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NXP Semiconductors S9S08SG32E1MTJ
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- Part No.:
- S9S08SG32E1MTJ
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
S9S08SG32E1MTJ.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 20TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,537
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Product details
Overview
S9S08SG32E1MTJ from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB Flash, 2 KB RAM, and integrated peripherals including 10-bit ADC, dual TPM timers, SCI, SPI, I²C, ACMP, and RTC. It operates up to 40 MHz at –40°C to +125°C and supports stop3 mode for ultra-low-power operation in battery-powered sensor nodes and automotive body electronics.
For engineers reviewing the S9S08SG32E1MTJ datasheet, S9S08SG32E1MTJ pinout, S9S08SG32E1MTJ application, or S9S08SG32E1MTJ equivalent, key selection criteria include Flash endurance (100k erase/write cycles), internal clock source accuracy (±1.5% over –40°C to 125°C), real-time counter operation in stop3, and single-wire background debug interface compatibility.
Technical Context
The S9S08SG32E1MTJ implements the HCS08 CPU core with HC08 instruction set extension, supporting up to 32 interrupt/reset sources and BGND instruction for debug entry. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference enabling bus frequencies from 2 MHz to 20 MHz.
Peripherals include a 16-channel 10-bit ADC with 2.5 µs conversion time and temperature sensor, two 2-channel TPM modules supporting input capture/output compare/PWM, and an analog comparator (ACMP) with edge-selectable interrupt and bandgap reference option - all functional in stop3 mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU, 40-MHz max operation (36 MHz above 125°C) |
| Flash Memory | 32 KB on-chip FLASH with 100,000 erase/write cycles; block protection enabled |
| RAM | 2 KB on-chip RAM with security lock to prevent unauthorized access |
| ADC | 16-channel, 10-bit resolution, 2.5 µs conversion time; includes internal temperature sensor and bandgap reference |
| Clock Source | Internal Clock Source (ICS) with FLL; ±1.5% deviation over –40°C to 125°C; supports 2–20 MHz bus frequency |
| Operating Temp | –40°C to +125°C ambient; qualified for automotive AEC-Q100 Grade 2 |
| Power Modes | Run, Wait, Stop2, Stop3; RTC and ACMP remain active in Stop3 with 1 kHz low-power oscillator |
Pinout & Package
Package: 28-pin TSSOP (Thin Shrink Small Outline Package), 4.4 mm × 9.7 mm body, 0.65 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual VDD pins (Pins 1, 28) and dual VSS pins (Pins 14, 15) ensure stable core and I/O rail decoupling |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external reset signal or power-on reset assertion |
| BKGD/MS | Single-wire background debug / Mode select | Enables in-circuit debugging via BDM interface; also selects boot mode during reset |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit port with configurable pull-up, slew rate, drive strength, and pin-interrupt capability on all pins |
| PTB0–PTB7 | Port B general-purpose I/O | 8-bit port; PTB[5:2] support ganged output for simultaneous multi-pin control |
| PTC0–PTC3 | Port C general-purpose I/O | 4-bit port; PTC[3:0] support ganged output; all pins support configurable hysteresis and interrupt on edge |
| XOSC/XFC | Crystal/resonator connection | Accepts 31.25 kHz–38.4 kHz or 1–16 MHz crystal/ceramic resonator for external clock source |
| TPM1CH0–TPM1CH1 | Timer PWM channel outputs | Dedicated pins for TPM1 channel 0 and 1; support input capture, output compare, or edge/center-aligned PWM |
Key Features
| Feature | Design Value |
|---|---|
| Stop3 ultra-low-power mode | RTC and ACMP remain fully operational with 1 kHz internal oscillator; enables wake-up without external components |
| Single-wire BDM interface | Enables full in-circuit debugging with breakpoint support and on-chip ICE module containing two comparators and nine trigger modes |
| Integrated analog subsystem | 10-bit ADC with automatic compare, temperature sensor, and bandgap reference; ACMP with interrupt on rising/falling/both edges |
| Flexible clock architecture | ICS with FLL and precision-trimmed internal reference delivers ±1.5% accuracy across –40°C to 125°C without external crystal |
| Peripheral coexistence in low-power states | SCI, SPI, I²C, TPM, and MTIM retain functionality in Wait mode; ADC and ACMP operate in Stop3 |
Applications
| Automotive Body Control Module | Industrial Sensor Node |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in 12 V vehicle systems. IC Role / Device Role / Timing Role: Main MCU executing real-time control logic, managing LIN/SCI communication with slave nodes, and monitoring analog inputs (e.g., potentiometer position, ambient light). Use Value: Integrated LIN-capable SCI, stop3-mode RTC for cyclic wake-up, and 10-bit ADC with temperature sensor enable deterministic timing and low-quiescent-current operation (<1 µA in Stop3). | Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and motion data in remote industrial facilities. IC Role / Device Role / Timing Role: System controller coordinating sensor sampling, data logging to Flash, and wireless transmission via external transceiver using SPI/SCI. Use Value: 32 KB Flash supports firmware updates and data buffering; stop3 mode with RTC wake-up every 30 s reduces average current to <2 µA; ACMP triggers immediate wake on motion detection. |
| Smart Appliance Control Unit | Medical Diagnostic Handheld |
Use Scenario: User-interface and motor-control subsystem in washing machines, dishwashers, and HVAC units. IC Role / Device Role / Timing Role: Real-time PWM generation for BLDC motor drives (via TPM), front-panel LED/button management, and fault monitoring (LVD, COP). Use Value: Dual TPM modules deliver independent 2-channel PWM with center-aligned mode for efficient motor commutation; LVD/LVW features provide early voltage-drop warning before brownout resets. | Use Scenario: Portable diagnostic device measuring pulse oximetry, ECG, or blood glucose with user-triggered readings. IC Role / Device Role / Timing Role: Signal acquisition controller interfacing with analog front-end (ADC, ACMP), managing display backlight via PWM, and storing calibration data in protected Flash. Use Value: On-chip 10-bit ADC with internal bandgap reference ensures consistent measurement accuracy; Flash security prevents tampering with calibration constants; stop3 mode extends battery life between measurements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08AC60CFGE | 60 KB Flash, 4 KB RAM, same HCS08 core but higher memory; no ACMP; different pinout (44-pin LQFP) | Targeted at more complex control tasks requiring larger code footprint; lacks analog comparator for threshold detection | Select when >32 KB Flash is required and ACMP is not needed; requires PCB redesign due to package and pin count change |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+, 128 KB Flash, 16 KB RAM; higher performance, different architecture; no stop3-equivalent ultra-low-power mode | Used where upgrade path to 32-bit processing, USB, or CAN is anticipated; consumes more active power | Choose for future-proofing or mixed-signal applications needing higher throughput; not drop-in compatible - new toolchain and firmware architecture required |
Compared with MC9S08AC60CFGE and S9KEAZ128AMLH, the S9S08SG32E1MTJ offers optimal balance of ultra-low-power stop3 operation, integrated analog peripherals (ACMP + ADC), and compact 28-TSSOP packaging - making it uniquely suited for cost-sensitive, battery-constrained embedded control where deterministic low-power behavior is critical.
Availability
S9S08SG32E1MTJ is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart appliance control units, and portable medical diagnostics requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S9S08SG32E1MTJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader delivering secure, connected, and intelligent solutions for automotive, industrial, IoT, mobile, and communication infrastructure markets.
The S9S08SG32E1MTJ belongs to NXP's legacy HCS08 microcontroller family, designed specifically for cost-effective, ultra-low-power embedded control in automotive and industrial applications where reliability, small footprint, and robust analog integration are essential.
FAQ
What is the maximum operating frequency of the S9S08SG32E1MTJ under industrial temperature conditions?
The S9S08SG32E1MTJ supports a maximum bus frequency of 40 MHz at ambient temperatures from –40°C to +125°C. At temperatures exceeding 125°C, the maximum rated bus frequency is reduced to 36 MHz to maintain timing integrity and reliability. This specification is guaranteed per Freescale's Rev. 8 MC9S08SG32 datasheet, Section "Electrical Characteristics", Table A-1.
Does the S9S08SG32E1MTJ support real-time counter operation during ultra-low-power stop modes?
Yes, the S9S08SG32E1MTJ supports full RTC operation in stop3 mode using its on-chip 1 kHz low-power oscillator. This allows precise timekeeping and periodic wake-up without external crystals or clocks, reducing system BOM cost and power consumption. The RTC remains active while most other peripherals are disabled, as documented in Section 3.6.1 ("Stop3 Mode") of the MC9S08SG32 Rev. 8 datasheet.
How many analog input channels does the ADC in the S9S08SG32E1MTJ support, and what is its resolution?
The S9S08SG32E1MTJ integrates a 10-bit successive-approximation ADC with 16 dedicated analog input channels. It achieves a typical conversion time of 2.5 µs and includes an internal temperature sensor and bandgap reference channel. These capabilities are confirmed in Chapter 9 ("Analog-to-Digital Converter") of the MC9S08SG32 Rev. 8 datasheet, and apply specifically to the S9S08SG32E1MTJ variant.
Is the S9S08SG32E1MTJ pin-compatible with other members of the MC9S08SGxx family?
No, the S9S08SG32E1MTJ in 28-TSSOP is not pin-compatible with MC9S08SG16 variants or higher-pin-count derivatives like the 44-pin MC9S08AC60. Pin assignments differ across packages and memory variants - for example, PTB[5:2] ganged output and XOSC connections are specific to the 28-TSSOP layout. Always verify pin mapping against Figure 2-1 ("Pin Assignments") in the MC9S08SG32 Rev. 8 datasheet before board reuse.
What debug interface does the S9S08SG32E1MTJ provide, and is it supported by modern tools?
The S9S08SG32E1MTJ provides a single-wire background debug mode (BDM) interface compliant with Freescale/NXP BDM protocol. It is supported by legacy tools including P&E Micro's Cyclone Pro and CodeWarrior Development Studio v10.x. While newer IDEs like MCUXpresso do not natively support HCS08, third-party debug probes with BDM firmware (e.g., OSJTAG) maintain full compatibility with the S9S08SG32E1MTJ's debug module.
S9S08SG32E1MTJ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 16
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08SG32E1MTJ FAQ
1.How can I place an order for S9S08SG32E1MTJ through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08SG32E1MTJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08SG32E1MTJ reliable?
The price and inventory of S9S08SG32E1MTJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG32E1MTJ is usually 5 days.
3.What payment methods are accepted for S9S08SG32E1MTJ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08SG32E1MTJ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S08SG32E1MTJ?
S9S08SG32E1MTJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08SG32E1MTJ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08SG32E1MTJ?
For technical support, including S9S08SG32E1MTJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG32E1MTJ requirements.
6.How does Aetrix verify that S9S08SG32E1MTJ is sourced from the original manufacturer or authorized distributors?
All S9S08SG32E1MTJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG32E1MTJ meets industry standards.
7.What is the process for return or replacement of S9S08SG32E1MTJ?
All S9S08SG32E1MTJ units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG32E1MTJ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08SG32E1MTJ part is unused and in its original packaging.
Return procedure for S9S08SG32E1MTJ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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