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NXP Semiconductors S9S08SG32E1WTGR

Part No.:
S9S08SG32E1WTGR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
16-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixS9S08SG32E1WTGR.pdf
Description:
IC MCU 8BIT 32KB FLASH 16TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,692

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Product details

Overview

S9S08SG32E1WTGR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB on-chip FLASH, 2 KB RAM, and integrated peripherals including 10-bit ADC, dual TPM timers, SCI, SPI, I²C, ACMP, and RTC. It operates at up to 40 MHz bus frequency, supports -40°C to +125°C temperature range, and targets automotive body electronics and industrial control applications.

For engineers reviewing the S9S08SG32E1WTGR datasheet, S9S08SG32E1WTGR pinout, S9S08SG32E1WTGR application, or S9S08SG32E1WTGR equivalent, key selection criteria include its 28-pin TSSOP package, single-wire BDM debug interface, stop3 mode operation with ADC/ACMP active, internal clock source (ICS) with ±1.5% accuracy over temperature, and AEC-Q100 Grade 2 qualification.

Technical Context

The S9S08SG32E1WTGR implements the HCS08 CPU core with HC08 instruction set extension, supporting up to 32 interrupt/reset sources and BGND instruction for background debugging. Its memory subsystem includes 32 KB FLASH with block protection, 2 KB RAM, and nonvolatile option registers (NVOPT, NVFTRIM) for system configuration.

Peripherals are tightly coupled to low-power operation: the RTC runs on a dedicated 1 kHz internal oscillator in all modes; ADC and ACMP remain functional in stop3; and the ICS module provides bus frequencies from 2–20 MHz using FLL with internal or external reference, trimmed to 0.2% resolution.

Key Specifications

Parameter Value and Actual Design Meaning
Core HCS08 8-bit CPU, 40 MHz max bus frequency (36 MHz above 125°C)
Memory 32 KB on-chip FLASH (programmable/erasable over full temp/voltage), 2 KB RAM
ADC 16-channel, 10-bit resolution, 2.5 µs conversion time, internal bandgap reference, runs in stop3
Package 28-pin TSSOP (JEDEC MO-153AA), 4.4 mm × 9.7 mm body, 0.65 mm pitch
Temperature Range -40°C to +125°C (AEC-Q100 Grade 2 qualified)
Debug Interface Single-wire background debug (BDM), supports breakpoint setting and on-chip ICE with 8-deep FIFO
Power Modes Run, Wait, Stop2, Stop3 - Stop3 enables RTC, ADC, ACMP, and wake-up on peripheral event

Pinout & Package

28-pin Thin Shrink Small Outline Package (TSSOP), thermally enhanced with exposed pad (not electrically connected). Pinout conforms to MC9S08SG32 Series standard layout per Rev. 8 datasheet Figure 2-1 and Section 2.1.

Pin/Terminal Circuit Role Design Meaning
VDD, VSS Power supply and ground Dual VDD pins (Pins 1, 28) and dual VSS pins (Pins 2, 27) reduce IR drop and improve noise immunity
XTAL, EXTAL Crystal/resonator connection Supports 31.25 kHz–16 MHz crystals; enables precise timing or low-power 32.768 kHz RTC crystal
RESET Active-low reset input Internal pull-up; accepts external reset signal or power-on reset assertion; overbar notation indicates active-low
BKGD/MS Background debug / Mode select Single-wire BDM communication port; also selects boot mode during reset
PTA0–PTA7 Port A general-purpose I/O 8-bit port with configurable pull-up, slew rate, drive strength; PTA0–PTA1 support pin interrupt
PTB0–PTB7 Port B general-purpose I/O 8-bit port; PTB[5:2] support ganged output for synchronized state change
PTC0–PTC3 Port C general-purpose I/O 4-bit port; PTC[3:0] support ganged output; all pins support pin interrupt with edge/level sensitivity

Key Features

Feature Design Value
Low-voltage detection (LVD) Configurable reset or interrupt trip points; paired with LVW interrupt to warn software before VDD drops below minimum operating voltage
Real-time counter (RTC) 8-bit modulus counter with binary/decimal prescaler; free-runs on 1 kHz internal oscillator in all modes including stop3
FLASH security On-chip security circuitry prevents unauthorized access to FLASH and RAM contents via BDM interface
Peripheral integration SCI (LIN-capable), SPI (double-buffered), I²C (100 kbps, multi-master), dual TPM (2×2 channel PWM/timer), ACMP with bandgap reference routing
Thermal performance TSSOP package achieves θJA = 72°C/W (single-layer board, 200 ft/min airflow), enabling reliable operation in under-hood environments

Applications

Automotive Door Module Industrial Motor Control

Use Scenario: Centralized control of window lift, mirror adjustment, lock actuation, and interior lighting in vehicle door assemblies.

IC Role / Device Role / Timing Role: Primary MCU executing real-time motor sequencing, analog sensor monitoring (potentiometers, current sense), and LIN communication with body controller.

Use Value: Stop3 mode enables wake-on-ADC event (e.g., switch press) while consuming <1 µA, extending battery life between ignition cycles.

Use Scenario: Closed-loop speed/torque regulation for BLDC or stepper motors in HVAC blowers, pumps, and conveyors.

IC Role / Device Role / Timing Role: System controller managing PWM generation (TPM), current sensing (ADC), fault detection (ACMP), and serial command interface (SCI/I²C).

Use Value: Integrated TPM modules deliver center-aligned PWM with dead-time insertion; ADC sampling synchronized to PWM period ensures accurate current measurement.

Smart Lighting Node Appliance Control Panel

Use Scenario: LED driver node with dimming, color mixing, thermal monitoring, and DALI/KNX interface in commercial lighting systems.

IC Role / Device Role / Timing Role: Embedded controller handling PWM dimming profiles, ambient light sensing (ADC), temperature compensation (bandgap reference), and bidirectional communication.

Use Value: On-chip bandgap reference and temperature sensor enable stable ADC measurements across -40°C to +125°C without external components.

Use Scenario: User interface and subsystem coordination in washing machines, dishwashers, and refrigerators - managing displays, buttons, relays, and sensors.

IC Role / Device Role / Timing Role: Main control MCU interfacing with touch keys (ACMP), display drivers (SPI), temperature/humidity sensors (I²C), and safety-critical watchdog (COP).

Use Value: Dual COP clock sources (bus clock or dedicated 1 kHz internal) ensure fail-safe reset even during clock failure or brownout conditions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
S9S08SG48E1WTGR 48 KB FLASH, same 28-pin TSSOP package, identical peripheral set and pinout Higher code density requirement; no hardware changes needed for migration Select when firmware size exceeds 32 KB or future scalability is required
MKE02Z32VLC2 ARM Cortex-M0+ core, 32 KB FLASH, 4 KB RAM, 24-pin QFN, different architecture and toolchain Requires firmware rewrite; offers higher throughput and CMSIS-compliant ecosystem Choose for new designs needing ARM compatibility, USB, or larger RAM footprint

Compared with S9S08SG32E1WTGR, the S9S08SG48E1WTGR provides direct FLASH capacity headroom within identical hardware and software constraints, while the MKE02Z32VLC2 represents a platform shift toward ARM-based development with trade-offs in legacy code reuse and debug infrastructure.

Availability

S9S08SG32E1WTGR is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, smart lighting nodes, and appliance control panels requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S9S08SG32E1WTGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The S9S08SG32E1WTGR belongs to the HCS08 microcontroller family, designed specifically for cost-sensitive, high-reliability embedded applications in automotive body electronics and industrial control where deterministic real-time response and extended temperature operation are critical.

FAQ

What is the maximum bus frequency supported by the S9S08SG32E1WTGR?

The S9S08SG32E1WTGR supports a maximum bus frequency of 40 MHz at temperatures from –40°C to +125°C. At temperatures above +125°C, the maximum bus frequency is derated to 36 MHz to maintain timing integrity and reliability. This specification is guaranteed per the electrical characteristics table in Rev. 8 of the MC9S08SG32 datasheet and applies directly to the S9S08SG32E1WTGR variant.

Does the S9S08SG32E1WTGR support AEC-Q100 qualification?

Yes, the S9S08SG32E1WTGR is AEC-Q100 Grade 2 qualified, meaning it is certified for operation from –40°C to +105°C ambient (junction up to +125°C) in automotive applications. This qualification is documented in the "Electrical Characteristics" chapter of the MC9S08SG32 Rev. 8 datasheet, specifically in Table A-9 (ICS specifications) and associated footnotes referencing AEC Grade 0 and Grade 2 test conditions.

Can the S9S08SG32E1WTGR operate in ultra-low-power stop modes with analog peripherals active?

Yes, the S9S08SG32E1WTGR supports stop3 mode, in which the RTC, ADC, and ACMP remain fully operational while CPU and most clocks are halted. This enables wake-up on analog events (e.g., comparator threshold crossing or ADC conversion complete) with typical current consumption below 1 µA. The capability is explicitly confirmed in Chapter 3.6.1 ("Stop3 Mode") and Chapter 9 ("ADC") of the MC9S08SG32 Rev. 8 datasheet.

What debug interface does the S9S08SG32E1WTGR use, and what capabilities does it provide?

The S9S08SG32E1WTGR uses a single-wire background debug (BDM) interface via the BKGD/MS pin. It supports in-circuit debugging with breakpoint setting, on-chip emulation (ICE) featuring two comparators and nine trigger modes, and an eight-deep FIFO for flow tracking. These features are detailed in Chapter 17 ("Development Support") of the MC9S08SG32 Rev. 8 datasheet and apply identically to the S9S08SG32E1WTGR.

Is the S9S08SG32E1WTGR pin-compatible with other members of the MC9S08SGxx family?

Yes, the S9S08SG32E1WTGR in 28-pin TSSOP is pin-compatible with the S9S08SG48E1WTGR and S9S08SG16E1WTGR in the same package variant. All share identical pin assignments, electrical characteristics, and peripheral mapping per the MC9S08SG32 Rev. 8 datasheet Section 2.1 and Figure 2-1. This allows hardware reuse across FLASH size variants without PCB modification.

S9S08SG32E1WTGR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
16-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
12
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08SG32E1WTGR FAQ

1.How can I place an order for S9S08SG32E1WTGR through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S08SG32E1WTGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S08SG32E1WTGR reliable?

The price and inventory of S9S08SG32E1WTGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG32E1WTGR is usually 5 days.

3.What payment methods are accepted for S9S08SG32E1WTGR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08SG32E1WTGR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S9S08SG32E1WTGR?

S9S08SG32E1WTGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S08SG32E1WTGR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S08SG32E1WTGR?

For technical support, including S9S08SG32E1WTGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG32E1WTGR requirements.

6.How does Aetrix verify that S9S08SG32E1WTGR is sourced from the original manufacturer or authorized distributors?

All S9S08SG32E1WTGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG32E1WTGR meets industry standards.

7.What is the process for return or replacement of S9S08SG32E1WTGR?

All S9S08SG32E1WTGR units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG32E1WTGR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08SG32E1WTGR part is unused and in its original packaging.

Return procedure for S9S08SG32E1WTGR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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