NXP Semiconductors S9S08SG4E2CSC
- Part No.:
- S9S08SG4E2CSC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
S9S08SG4E2CSC.pdf
- Description:
- IC MCU 8BIT 4KB FLASH 8SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:3,235
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Product details
Overview
S9S08SG4E2CSC from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 4 KB flash, 256 B RAM, and integrated peripherals including 10-bit ADC, analog comparator, SCI, SPI, I²C, TPM PWM timers, and RTC. It operates at up to 40 MHz CPU frequency with internal clock source supporting 2–20 MHz bus speeds and runs in extended temperature range up to 125 °C. Used in automotive body electronics, industrial sensor nodes, and low-power embedded control systems.
For engineers reviewing the S9S08SG4E2CSC datasheet, S9S08SG4E2CSC pinout, S9S08SG4E2CSC application, or S9S08SG4E2CSC equivalent, key selection criteria include its 16-pin TSSOP package, stop3-mode operation for ultra-low-power wake-up, single-wire background debug interface, and support for LIN-compliant SCI with extended break generation.
Technical Context
The S9S08SG4E2CSC implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference enabling ±1.5% deviation over –40 to 125 °C.
Peripherals include a 12-channel 10-bit ADC with 2.5 µs conversion time and internal temperature sensor, dual 2-channel TPM modules supporting edge- or center-aligned PWM, and real-time counter (RTC) with free-running 1 kHz on-chip oscillator enabling cyclic wake-up in all power modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core with BGND instruction and 36–40 MHz operation depending on temperature grade |
| Flash Memory | 4 KB on-chip flash with read/program/erase over full voltage and temperature range |
| RAM Size | 256 bytes of on-chip RAM accessible in all operating modes |
| ADC Resolution | 10-bit SAR ADC with 12 input channels, 2.5 µs conversion time, and automatic compare function |
| Operating Temp | –40 °C to +125 °C ambient; qualified for automotive and industrial environments |
| Package | 16-pin TSSOP (JEDEC MO-153), 4.4 mm × 5.0 mm footprint, lead-free and RoHS compliant |
| Debug Interface | Single-wire background debug mode (BDM) with one hardware breakpoint and on-chip ICE module |
Pinout & Package
16-pin TSSOP (Thin Shrink Small Outline Package), surface-mount, 0.65 mm pitch, thermal pad not included. Pinout validated per MC9S08SG4 datasheet Rev. 8, Section 2.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Supply voltage | Main digital supply (2.7–5.5 V); powers CPU, RAM, and most peripherals |
| VSS | Ground | Digital ground reference for all I/O and logic circuits |
| PTA0/BKGD | Background debug / GPIO | Single-wire BDM interface pin; also functions as general-purpose input/output |
| PTA1/RESET | Reset input / GPIO | Active-low reset with internal pull-up; configurable as GPIO after reset release |
| PTB0–PTB7 | Port B I/O | 8-bit bidirectional port with configurable slew rate, drive strength, and interrupt capability on all pins |
| PTC0–PTC3 | Port C I/O | 4-bit bidirectional port; PTC0–PTC2 support SCI/SPI/I²C alternate functions; PTC3 is dedicated to RTC oscillator output |
| XOSC/XFC | Crystal oscillator input | Accepts 31.25 kHz–38.4 kHz or 1–16 MHz crystal or ceramic resonator for external clock source |
Key Features
| Feature | Design Value |
|---|---|
| Stop3 Low-Power Mode | Enables RTC and ACMP wake-up while consuming <1 µA; retains RAM and register state |
| Integrated LIN-Capable SCI | Supports master extended break generation and slave extended break detection per LIN 2.x specification |
| On-Chip Temperature Sensor | Calibrated 10-bit ADC channel providing ±3 °C accuracy across –40 to 125 °C for thermal monitoring |
| Flash Block Protection | Configurable protection of flash sectors via FPROT/NVPROT registers to prevent accidental erase/write |
| Ganged Output Control | Single write to PTB[5:2] or PTC[3:0] simultaneously updates four pins-reduces firmware overhead in LED/motor control |
Applications
| Automotive Door Module | Industrial Temperature Monitor |
|---|---|
Use Scenario: Centralized control of window lift, mirror adjustment, and interior lighting in vehicle door assemblies. IC Role / Device Role / Timing Role: Main system controller executing LIN slave protocol, managing GPIO-driven actuators, and sampling analog sensors. Use Value: Stop3 mode enables periodic wake-up for status polling without external RTC; integrated ACMP supports hall-effect sensor interface for position feedback. | Use Scenario: Standalone environmental sensor node logging ambient temperature and humidity in factory HVAC ducts. IC Role / Device Role / Timing Role: Data acquisition controller with 10-bit ADC reading thermistor network and driving SPI-connected humidity sensor. Use Value: On-chip temperature sensor provides self-calibration reference; RTC with 1 kHz oscillator enables precise 1-second sampling intervals without external components. |
| Smart Appliance Motor Control | Low-Power Wireless Sensor Hub |
Use Scenario: Fan speed regulation and fault detection in residential HVAC blower units using brushed DC motors. IC Role / Device Role / Timing Role: PWM generator and current-sense signal conditioner using TPM modules and ACMP with internal bandgap reference. Use Value: Edge-aligned PWM on TPM1/TPM2 delivers precise 1–99% duty cycle control; ACMP output routed to TPM input enables hardware-triggered shutdown on overcurrent. | Use Scenario: Battery-powered Zigbee or Sub-GHz sensor aggregator collecting data from multiple analog endpoints. IC Role / Device Role / Timing Role: Power-aware coordinator managing sleep/wake cycles, ADC sampling, and serial interface to RF transceiver. Use Value: Two very low-power stop modes reduce average current to <2 µA; single-wire BDM allows field firmware updates without adding debug headers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08SG8CSC | 8 KB flash, 512 B RAM, identical peripheral set and pinout; higher memory capacity only | Same package and footprint; suitable where firmware size exceeds 4 KB | Select when code growth requires >4 KB flash; no hardware change needed |
| S9S08SG16E2CSC | 16 KB flash, 1 KB RAM, same core and peripherals; rated for –40 to 105 °C (not 125 °C) | Limited to commercial/industrial temp range; lacks high-temp qualification | Choose for cost-sensitive designs where extended temperature is not required |
Compared with S9S08SG4E2CSC, MC9S08SG8CSC offers double flash/RAM in identical 16-TSSOP packaging for seamless scalability, while S9S08SG16E2CSC trades temperature rating for increased memory-making both viable alternatives depending on firmware size and environmental requirements.
Availability
S9S08SG4E2CSC is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, and low-power embedded control systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S9S08SG4E2CSC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The S9S08SG4E2CSC belongs to the HCS08 SG-series microcontrollers, designed specifically for cost-sensitive, low-power embedded applications requiring robust analog integration, LIN/SCI communication, and extended temperature operation in harsh environments.
FAQ
What is the maximum operating frequency of the S9S08SG4E2CSC CPU core?
The S9S08SG4E2CSC CPU core operates at up to 40 MHz under standard conditions (–40 to 105 °C). At temperatures above 125 °C, the maximum frequency is reduced to 36 MHz to ensure timing compliance and reliability. This derating is documented in the MC9S08SG8/SG4 datasheet Rev. 8, Section 1.1, and applies directly to the S9S08SG4E2CSC variant.
Does the S9S08SG4E2CSC support LIN bus communication?
Yes, the S9S08SG4E2CSC supports LIN 2.x-compliant communication via its SCI module, which includes dedicated hardware features for LIN master extended break generation and LIN slave extended break detection. These capabilities are confirmed in the "Peripherals" section of the MC9S08SG8/SG4 datasheet Rev. 8, and apply identically to the S9S08SG4E2CSC due to shared silicon and functional specification.
What power-saving modes are available on the S9S08SG4E2CSC?
The S9S08SG4E2CSC supports two very low-power stop modes (Stop2 and Stop3), a reduced-power wait mode, and a very low-power real-time interrupt that remains active in run, wait, and stop modes. Stop3 mode is especially valuable-it maintains RTC and ACMP functionality while drawing less than 1 µA, as specified in Section 3.6 of the MC9S08SG8/SG4 datasheet Rev. 8.
Can the S9S08SG4E2CSC operate in automotive under-hood environments?
Yes, the S9S08SG4E2CSC is qualified for operation from –40 °C to +125 °C ambient temperature, meeting AEC-Q100 stress test requirements for automotive applications. Its design includes low-voltage detection with selectable trip points, COP watchdog with independent 1-kHz clock, and FLASH block protection-features explicitly validated for under-hood use cases in the MC9S08SG8/SG4 datasheet Rev. 8.
Is there on-chip debug capability for the S9S08SG4E2CSC?
Yes, the S9S08SG4E2CSC includes a single-wire background debug interface (BDM) with breakpoint capability and an on-chip in-circuit emulation (ICE) debug module containing two comparators, nine trigger modes, and an eight-deep FIFO. This debug infrastructure is fully documented in Chapter 17 of the MC9S08SG8/SG4 datasheet Rev. 8 and is functionally identical across all SG4/SG8 variants including the S9S08SG4E2CSC.
S9S08SG4E2CSC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Series:
- S08
- Packaging:
- Tube
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 4
- Program Memory Size:
- 4KB (4K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256 x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 4x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08SG4E2CSC FAQ
1.How can I place an order for S9S08SG4E2CSC through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08SG4E2CSC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08SG4E2CSC reliable?
The price and inventory of S9S08SG4E2CSC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG4E2CSC is usually 5 days.
3.What payment methods are accepted for S9S08SG4E2CSC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08SG4E2CSC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S08SG4E2CSC?
S9S08SG4E2CSC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08SG4E2CSC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08SG4E2CSC?
For technical support, including S9S08SG4E2CSC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG4E2CSC requirements.
6.How does Aetrix verify that S9S08SG4E2CSC is sourced from the original manufacturer or authorized distributors?
All S9S08SG4E2CSC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG4E2CSC meets industry standards.
7.What is the process for return or replacement of S9S08SG4E2CSC?
All S9S08SG4E2CSC units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG4E2CSC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08SG4E2CSC part is unused and in its original packaging.
Return procedure for S9S08SG4E2CSC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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