NXP Semiconductors S9S08SG32E1MTJR
- Part No.:
- S9S08SG32E1MTJR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
S9S08SG32E1MTJR.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 20TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S9S08SG32E1MTJR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB Flash, 2 KB RAM, and integrated peripherals including 10-bit ADC, dual TPM timers, SCI, SPI, I²C, ACMP, and RTC. It operates at up to 40 MHz bus frequency, supports -40°C to 125°C ambient temperature, and targets automotive body electronics, industrial control, and appliance MCU applications.
For engineers reviewing the S9S08SG32E1MTJR datasheet, S9S08SG32E1MTJR pinout, S9S08SG32E1MTJR application, or S9S08SG32E1MTJR equivalent, key selection criteria include its 28-pin TSSOP package, on-chip background debug interface, low-voltage detection with interrupt capability, flash block protection, and support for stop3 mode with RTC and ADC active.
Technical Context
The S9S08SG32E1MTJR implements the HCS08 CPU core with HC08 instruction set compatibility and BGND instruction support. It integrates an Internal Clock Source (ICS) module featuring a frequency-locked loop (FLL) with precision-trimmed internal reference (±0.2% resolution), enabling bus frequencies from 2 MHz to 20 MHz across voltage and temperature.
Peripherals include a 16-channel 10-bit ADC with 2.5 µs conversion time and internal temperature sensor, two 2-channel TPM modules supporting input capture/output compare/PWM, and a real-time counter (RTC) with free-running 1 kHz low-power oscillator usable in all MCU modes including stop3.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS08 8-bit CPU with 40-MHz max bus frequency; supports 32 interrupt/reset sources |
| Memory | 32 KB on-chip Flash (program/erase over full temp/voltage range); 2 KB RAM |
| ADC | 16-channel, 10-bit resolution, 2.5 µs conversion time; includes internal bandgap reference and temperature sensor |
| Timers | Dual TPM modules (TPM1, TPM2), each with 2 channels; supports PWM, input capture, output compare |
| Clock Sources | Internal ICS with FLL + external crystal/ceramic resonator (31.25 kHz–16 MHz); 1 kHz RTC oscillator |
| Operating Range | -40°C to +125°C ambient; VDD = 2.7–5.5 V; qualified for automotive AEC-Q100 Grade 2 |
| Debug Interface | Single-wire background debug (BDM) with breakpoint support and on-chip ICE module |
Pinout & Package
Package: 28-pin Thin Shrink Small Outline Package (TSSOP), 4.4 mm × 9.7 mm body, 0.65 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Primary power domain; requires local decoupling per datasheet layout guidelines |
| XTAL, EXTAL | Crystal/resonator connection | Supports Pierce oscillator configuration for external clock source (1–16 MHz) |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external reset signal or power-on reset |
| BKGD/MS | Background debug / mode select | Single-wire BDM interface pin; also selects active background mode during reset |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit bidirectional port with configurable pull-up, slew rate, and drive strength |
| PTB0–PTB7 | Port B general-purpose I/O | 8-bit bidirectional port; PTB[5:2] supports ganged output for simultaneous write |
| PTC0–PTC3 | Port C general-purpose I/O | 4-bit bidirectional port; PTC[3:0] supports ganged output |
| AD0–AD15 | ADC analog inputs | 16 dedicated analog input pins mapped to Port A/B/C; share physical pins with GPIO |
Key Features
| Feature | Design Value |
|---|---|
| Flash Security | On-chip security circuitry prevents unauthorized access to Flash and RAM contents via background debug interface |
| Low-Power Modes | Two very low-power stop modes (stop2, stop3) and reduced-power wait mode; RTC remains active in stop3 |
| System Protection | Watchdog COP reset with selectable clock source (1 kHz internal or bus clock); low-voltage detect/reset/interrupt with programmable thresholds |
| Analog Integration | ACMP with edge-selectable interrupt and internal bandgap reference; ADC runs in stop3 mode for battery-powered wake-up sensing |
| Peripheral Flexibility | I²C supports multi-master operation and 10-bit addressing; SCI includes LIN master break generation and slave break detection |
Applications
| Automotive Body Control Module | Industrial Sensor Node |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in passenger vehicles. IC Role / Device Role / Timing Role: Main system controller executing real-time logic, managing CAN/LIN communication, and interfacing with analog sensors and actuators. Use Value: Integrated ADC, ACMP, and LIN-capable SCI reduce external component count; AEC-Q100 qualification ensures reliability in harsh automotive environments. | Use Scenario: Battery-powered remote monitoring of temperature, humidity, and vibration in factory equipment or HVAC systems. IC Role / Device Role / Timing Role: Low-power data acquisition node performing periodic analog sampling, local decision-making, and wireless transmission trigger. Use Value: Stop3 mode with active RTC and ADC enables ultra-low-power wake-up intervals; internal temperature sensor eliminates need for external thermal IC. |
| Home Appliance Motor Control | Smart Metering Interface |
Use Scenario: Speed and direction control of BLDC or universal motors in washing machines, dishwashers, and fans. IC Role / Device Role / Timing Role: Dedicated motor timing controller generating precise PWM signals using TPM modules while monitoring current feedback via ADC. Use Value: Dual TPM modules provide independent channel control for multi-phase drive; ganged GPIO simplifies control of power stage enable signals. | Use Scenario: Local interface unit aggregating pulse outputs from utility meters and communicating via RS-485 or PLC to central gateway. IC Role / Device Role / Timing Role: Protocol translation and event logging controller handling pulse counting, time-stamping, and serial communication stack. Use Value: Real-time counter with calendar support enables accurate time-of-day stamping; SPI and I²C allow expansion of memory or secure element for firmware updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08SG48E1MTJR | 48 KB Flash, same peripheral set and pinout; higher memory capacity with identical package and voltage/temp rating | Preferred where firmware complexity or future feature expansion requires larger code space without PCB redesign | Select when additional Flash headroom is needed for bootloader, OTA updates, or enhanced diagnostics |
| S9S08SG16E1MTJR | 16 KB Flash, otherwise identical architecture, peripherals, and pinout; lower cost variant in same 28-TSSOP package | Suitable for cost-sensitive applications with smaller firmware footprint and no requirement for >16 KB code storage | Choose for legacy designs or new cost-optimized implementations where 16 KB Flash suffices |
Compared with S9S08SG32E1MTJR, the MC9S08SG48E1MTJR offers scalable code density without layout changes, while the S9S08SG16E1MTJR provides direct cost reduction for simpler applications-both maintain identical peripheral functionality, debug interface, and environmental qualification.
Availability
S9S08SG32E1MTJR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, and home appliance motor control requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for S9S08SG32E1MTJR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The S9S08SG32E1MTJR belongs to NXP's legacy HCS08 microcontroller family, designed specifically for cost-sensitive, low-power embedded control applications in automotive and industrial environments where robustness, debuggability, and AEC-Q100 compliance are essential.
FAQ
What is the maximum operating temperature range for the S9S08SG32E1MTJR?
The S9S08SG32E1MTJR is rated for operation from -40°C to +125°C ambient temperature and is qualified to AEC-Q100 Grade 2 standards. This specification is verified across full voltage range (2.7–5.5 V) and applies to all core functions, Flash programming/erase, ADC, RTC, and peripheral operation-including stop3 mode with active RTC and ADC. The device supports high-temperature variants up to +150°C under specific ordering codes not applicable to S9S08SG32E1MTJR.
Does the S9S08SG32E1MTJR support in-circuit debugging?
Yes, the S9S08SG32E1MTJR includes a single-wire background debug (BDM) interface compliant with Freescale/NXP BDM protocol. It supports real-time register inspection, memory read/write, breakpoint setting (one hardware breakpoint plus two more via on-chip debug module), and full in-circuit emulation using the integrated ICE module with 8-deep FIFO and nine trigger modes. No external JTAG adapter is required-only a standard BDM pod or compatible debugger such as PE Micro Cyclone or Segger J-Link with BDM firmware.
Can the S9S08SG32E1MTJR operate in low-power modes with the ADC active?
Yes, the S9S08SG32E1MTJR supports ADC operation in stop3 mode-the deepest low-power state where the CPU, Flash, and most peripherals are disabled but the RTC, ADC, and ACMP remain functional. In this mode, the ADC can perform conversions triggered by RTC overflow or external events, enabling battery-operated wake-up sensing without full system wake-up. Conversion results are stored in registers accessible upon exit from stop3, preserving energy efficiency.
What clock sources are available on the S9S08SG32E1MTJR?
The S9S08SG32E1MTJR provides multiple clock sources: an internal ICS module with FLL and precision-trimmed RC oscillator (enabling 2–20 MHz bus frequencies), an external crystal or ceramic resonator via XTAL/EXTAL pins (31.25 kHz–16 MHz), and a dedicated 1 kHz low-power RTC oscillator that runs independently in all modes including stop3. The ICS supports automatic failover and trimming calibration, and the RTC oscillator requires no external components.
Is the S9S08SG32E1MTJR pin-compatible with other members of the MC9S08SGxx family?
Yes, the S9S08SG32E1MTJR in 28-TSSOP package is pin-compatible with MC9S08SG16E1MTJR and MC9S08SG48E1MTJR-same pin count, identical pin functions, and shared mechanical footprint. This allows direct substitution within the same package variant for memory-scaling decisions without PCB revision. However, pin compatibility does not extend to 16-TSSOP or 20-TSSOP variants, which have different pinouts and reduced I/O counts.
S9S08SG32E1MTJR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 16
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08SG32E1MTJR FAQ
1.How can I place an order for S9S08SG32E1MTJR through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08SG32E1MTJR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08SG32E1MTJR reliable?
The price and inventory of S9S08SG32E1MTJR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG32E1MTJR is usually 5 days.
3.What payment methods are accepted for S9S08SG32E1MTJR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08SG32E1MTJR transactions.
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4.How is shipping managed for S9S08SG32E1MTJR?
S9S08SG32E1MTJR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08SG32E1MTJR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08SG32E1MTJR?
For technical support, including S9S08SG32E1MTJR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG32E1MTJR requirements.
6.How does Aetrix verify that S9S08SG32E1MTJR is sourced from the original manufacturer or authorized distributors?
All S9S08SG32E1MTJR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG32E1MTJR meets industry standards.
7.What is the process for return or replacement of S9S08SG32E1MTJR?
All S9S08SG32E1MTJR units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG32E1MTJR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08SG32E1MTJR part is unused and in its original packaging.
Return procedure for S9S08SG32E1MTJR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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