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NXP Semiconductors S9S08SG16E1MTLR

Part No.:
S9S08SG16E1MTLR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
28-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixS9S08SG16E1MTLR.pdf
Description:
IC MCU 8BIT 16KB FLASH 28TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,810

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Product details

Overview

S9S08SG16E1MTLR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB on-chip Flash, 1 KB RAM, and integrated peripherals including 10-bit ADC, dual TPM timers, SCI, SPI, I²C, ACMP, and RTC. It operates at up to 40 MHz bus frequency, supports -40°C to +125°C temperature range, and targets embedded control in automotive body electronics and industrial sensors.

For engineers reviewing the S9S08SG16E1MTLR datasheet, S9S08SG16E1MTLR pinout, S9S08SG16E1MTLR application, or S9S08SG16E1MTLR equivalent, this page delivers verified technical context, validated pin functions, real-world use cases, and two confirmed alternative parts for design continuity and sourcing flexibility.

Technical Context

The S9S08SG16E1MTLR implements the HCS08 CPU core with BGND instruction support and handles up to 32 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference (±0.2% resolution), enabling stable 2–20 MHz bus frequencies across voltage and temperature.

Peripherals include a 16-channel 10-bit ADC with 2.5 µs conversion time and internal temperature sensor, two 2-channel TPM modules supporting input capture/output compare/PWM, and a real-time counter (RTC) with free-running 1 kHz low-power oscillator that operates in all MCU modes including Stop3.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture HCS08 8-bit CPU with 40 MHz max bus frequency and HC08 instruction set extension
Flash Memory 16 KB on-chip Flash with read/program/erase over full -40°C to +125°C operating range
RAM 1 KB on-chip RAM with security protection against unauthorized access
ADC 16-channel, 10-bit resolution, 2.5 µs conversion time; includes internal bandgap reference and temperature sensor
Timers Dual TPM modules (TPM1, TPM2), each with 2 channels supporting PWM, input capture, and output compare
Communication Interfaces SCI (LIN-capable), SPI (master/slave, double-buffered), I²C (100 kbps, multi-master)
Power Modes Run, Wait, Stop2, Stop3; RTC and ACMP remain active in Stop3 for ultra-low-power wake-up

Pinout & Package

Package: 28-pin TSSOP (Thin Shrink Small Outline Package), 4.4 mm × 9.7 mm body, 0.65 mm pitch, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
VDD, VSS Power supply and ground Primary power domain; requires local decoupling per datasheet layout guidelines
XTAL, EXTAL Crystal oscillator inputs Supports 31.25 kHz–16 MHz crystal or ceramic resonator for precise clock source
RESET Active-low reset input Asynchronous reset with internal pull-up; accepts external push-button or supervisor IC assertion
BKGD/MS Background debug and mode select Single-wire debug interface pin; also selects boot mode during reset
PTA0–PTA7 Port A general-purpose I/O 8-bit bidirectional port with configurable pull-up, slew rate, and drive strength
PTB0–PTB7 Port B general-purpose I/O 8-bit bidirectional port; PTB[5:2] supports ganged output for synchronized state changes
PTC0–PTC3 Port C general-purpose I/O 4-bit bidirectional port; PTC[3:0] supports ganged output and pin-interrupt capability
AD0–AD15 ADC analog input channels 16 dedicated analog input pins mapped to Port A and Port B; share physical pins with GPIO

Key Features

Feature Design Value
On-chip security circuitry Prevents unauthorized read-out of Flash and RAM contents via background debug interface
Low-voltage detection (LVD) and warning (LVW) LVD provides reset at selectable thresholds; LVW generates interrupt to enable software response before brownout
Real-time counter (RTC) with 1 kHz oscillator Free-running low-power RTC operates in Run, Wait, and Stop3 modes without external components
Stop3 ultra-low-power mode Current draw < 1 µA typical; retains RAM, RTC, ACMP, and selected wake-up sources active
Single-wire background debug interface Enables in-circuit debugging with breakpoint support and on-chip emulation (ICE) module

Applications

Automotive Body Control Module Industrial Temperature Sensor Node

Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in 12 V vehicle systems.

IC Role / Device Role / Timing Role: Main system controller executing real-time actuator sequencing, LIN communication with sub-nodes, and fault monitoring.

Use Value: Integrated LIN-capable SCI, robust LVD/LVW, and -40°C to +125°C operation ensure reliable function under automotive electrical transients and thermal extremes.

Use Scenario: Battery-powered wireless node measuring ambient and component temperature in HVAC ducts or motor enclosures.

IC Role / Device Role / Timing Role: Sensor hub managing ADC sampling, RTC-based wake scheduling, and SPI/I²C peripheral interfacing.

Use Value: Stop3 mode with active RTC and ADC reduces average current to < 2 µA; internal temperature sensor eliminates external component cost.

Smart Appliance Motor Controller Medical Diagnostic Equipment Subsystem

Use Scenario: Closed-loop speed and direction control of BLDC fans or pumps in refrigerators and washing machines.

IC Role / Device Role / Timing Role: PWM generator and feedback processor using TPM modules and ACMP for zero-crossing detection.

Use Value: Dual TPM modules provide independent edge-aligned and center-aligned PWM outputs; ACMP with internal bandgap reference enables accurate current sensing.

Use Scenario: Front-end signal conditioning and status monitoring in portable ultrasound or patient monitor auxiliary modules.

IC Role / Device Role / Timing Role: Safety-critical subsystem controller handling power sequencing, watchdog supervision, and nonvolatile configuration storage.

Use Value: COP watchdog with dedicated 1 kHz clock source ensures fail-safe reset; Flash block protection prevents accidental firmware corruption during field updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
S9S08SG32E1MTLR 32 KB Flash, same package and pinout; identical peripheral set and register map Higher memory headroom for larger firmware or data logging; no hardware or layout change required Select when future firmware expansion or bootloader partitioning is anticipated
MC9RS08LA8CP RISC-based RS08 core, 8 KB Flash, 512 B RAM; different instruction set and debug interface Lower cost and power; lacks TPM modules and LIN-capable SCI; not software-compatible Choose for simpler, lower-power applications where HCS08 code reuse is not required

Compared with S9S08SG16E1MTLR, the S9S08SG32E1MTLR offers direct pin- and code-compatible upgrade path with doubled Flash capacity, while the MC9RS08LA8CP represents a cost-optimized alternative with reduced peripheral count and incompatible architecture-requiring full firmware rework but delivering lower active and standby current.

Availability

S9S08SG16E1MTLR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart appliance controllers, and medical diagnostic subsystems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S9S08SG16E1MTLR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, and mobile applications.

The S9S08SG16E1MTLR belongs to the HCS08 microcontroller family, designed specifically for cost-sensitive, reliability-critical embedded control in harsh environments-including automotive under-hood and industrial automation systems.

FAQ

What is the maximum operating frequency of the S9S08SG16E1MTLR?

The S9S08SG16E1MTLR supports a maximum bus frequency of 40 MHz at ambient temperatures up to +125°C. At temperatures above +125°C (up to +150°C), the maximum bus frequency is derated to 36 MHz to maintain timing integrity and reliability. This specification is guaranteed across the full operating voltage range (2.7 V to 5.5 V) and validated per Freescale's Rev. 8 and Rev. 9 datasheet revisions.

Does the S9S08SG16E1MTLR support LIN communication?

Yes, the S9S08SG16E1MTLR supports LIN communication through its SCI module, which includes hardware-level LIN master extended break generation and LIN slave extended break detection. This enables direct integration into LIN networks without external transceivers for basic node functionality, as confirmed in the "Serial Communications Interface" chapter of the MC9S08SG32 Rev. 8 datasheet covering both SG32 and SG16 variants.

What power-saving modes does the S9S08SG16E1MTLR offer?

The S9S08SG16E1MTLR provides three low-power modes: Wait mode (CPU stopped, peripherals active), Stop2 (deep sleep with limited wake sources), and Stop3 (ultra-low-power mode with RTC, ACMP, and selected I/O active at < 1 µA typical). Stop3 retains RAM and allows wake-up via external pin interrupt, RTC alarm, or ACMP event-making it ideal for battery-operated sensor applications.

Is the S9S08SG16E1MTLR pin-compatible with the S9S08SG32E1MTLR?

Yes, the S9S08SG16E1MTLR and S9S08SG32E1MTLR are fully pin-compatible and share identical 28-pin TSSOP packaging, memory-mapped register layout, and peripheral configuration. They differ only in Flash size (16 KB vs. 32 KB) and associated nonvolatile option bits, allowing drop-in replacement and seamless firmware scaling without PCB revision.

What debug interface does the S9S08SG16E1MTLR use?

The S9S08SG16E1MTLR uses a single-wire background debug (BDM) interface via the BKGD/MS pin, supporting in-circuit debugging, flash programming, and real-time emulation. It includes breakpoint capability (one hardware breakpoint plus two more in the on-chip debug module) and an eight-deep FIFO for trace data-fully documented in Chapter 17 of the MC9S08SG32 Rev. 8 datasheet applicable to the SG16 variant.

S9S08SG16E1MTLR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
28-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08SG16E1MTLR FAQ

1.How can I place an order for S9S08SG16E1MTLR through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S08SG16E1MTLR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S08SG16E1MTLR reliable?

The price and inventory of S9S08SG16E1MTLR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG16E1MTLR is usually 5 days.

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S9S08SG16E1MTLR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S08SG16E1MTLR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S08SG16E1MTLR?

For technical support, including S9S08SG16E1MTLR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG16E1MTLR requirements.

6.How does Aetrix verify that S9S08SG16E1MTLR is sourced from the original manufacturer or authorized distributors?

All S9S08SG16E1MTLR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG16E1MTLR meets industry standards.

7.What is the process for return or replacement of S9S08SG16E1MTLR?

All S9S08SG16E1MTLR units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG16E1MTLR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08SG16E1MTLR part is unused and in its original packaging.

Return procedure for S9S08SG16E1MTLR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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