NXP Semiconductors S9S08SG4E2CTJ
- Part No.:
- S9S08SG4E2CTJ
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
S9S08SG4E2CTJ.pdf
- Description:
- IC MCU 8BIT 4KB FLASH 20TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S9S08SG4E2CTJ from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 4 KB flash, 256 B RAM, and integrated peripherals including 10-bit ADC, analog comparator, SCI, SPI, I²C, TPM PWM timers, and RTC. It operates at up to 40 MHz CPU frequency with internal FLL clock source and supports stop3 low-power mode with peripheral wake-up capability. Used in automotive body electronics, industrial sensor nodes, and smart appliance control.
For engineers reviewing the S9S08SG4E2CTJ datasheet, S9S08SG4E2CTJ pinout, S9S08SG4E2CTJ application, or S9S08SG4E2CTJ equivalent, key selection criteria include its 16-pin TSSOP package, -40°C to 125°C operating range, single-wire BDM debug interface, and support for LIN-compliant SCI with extended break generation.
Technical Context
The S9S08SG4E2CTJ implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference enabling ±1.5% deviation over -40°C to 125°C and bus frequencies from 2 MHz to 20 MHz.
Peripherals include a 12-channel 10-bit ADC with 2.5 µs conversion time and temperature sensor, dual 2-channel TPM modules supporting edge- or center-aligned PWM, and real-time counter with 1 kHz on-chip oscillator for cyclic wake-up in all power modes. The device runs ADC and ACMP in stop3 mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU with BGND instruction and 36–40 MHz operation |
| Flash Memory | 4 KB on-chip flash with read/program/erase over full voltage/temperature range |
| RAM | 256 B on-chip RAM, retained in wait and stop3 modes |
| ADC | 12-channel, 10-bit resolution, 2.5 µs conversion time, includes internal bandgap reference and temperature sensor |
| Operating Temperature | -40°C to +125°C (qualified per MC9S08SG4 data sheet Rev. 8) |
| Package | 16-pin TSSOP (SOIC not available for this variant; high-temp rating confirmed) |
| Debug Interface | Single-wire background debug mode (BDM) with one hardware breakpoint and on-chip ICE module |
Pinout & Package
16-pin Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153 compliant, 4.4 mm width, 1.2 mm height, 0.65 mm pitch. Pinout validated per MC9S08SG4 data sheet Rev. 8, Section 2.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual-supply pins for core/analog domains; VDDAD/VSSAD not separate - shared VDD/VSS used for ADC/ACMP |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit bidirectional port with configurable pull-up, slew rate, and drive strength; PTA0–PTA1 support SCI functions |
| PTB0–PTB7 | Port B general-purpose I/O | 8-bit bidirectional port; PTB2–PTB5 support TPM1/TPM2 channels and I²C; PTB6/PTB7 support XOSC |
| BKGD/MS | Background debug / mode select | Single-wire BDM communication and MCU mode configuration during reset |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; supports external reset assertion and low-voltage detect reset |
Key Features
| Feature | Design Value |
|---|---|
| Stop3 ultra-low-power mode | Enables ADC, ACMP, RTC, and SCI wake-up while CPU and most clocks halted; typical current < 2 µA |
| FLL-based internal clock source | Eliminates need for external crystal in cost-sensitive designs; ±1.5% accuracy over -40°C to 125°C without calibration |
| LIN-compliant SCI module | Supports master extended break generation and slave extended break detection per LIN 2.0/2.1, enabling automotive sub-network integration |
| On-chip RTC with 1 kHz oscillator | Provides calendar/time-of-day functionality and periodic wake-up without external timing components |
| Flash block protection | Prevents unauthorized read/write/erase of protected sectors via FOPT/NVOPT register settings |
Applications
| Automotive Door Module | Industrial Temperature Sensor Node |
|---|---|
|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in vehicle door assemblies. IC Role / Device Role / Timing Role: Main system controller executing LIN slave protocol, managing GPIO-driven actuators, and monitoring switch inputs. Use Value: Integrated LIN-capable SCI, 125°C rating, and stop3 wake-up enable reliable operation in under-hood-adjacent environments with minimal BOM count. |
Use Scenario: Battery-powered wireless node measuring ambient temperature and transmitting data via UART-to-LoRa bridge. IC Role / Device Role / Timing Role: Sensor interface MCU acquiring ADC readings, performing local threshold comparison, and scheduling transmissions via RTC-triggered wake-up. Use Value: On-chip temperature sensor + 10-bit ADC eliminates external sensor; stop3 mode with RTC wake-up extends battery life beyond 5 years. |
| Smart Appliance Motor Control | Medical Diagnostic Handheld |
|
Use Scenario: Fan speed regulation and thermal monitoring in HVAC blower units and refrigerator compressors. IC Role / Device Role / Timing Role: Real-time PWM generator (TPM) driving MOSFET gate drivers, with ADC monitoring thermistor feedback and supply voltage. Use Value: Dual TPM modules provide independent 8-bit PWM outputs; ACMP supports fast over-temperature shutdown independent of CPU state. |
Use Scenario: Portable blood glucose meter requiring precise analog measurement, button interface, and low-power display backlight control. IC Role / Device Role / Timing Role: Signal acquisition MCU interfacing electrochemical sensor via ADC, managing tactile buttons, and driving LED backlight via PWM. Use Value: Internal bandgap reference ensures stable ADC accuracy across battery discharge; ganged GPIO writes simplify multi-LED control sequences. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08SG8CFAE | 8 KB flash, 512 B RAM, same 16-TSSOP package and peripheral set; higher memory density but identical pinout and clock architecture | Preferred where firmware complexity requires >4 KB code space or future-proofing against feature expansion | Select when additional flash/RAM is needed without changing PCB layout or driver software |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+ core, 128 KB flash, 16 KB RAM, 48 MHz; different architecture, toolchain, and power profile | Suitable for applications scaling to USB, CAN, or advanced motor control requiring deterministic 32-bit performance | Choose for new designs targeting longer lifecycle, higher compute throughput, or ARM ecosystem compatibility |
Compared with MC9S08SG8CFAE, S9S08SG4E2CTJ offers lower cost and footprint for fixed-function control; versus S9KEAZ128AMLH, it delivers proven reliability and minimal power in resource-constrained embedded roles where 8-bit determinism suffices.
Availability
S9S08SG4E2CTJ is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart appliance control, and medical handheld devices requiring stable component supply across extended temperature ranges.
Supply support for S9S08SG4E2CTJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now headquartered in Eindhoven, Netherlands, with R&D and manufacturing across Asia, Europe, and the Americas.
The S9S08SG4E2CTJ belongs to the legacy HCS08 microcontroller family designed for cost-sensitive, low-power, high-reliability embedded control in automotive and industrial environments where deterministic real-time response and long-term supply stability are critical.
FAQ
What is the maximum operating frequency of the S9S08SG4E2CTJ CPU core?
The S9S08SG4E2CTJ features an HCS08 CPU core rated for up to 40 MHz operation at standard temperature ranges (-40°C to 105°C). At extended temperatures above 125°C, the maximum guaranteed CPU frequency is reduced to 36 MHz per the MC9S08SG4 data sheet Rev. 8 electrical specifications. This derating ensures timing margin and reliability under thermal stress, and applies specifically to the S9S08SG4E2CTJ variant.
Does the S9S08SG4E2CTJ support LIN communication natively?
Yes, the S9S08SG4E2CTJ supports LIN 2.0/2.1 communication through its SCI module, which includes dedicated hardware for LIN master extended break generation and LIN slave extended break detection. This enables direct integration into automotive sub-networks without external LIN transceivers for basic node functionality, and is explicitly documented in the MC9S08SG4 data sheet Rev. 8 Section 14.
Can the S9S08SG4E2CTJ operate in ultra-low-power modes with ADC active?
Yes, the S9S08SG4E2CTJ supports ADC operation in stop3 mode - the deepest low-power state where the CPU and most clocks are halted but selected peripherals remain functional. The 10-bit ADC can perform conversions and trigger interrupts while consuming microamp-level current, enabling battery-powered sensing applications with long operational life. This capability is confirmed in the MC9S08SG4 data sheet Rev. 8 Section 9.4.7.
What debug interface does the S9S08SG4E2CTJ use, and is external hardware required?
The S9S08SG4E2CTJ uses a single-wire background debug mode (BDM) interface accessible via the BKGD/MS pin. Debugging requires an external BDM pod (e.g., PE Micro Cyclone or NXP DEMO9S08SG8 board), but no dedicated JTAG header or complex cabling is needed. The on-chip debug module supports one hardware breakpoint and provides full in-circuit emulation, as specified in MC9S08SG4 data sheet Rev. 8 Section 17.
Is the S9S08SG4E2CTJ pin-compatible with other MC9S08SGx devices in the same package?
Yes, the S9S08SG4E2CTJ is pin-compatible with MC9S08SG8 variants in the 16-TSSOP package (e.g., MC9S08SG8CFAE), sharing identical pin assignments, electrical characteristics, and peripheral mapping. This allows drop-in replacement where flash/RAM requirements permit, and is verified in the MC9S08SG4/SG8 data sheet Rev. 8 Section 2.1 pin assignment tables.
S9S08SG4E2CTJ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 16
- Program Memory Size:
- 4KB (4K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256 x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08SG4E2CTJ FAQ
1.How can I place an order for S9S08SG4E2CTJ through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08SG4E2CTJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08SG4E2CTJ reliable?
The price and inventory of S9S08SG4E2CTJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG4E2CTJ is usually 5 days.
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S9S08SG4E2CTJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08SG4E2CTJ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08SG4E2CTJ?
For technical support, including S9S08SG4E2CTJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG4E2CTJ requirements.
6.How does Aetrix verify that S9S08SG4E2CTJ is sourced from the original manufacturer or authorized distributors?
All S9S08SG4E2CTJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG4E2CTJ meets industry standards.
7.What is the process for return or replacement of S9S08SG4E2CTJ?
All S9S08SG4E2CTJ units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG4E2CTJ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08SG4E2CTJ part is unused and in its original packaging.
Return procedure for S9S08SG4E2CTJ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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