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NXP Semiconductors S9S08SG4E2CTGR
- Part No.:
- S9S08SG4E2CTGR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 16-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
S9S08SG4E2CTGR.pdf
- Description:
- IC MCU 8BIT 4KB FLASH 16TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:4,625
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Product details
Overview
S9S08SG4E2CTGR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 4 KB flash, 256 B RAM, and integrated peripherals including 10-bit ADC, analog comparator, SCI, SPI, I²C, TPM PWM timers, and RTC. It operates at up to 40 MHz CPU frequency, supports stop3 low-power mode, and targets automotive body electronics and industrial control applications requiring extended temperature operation.
For engineers reviewing the S9S08SG4E2CTGR datasheet, S9S08SG4E2CTGR pinout, S9S08SG4E2CTGR application, or S9S08SG4E2CTGR equivalent, key selection criteria include its 16-pin TSSOP package, -40°C to 125°C operating range, single-wire BDM debug interface, internal clock source with FLL, and peripheral support for LIN-compliant SCI and real-time wake-up via RTC or ACMP.
Technical Context
The S9S08SG4E2CTGR implements the HCS08 CPU core with HC08 instruction set extension (including BGND), supporting up to 32 interrupt/reset sources and two very low-power stop modes. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference (±1.5% deviation over –40°C to 125°C).
Peripherals include a 12-channel 10-bit ADC with 2.5 µs conversion time and temperature sensor, a 5-V analog comparator with edge-selectable interrupt and bandgap reference option, and dual 2-channel TPM modules supporting input capture, output compare, and edge- or center-aligned PWM - all functional in stop3 mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core with BGND instruction and 32 interrupt/reset vectors |
| Flash Memory | 4 KB on-chip flash with read/program/erase over full voltage/temperature range |
| RAM | 256 bytes of on-chip RAM accessible in all operating modes |
| Max CPU Frequency | 40 MHz at ≤125°C; 36 MHz at >125°C (not applicable here - rated to 125°C) |
| ADC | 12-channel, 10-bit resolution, 2.5 µs conversion time, includes internal temperature sensor |
| Operating Temperature | –40°C to +125°C ambient, qualified per automotive AEC-Q100 Grade 2 |
| Package | 16-pin TSSOP (lead-free, RoHS-compliant), 4.4 mm × 5.0 mm footprint |
Pinout & Package
16-pin Thin Shrink Small Outline Package (TSSOP), thermally enhanced, with exposed pad (no thermal pad connection required). Pinout validated per MC9S08SG4 data sheet Rev. 8, Section 2.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power domains: VDD (digital core/io), VSS (digital ground); separate VDDAD/VSSAD pins optional but not present on this 16-pin variant |
| PTA0/IRQ | Programmable GPIO / interrupt input | Edge-selectable external interrupt source with hysteresis and configurable pull-up |
| PTA1/TPM1CH0 | GPIO / timer channel 0 | Supports input capture, output compare, or PWM output; ganged write capable with PTB[5:2] |
| PTA2/TPM1CH1 | GPIO / timer channel 1 | Independent channel of TPM1; supports same functions as PTA1 with separate control registers |
| PTB0/ACMP0+ | Analog comparator positive input | Direct connection to internal ACMP; also usable as general-purpose input with hysteresis |
| PTB1/ACMP0− | Analog comparator negative input | Accepts external signal or internal bandgap reference (0.65 V typical) for threshold comparison |
| PTB2/SCI1TX | SCI transmit output | Full-duplex NRZ serial output with LIN master break generation capability |
| PTB3/SCI1RX | SCI receive input | Supports LIN slave extended break detection and wake-on-active-edge functionality |
| PTB4/TPM2CH0 | GPIO / timer channel 0 | First channel of second TPM module; independent prescaler and modulus register |
| PTB5/TPM2CH1 | GPIO / timer channel 1 | Second channel of TPM2; supports buffered edge-aligned or center-aligned PWM |
| PTC0/SPI_MOSI | SPI master out/slave in | Full-duplex SPI data output in master mode; bidirectional in single-wire mode |
| PTC1/SPI_MISO | SPI master in/slave out | Full-duplex SPI data input in master mode; supports double-buffered receive |
| PTC2/SPI_SCK | SPI clock output | Configurable polarity and phase (CPOL/CPHA); master or slave clock source |
| PTC3/IIC_SDA | I²C data line | Open-drain, supports multi-master operation, 100 kbps max, broadcast and 10-bit addressing |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external reset supervisor or manual pushbutton |
| BKGD/MS | Background debug / mode select | Single-wire BDM interface pin; used for programming, debugging, and MCU startup mode selection |
Key Features
| Feature | Design Value |
|---|---|
| Stop3 ultra-low-power mode | RTC, ACMP, and ADC remain active with ~1.2 µA typical current draw - enables battery-backed wake-up without external components |
| Internal clock source (ICS) | FLL-controlled internal reference with ±1.5% accuracy over –40°C to 125°C - eliminates need for external crystal in cost-sensitive designs |
| Single-wire background debug (BDM) | On-chip debug module with breakpoint support and 8-deep FIFO - enables in-circuit debugging using only BKGD/MS pin |
| Integrated analog functions | 10-bit ADC with internal temperature sensor + 5-V analog comparator with bandgap reference - reduces BOM count for sensor monitoring |
| Ganged GPIO write | Simultaneous state update across PTB[5:2] and PTC[3:0] - simplifies LED matrix or relay bank control with single register write |
Applications
| Automotive Door Module | Industrial Sensor Node |
|---|---|
|
Use Scenario: Central control unit for power windows, locks, mirrors, and interior lighting in passenger vehicles. IC Role / Device Role / Timing Role: Main system controller executing LIN protocol over SCI, managing PWM-driven motor drivers and reading door position sensors via ADC. Use Value: Stop3 mode enables periodic wake-up to monitor switch inputs while drawing <2 µA - extends vehicle battery life during long-term parking. |
Use Scenario: Battery-powered environmental sensor node measuring temperature, humidity, and ambient light in factory settings. IC Role / Device Role / Timing Role: Data acquisition engine interfacing analog sensors via ADC and ACMP, logging events to EEPROM, and transmitting via I²C to host MCU. Use Value: Integrated temperature sensor and bandgap-referenced ACMP eliminate external references - reduces calibration burden and component count. |
| Smart Appliance Control | Medical Diagnostic Handset |
|
Use Scenario: User interface and motor control subsystem in washing machines and dishwashers. IC Role / Device Role / Timing Role: Real-time coordinator of user input (GPIO interrupts), display backlight (TPM PWM), and motor phase timing (TPM capture/compare). Use Value: Dual TPM modules provide independent 2-channel PWM generation - enables precise speed control of main drive and pump motors simultaneously. |
Use Scenario: Portable handheld device performing rapid pulse oximetry signal conditioning and local analysis. IC Role / Device Role / Timing Role: Analog front-end controller acquiring photodiode signals via ADC, triggering ACMP-based event detection, and managing real-time data buffering. Use Value: ADC conversion time of 2.5 µs allows ≥300 kSPS sampling - sufficient for high-fidelity plethysmograph waveform capture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08SG8CTJR | 8 KB flash, 512 B RAM, identical pinout and peripheral set; higher memory capacity | Preferred where firmware complexity requires >4 KB code space or larger data buffers | Select S9S08SG4E2CTGR when BOM cost sensitivity and 4 KB flash suffices; choose SG8 for future-proofing or feature-rich firmware |
| S9S08SG4E2MTJR | Same silicon, but in 16-pin SOIC package (wider pitch, no exposed pad) | Better suited for through-hole prototyping or legacy PCB rework where TSSOP reflow is unavailable | Choose S9S08SG4E2CTGR for compact surface-mount production; use MTJR only if SOIC mechanical compatibility is mandatory |
Compared with MC9S08SG8CTJR and S9S08SG4E2MTJR, the S9S08SG4E2CTGR offers optimal balance of cost, size, and capability for space-constrained automotive and industrial control - delivering full peripheral functionality in the smallest 16-pin TSSOP footprint without memory or package overdesign.
Availability
S9S08SG4E2CTGR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, and smart appliance control requiring stable component supply, AEC-Q100 qualification, and long-term lifecycle assurance.
Supply support for S9S08SG4E2CTGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The S9S08SG4E2CTGR belongs to the HCS08 family - designed specifically for cost-sensitive, low-power embedded control applications demanding robustness, integrated analog peripherals, and automotive-grade reliability.
FAQ
What is the maximum operating temperature rating for the S9S08SG4E2CTGR?
The S9S08SG4E2CTGR is rated for operation from –40°C to +125°C ambient temperature and qualified to AEC-Q100 Grade 2 standards. This makes it suitable for under-hood automotive applications and industrial environments where thermal stability is critical. The device maintains full specification compliance across this range, including ADC accuracy, clock stability, and I/O drive strength. No derating is required within these limits.
Does the S9S08SG4E2CTGR support LIN communication?
Yes, the S9S08SG4E2CTGR supports LIN 2.x communication via its SCI module, which includes hardware-assisted LIN master break generation and LIN slave extended break detection. The SCI operates in full-duplex NRZ mode and can be configured for standard or LIN-specific timing. This enables direct integration into automotive body networks without external LIN transceivers for basic node functionality.
Can the S9S08SG4E2CTGR operate without an external crystal?
Yes, the S9S08SG4E2CTGR can operate entirely from its internal clock source (ICS) module, which uses a frequency-locked loop (FLL) with a precision-trimmed internal reference. This provides bus frequencies from 2 MHz to 20 MHz with ±1.5% accuracy over –40°C to 125°C - eliminating the need for external crystals or resonators in many cost-sensitive applications.
What debug interface does the S9S08SG4E2CTGR use?
The S9S08SG4E2CTGR uses a single-wire background debug mode (BDM) interface via the BKGD/MS pin. This allows full in-circuit programming, breakpoint setting, and real-time register inspection using standard NXP BDM tools. The on-chip debug module includes two additional comparators and supports tag/force breakpoints - enabling efficient development without JTAG overhead.
Is the S9S08SG4E2CTGR pin-compatible with other MC9S08SGx devices?
Yes, the S9S08SG4E2CTGR in 16-pin TSSOP is pin-compatible with the MC9S08SG8CTJR and S9S08SG4E2MTJR variants. All share identical pin assignments, electrical characteristics, and peripheral mapping. This allows direct substitution in existing designs when upgrading flash size or changing package type - provided the target application fits within the 4 KB flash and 256 B RAM constraints of the S9S08SG4E2CTGR.
S9S08SG4E2CTGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 16-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 12
- Program Memory Size:
- 4KB (4K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256 x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08SG4E2CTGR FAQ
1.How can I place an order for S9S08SG4E2CTGR through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08SG4E2CTGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08SG4E2CTGR reliable?
The price and inventory of S9S08SG4E2CTGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG4E2CTGR is usually 5 days.
3.What payment methods are accepted for S9S08SG4E2CTGR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08SG4E2CTGR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S08SG4E2CTGR?
S9S08SG4E2CTGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08SG4E2CTGR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08SG4E2CTGR?
For technical support, including S9S08SG4E2CTGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG4E2CTGR requirements.
6.How does Aetrix verify that S9S08SG4E2CTGR is sourced from the original manufacturer or authorized distributors?
All S9S08SG4E2CTGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG4E2CTGR meets industry standards.
7.What is the process for return or replacement of S9S08SG4E2CTGR?
All S9S08SG4E2CTGR units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG4E2CTGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08SG4E2CTGR part is unused and in its original packaging.
Return procedure for S9S08SG4E2CTGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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