NXP Semiconductors S9S08SG32E1CTGR
- Part No.:
- S9S08SG32E1CTGR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 16-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
S9S08SG32E1CTGR.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 16TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S9S08SG32E1CTGR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB on-chip Flash, 2 KB RAM, and integrated peripherals including 10-bit ADC, dual TPM timers, SCI, SPI, I²C, ACMP, and RTC. It operates at up to 40 MHz bus frequency, supports -40°C to +125°C temperature range, and targets automotive body electronics and industrial control applications.
For engineers reviewing the S9S08SG32E1CTGR datasheet, S9S08SG32E1CTGR pinout, S9S08SG32E1CTGR application, or S9S08SG32E1CTGR equivalent, key selection criteria include Flash endurance (100k erase/write cycles), low-power stop3 mode with RTC wake-up, single-wire background debug interface, and AEC-Q100 Grade 2 qualification for automotive use.
Technical Context
The S9S08SG32E1CTGR implements the HCS08 CPU core with HC08 instruction set extension, supporting up to 32 interrupt/reset sources and BGND instruction for debug entry. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference enabling ±1.5% frequency deviation over -40°C to +125°C.
Peripherals include a 16-channel 10-bit ADC with 2.5 µs conversion time and internal temperature sensor, two 2-channel TPM modules supporting input capture/output compare/PWM, and SCI with LIN master break generation. All analog peripherals (ADC, ACMP) and RTC remain functional in stop3 mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS08 8-bit CPU with 40 MHz max bus frequency and BGND debug instruction |
| Memory | 32 KB on-chip Flash (100k erase/write cycles), 2 KB RAM, security circuitry blocking unauthorized access |
| ADC | 16-channel, 10-bit resolution, 2.5 µs conversion time, internal bandgap reference and temperature sensor channel |
| Timers | Dual TPM modules (TPM1/TPM2), each with 2 channels supporting PWM, input capture, output compare, and center-aligned modes |
| Low-Power Modes | Stop3 mode with RTC running on 1 kHz internal oscillator; wake-up via external pin, SCI, or RTC overflow |
| Debug Interface | Single-wire background debug (BDM) with one hardware breakpoint and on-chip ICE module with 8-deep FIFO |
| Operating Range | -40°C to +125°C ambient temperature, 2.7–5.5 V supply voltage, AEC-Q100 Grade 2 qualified |
Pinout & Package
Package: 28-pin TSSOP (Thin Shrink Small Outline Package), 4.4 mm × 9.7 mm body, 0.65 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power pins support stable core/peripheral operation; decoupling required per datasheet layout guidelines |
| XTAL, EXTAL | Crystal oscillator inputs | Support 31.25 kHz–16 MHz crystals/resonators; enable precise timing or low-power 32.768 kHz RTC crystal option |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external reset signal or watchdog timeout assertion |
| BKGD/MS | Background debug / mode select | Single-wire BDM communication path; also selects boot mode during reset assertion |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit port with configurable pull-up, slew rate, drive strength, and edge-sensitive interrupts |
| PTB0–PTB7 | Port B general-purpose I/O | 8-bit port; PTB[5:2] support ganged output for synchronized multi-pin control |
| PTC0–PTC7 | Port C general-purpose I/O | 8-bit port; PTC[3:0] support ganged output; all pins support hysteresis and interrupt on configurable edge |
| AD0–AD15 | ADC analog input channels | 16 dedicated analog input pins mapped across ports A/B/C; share digital I/O functionality when not used for ADC |
Key Features
| Feature | Design Value |
|---|---|
| Flash block protection | Configurable write/erase protection per 512-byte block prevents accidental firmware corruption during field updates |
| Low-voltage warning (LVW) | Generates interrupt before LVD threshold is reached, enabling graceful shutdown or data save prior to reset |
| Real-time counter (RTC) | Free-running 8-bit modulus counter with binary/decimal prescaler; operates in all modes including stop3 using 1 kHz internal oscillator |
| SCI with LIN support | Full-duplex NRZ UART with hardware-generated extended break for LIN 2.x master compliance and slave break detection |
| ACMP with routing | Analog comparator output can be routed directly to TPM input capture or trigger interrupts on rising/falling/both edges |
Applications
| Automotive Door Module | Industrial Motor Control |
|---|---|
|
Use Scenario: Centralized control of window lift, mirror adjustment, lock actuation, and interior lighting in vehicle door assemblies. IC Role / Device Role / Timing Role: Main system controller executing motor sequencing, switch debouncing, LIN communication with body control module, and fault monitoring. Use Value: Integrated LIN-capable SCI eliminates external transceiver; stop3-mode RTC enables periodic self-test without waking main ECU; AEC-Q100 Grade 2 ensures reliability in under-hood thermal environments. |
Use Scenario: Closed-loop speed/torque control of BLDC or stepper motors in HVAC blowers, pumps, and factory automation drives. IC Role / Device Role / Timing Role: Real-time PWM generation, ADC-based current/voltage sensing, and thermal monitoring with fast interrupt response. Use Value: Dual TPM modules provide independent high-resolution PWM outputs; 10-bit ADC with 2.5 µs conversion enables >10 kHz control loop rates; ganged I/O simplifies multi-phase gate driver enable sequencing. |
| Smart Lighting Controller | Medical Diagnostic Sensor Hub |
|
Use Scenario: Adaptive LED driver for commercial lighting systems requiring dimming profiles, occupancy sensing, and daylight harvesting. IC Role / Device Role / Timing Role: Sensor fusion hub aggregating PIR, ambient light, and temperature data; generating PWM dimming signals and communicating via I²C to master controller. Use Value: On-chip ACMP compares ambient light against reference; 16-channel ADC interfaces multiple sensors; low-power wait/stop modes extend battery life in wireless variants. |
Use Scenario: Portable diagnostic device collecting analog signals from ECG, temperature, and SpO₂ sensors for point-of-care analysis. IC Role / Device Role / Timing Role: Signal acquisition front-end with calibrated ADC, analog comparator for threshold alarms, and secure local data buffering before USB transfer. Use Value: Internal bandgap reference and temperature sensor enable self-calibration; Flash security prevents firmware tampering; RTC timestamps critical events for clinical traceability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S08SG48E1CTGR | 48 KB Flash, 4 KB RAM, identical peripheral set and pinout; same 28-TSSOP package | Higher firmware complexity, larger bootloader, or future-proofing requirements | Select when >32 KB Flash is needed without changing PCB layout or software architecture |
| MC9S08AC60CFGE | 60 KB Flash, 4 KB RAM, enhanced ADC (12-bit, 16-channel), additional SCI/I²C modules; 44-pin LQFP package | Higher analog precision, multi-protocol connectivity, or expanded I/O count required | Choose for designs needing greater memory headroom, higher-resolution sensing, or more serial interfaces-requires PCB redesign |
Compared with S9S08SG32E1CTGR, the S9S08SG48E1CTGR offers direct Flash/RAM scalability in identical packaging, while the MC9S08AC60CFGE provides architectural upgrades at the cost of package and layout change-making the former ideal for incremental feature expansion and the latter suited for new designs demanding higher performance.
Availability
S9S08SG32E1CTGR is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor controllers, smart lighting systems, and portable medical devices requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S9S08SG32E1CTGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, mobile, and communication infrastructure markets.
The S9S08SG32E1CTGR belongs to NXP's legacy HCS08 microcontroller family, designed specifically for cost-sensitive, high-reliability embedded control in automotive and industrial environments where AEC-Q100 qualification, low-power operation, and robust debug capability are essential.
FAQ
What is the maximum operating frequency of the S9S08SG32E1CTGR?
The S9S08SG32E1CTGR supports a maximum bus frequency of 40 MHz when operating within its specified voltage and temperature range. This frequency is achieved using the internal clock source (ICS) with FLL enabled and properly configured external or internal reference. At temperatures above 125°C, the maximum bus frequency is reduced to 36 MHz to maintain timing integrity, as confirmed in the Rev. 8 datasheet Section 1.3 and Appendix A-9.
Does the S9S08SG32E1CTGR support LIN communication?
Yes, the S9S08SG32E1CTGR supports LIN 2.x communication through its SCI module, which includes hardware-assisted extended break generation for LIN master operation and extended break detection for LIN slave operation. This capability is explicitly documented in the "Peripherals" section of the Rev. 8 datasheet and enables direct integration into automotive body networks without external LIN transceivers.
What low-power modes are available on the S9S08SG32E1CTGR?
The S9S08SG32E1CTGR offers three primary low-power modes: Wait mode (reduced power with clocks active), Stop2 mode (very low power with most clocks disabled), and Stop3 mode (lowest power state with RTC running on 1 kHz internal oscillator). In Stop3, the ADC, ACMP, and RTC remain operational, allowing wake-up via external pin, SCI activity, or RTC overflow-critical for battery-powered automotive and industrial applications.
Is the S9S08SG32E1CTGR AEC-Q100 qualified?
Yes, the S9S08SG32E1CTGR is qualified to AEC-Q100 Grade 2 standards (-40°C to +105°C ambient) and supports extended temperature operation up to +125°C. The datasheet Rev. 8 explicitly lists AEC-Q100 qualification in the "Features" section and confirms Grade 2 compliance in Appendix A-9 (ICS characteristics) and Table B-1 (device numbering system), making it suitable for automotive body electronics and under-hood applications.
How many I/O pins does the S9S08SG32E1CTGR have?
The S9S08SG32E1CTGR provides 22 general-purpose I/O pins distributed across Port A (8 pins), Port B (8 pins), and Port C (8 pins), with overlapping functions. Not all 24 pins are simultaneously available as GPIO due to dedicated functions (e.g., BKGD/MS, RESET, XTAL/EXTAL), resulting in 22 usable I/Os as stated in the Rev. 8 datasheet "Features" section and Chapter 2 pin assignment tables.
S9S08SG32E1CTGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 16-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 12
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08SG32E1CTGR FAQ
1.How can I place an order for S9S08SG32E1CTGR through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08SG32E1CTGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08SG32E1CTGR reliable?
The price and inventory of S9S08SG32E1CTGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG32E1CTGR is usually 5 days.
3.What payment methods are accepted for S9S08SG32E1CTGR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08SG32E1CTGR transactions.
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4.How is shipping managed for S9S08SG32E1CTGR?
S9S08SG32E1CTGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08SG32E1CTGR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08SG32E1CTGR?
For technical support, including S9S08SG32E1CTGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG32E1CTGR requirements.
6.How does Aetrix verify that S9S08SG32E1CTGR is sourced from the original manufacturer or authorized distributors?
All S9S08SG32E1CTGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG32E1CTGR meets industry standards.
7.What is the process for return or replacement of S9S08SG32E1CTGR?
All S9S08SG32E1CTGR units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG32E1CTGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08SG32E1CTGR part is unused and in its original packaging.
Return procedure for S9S08SG32E1CTGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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