA0–PTA1 and PTB0–PTB5 support ganged output writes
PTC0–PTC3Port C bidirectional I/OSupports analog comparator inputs (ACMP0+, ACMP0−) and ADC channel selection
XIN/XOUTCrystal oscillator terminalsAccepts 31.25 kHz–16 MHz crystal or ceramic resonator for precise clock source

Key Features

FeatureDesign Value
Integrated RTC with 1 kHz LPOFree-running real-time counter operates in all modes including Stop3, enabling time-stamped event logging without external components
Low-Voltage Warning (LVW)Generates interrupt before LVD threshold breach, allowing software-initiated safe shutdown or data save prior to reset
FLASH Block ProtectionConfigurable write/erase lock per 512-byte block prevents accidental firmware corruption during field updates
Stop3 Mode Power Consumption1.5 µA typical current draw with RTC and ACMP active - extends battery life in intermittent-sensing applications
Background Debug InterfaceSingle-wire physical interface supports full in-circuit debugging, flash programming, and breakpoint setting without dedicated JTAG header
ADC Temperature SensorOn-die sensor calibrated across -40°C to +125°C provides system thermal monitoring without external components

Applications

Automotive Door ModuleIndustrial Temperature Sensor Node

Use Scenario: Centralized control of window lift, mirror adjustment, and interior lighting in vehicle door assemblies.

IC Role / Device Role / Timing Role: Main MCU executing motor control PWM via TPM modules, reading switch inputs, and communicating via LIN/SCI with body control module.

Use Value: Integrated 10-bit ADC reads potentiometer position feedback; Stop3 mode enables <2 µA sleep current between user interactions.

Use Scenario: Wireless-capable environmental monitor deployed in factory HVAC ducts or machinery enclosures.

IC Role / Device Role / Timing Role: Sensor hub acquiring thermistor/RTD readings, performing linearization, and triggering BLE/Wi-Fi transmission on threshold breach.

Use Value: On-chip temperature sensor validates die temperature during calibration; 16 KB Flash hosts sensor fusion algorithm and wireless stack.

Smart Lighting DimmerAppliance Motor Control

Use Scenario: DALI- or 0–10 V-controlled LED driver with adaptive dimming profiles and thermal derating.

IC Role / Device Role / Timing Role: Real-time PWM generator (TPM2) with phase-shifted outputs, ADC monitoring heatsink thermistor, and SCI handling command interface.

Use Value: 2.5 µs ADC conversion enables closed-loop current regulation at 20 kHz switching frequency; ganged I/O simplifies multi-channel LED enable control.

Use Scenario: Brushless DC motor controller in HVAC blower or refrigerator compressor subsystem.

IC Role / Device Role / Timing Role: Commutation sequencer using TPM edge-aligned PWM, Hall-effect sensor input via ACMP, and fault detection via LVD/LVW.

Use Value: Dual TPM modules provide independent 3-phase PWM generation; 1 KB RAM accommodates PID coefficients and error log buffer.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9RS08KA2CSC8 KB Flash, 512 B RAM, no TPM, no ACMP, 16-pin SOIC only - lower peripheral integration and memory capacityLimited to simpler timer-based control without analog comparison or PWM flexibilitySelect when cost sensitivity outweighs need for ADC, TPM, or ACMP; not drop-in compatible due to missing peripherals and register map differences
S9KEAZ128AMLHARM Cortex-M0+ core, 128 KB Flash, 16 KB RAM, 12-bit ADC, 2x TPM, CAN - higher performance, larger memory, and CAN interfaceTargets more complex systems requiring CAN bus connectivity or deterministic real-time response beyond HCS08 capabilitiesChoose for future-proofing or migration path; requires PCB redesign and firmware rearchitecture due to core and peripheral incompatibility

Compared with MC9RS08KA2CSC, S9S08SG16E1MTJ delivers 2× Flash, integrated TPM and ACMP, and broader temperature qualification; versus S9KEAZ128AMLH, it offers lower BOM cost and simpler toolchain but lacks CAN and ARM ecosystem support.

Availability

S9S08SG16E1MTJ is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart lighting controls, and appliance motor management requiring stable component supply across extended temperature ranges.

Supply support for S9S08SG16E1MTJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The S9S08SG16E1MTJ belongs to the legacy HCS08 microcontroller family designed for cost-sensitive, low-power embedded control applications where deterministic real-time response and minimal external components are critical.

FAQ

What is the maximum operating frequency of the S9S08SG16E1MTJ?

The S9S08SG16E1MTJ supports a maximum bus frequency of 40 MHz, achieved via its internal clock source (ICS) with frequency-locked loop (FLL). This allows execution of instructions at sub-µs intervals while maintaining stability across the full -40°C to +125°C operating range. The S9S08SG16E1MTJ achieves this performance without requiring external high-frequency crystals, reducing BOM count and board space.

Does the S9S08SG16E1MTJ support in-circuit debugging?

Yes, the S9S08SG16E1MTJ features a single-wire background debug interface compliant with Freescale's BDM specification. This allows full in-circuit debugging, flash programming, and breakpoint setting without dedicated JTAG headers. The S9S08SG16E1MTJ uses the BKGD/MS pin for debug communication, enabling development with minimal pin count and no additional connectors.

What power-saving modes does the S9S08SG16E1MTJ offer?

The S9S08SG16E1MTJ provides three low-power modes: Wait mode, Stop2, and Stop3. Stop3 is the deepest, drawing just 1.5 µA typical while retaining RTC, ACMP, and SCI wake-up capability. The S9S08SG16E1MTJ enters Stop3 via software command and wakes on pin interrupt, RTC overflow, or serial activity - ideal for battery-powered sensor endpoints.

Can the S9S08SG16E1MTJ operate from a 3.3 V supply?

Yes, the S9S08SG16E1MTJ operates across a 2.7 V to 5.5 V supply range, making it fully compatible with standard 3.3 V logic systems. At 3.3 V, all I/O pins maintain TTL-compatible thresholds, and the internal voltage regulator ensures stable core operation. The S9S08SG16E1MTJ retains full peripheral functionality-including ADC accuracy and Flash programming-within this voltage range.

Is the S9S08SG16E1MTJ pin-compatible with other MC9S08SG devices?

No, the S9S08SG16E1MTJ uses a 16-pin TSSOP package, while MC9S08SG32 variants use 20-pin or 28-pin TSSOP packages. Pin mapping differs significantly due to reduced I/O count and peripheral allocation. Although register-level compatibility exists within the HCS08 family, the S9S08SG16E1MTJ is not pin-compatible with SG32 or SG8 variants - PCB layout and schematic must be designed specifically for the 16-pin footprint.

S9S08SG16E1MTJ Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
20-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08SG16E1MTJ FAQ

1.How can I place an order for S9S08SG16E1MTJ through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S08SG16E1MTJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S08SG16E1MTJ reliable?

The price and inventory of S9S08SG16E1MTJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG16E1MTJ is usually 5 days.

3.What payment methods are accepted for S9S08SG16E1MTJ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08SG16E1MTJ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S9S08SG16E1MTJ?

S9S08SG16E1MTJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S08SG16E1MTJ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S08SG16E1MTJ?

For technical support, including S9S08SG16E1MTJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG16E1MTJ requirements.

6.How does Aetrix verify that S9S08SG16E1MTJ is sourced from the original manufacturer or authorized distributors?

All S9S08SG16E1MTJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG16E1MTJ meets industry standards.

7.What is the process for return or replacement of S9S08SG16E1MTJ?

All S9S08SG16E1MTJ units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG16E1MTJ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08SG16E1MTJ part is unused and in its original packaging.

Return procedure for S9S08SG16E1MTJ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S9S08SG16E1MTJ Tags

  • S9S08SG16E1MTJ
  • S9S08SG16E1MTJ PDF
  • S9S08SG16E1MTJ Datasheet
  • S9S08SG16E1MTJ Specifications
  • S9S08SG16E1MTJ Images
  • NXP Semiconductors
  • NXP Semiconductors S9S08SG16E1MTJ
  • Buy S9S08SG16E1MTJ
  • S9S08SG16E1MTJ Price
  • S9S08SG16E1MTJ Distributor
  • S9S08SG16E1MTJ Supplier
  • S9S08SG16E1MTJ Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER