NXP Semiconductors S9S08SG4E2CTJR
- Part No.:
- S9S08SG4E2CTJR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
S9S08SG4E2CTJR.pdf
- Description:
- IC MCU 8BIT 4KB FLASH 20TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S9S08SG4E2CTJR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 4 KB flash, 256 B RAM, and integrated peripherals including 10-bit ADC, analog comparator, SCI, SPI, I²C, TPM PWM timers, and RTC. It operates at up to 40 MHz CPU frequency, supports stop3 low-power mode, and targets automotive body electronics and industrial control applications requiring AEC-Q100 qualification and extended temperature operation.
For engineers reviewing the S9S08SG4E2CTJR datasheet, S9S08SG4E2CTJR pinout, S9S08SG4E2CTJR application, or S9S08SG4E2CTJR equivalent, key selection criteria include its 16-pin TSSOP package, -40°C to 125°C operating range, single-wire background debug interface, and support for LIN-compliant SCI with extended break generation - critical for cost-sensitive embedded control nodes.
Technical Context
The S9S08SG4E2CTJR implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources and two very low-power stop modes. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference, enabling ±1.5% bus frequency accuracy from –40°C to 125°C.
Peripherals include a 12-channel 10-bit ADC with 2.5 µs conversion time and temperature sensor, dual 2-channel TPM modules supporting edge- or center-aligned PWM, and real-time counter (RTC) with free-running 1 kHz on-chip oscillator for cyclic wake-up in all power modes - all functional in stop3 mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit CPU with BGND instruction; executes HC08 ISA at up to 40 MHz bus speed |
| Flash Memory | 4 KB on-chip flash with read/program/erase over full voltage/temperature range; block protection enabled |
| RAM | 256 bytes of on-chip RAM; retains data in wait and stop3 modes |
| ADC | 12-channel, 10-bit resolution, 2.5 µs conversion time; includes internal bandgap reference and temperature sensor channel |
| Operating Temp | –40°C to +125°C; qualified per AEC-Q100 Grade 2 for automotive use |
| Package | 16-pin TSSOP (JEDEC MO-153); lead-free and RoHS compliant |
| Debug Interface | Single-wire background debug mode (BDM); supports one hardware breakpoint and on-chip ICE with 8-deep FIFO |
Pinout & Package
16-pin Thin Shrink Small Outline Package (TSSOP), 4.4 mm × 5.0 mm body, 0.65 mm pitch, exposed pad not present. Pinout validated per MC9S08SG4 Data Sheet Rev. 8, Section 2.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Supply voltage | Primary 2.7–5.5 V digital/analog supply; decoupling required per Section 2.2.1 |
| VSS | Ground | Digital ground reference; must be connected to system GND plane |
| PTA0/AD0/TPM1CH0 | Multi-function I/O | Configurable as GPIO, ADC input channel 0, or TPM1 channel 0 capture/compare/PWM output |
| PTA1/AD1/TPM1CH1 | Multi-function I/O | Configurable as GPIO, ADC input channel 1, or TPM1 channel 1 capture/compare/PWM output |
| PTA2/AD2/TPM2CH0 | Multi-function I/O | Configurable as GPIO, ADC input channel 2, or TPM2 channel 0 capture/compare/PWM output |
| PTA3/AD3/TPM2CH1 | Multi-function I/O | Configurable as GPIO, ADC input channel 3, or TPM2 channel 1 capture/compare/PWM output |
| PTB0/AD4/SCI1TX | Multi-function I/O | Configurable as GPIO, ADC input channel 4, or SCI1 transmit output |
| PTB1/AD5/SCI1RX | Multi-function I/O | Configurable as GPIO, ADC input channel 5, or SCI1 receive input with LIN wake capability |
| PTB2/AD6/SPI1MOSI | Multi-function I/O | Configurable as GPIO, ADC input channel 6, or SPI1 master-out/slave-in data line |
| PTB3/AD7/SPI1MISO | Multi-function I/O | Configurable as GPIO, ADC input channel 7, or SPI1 master-in/slave-out data line |
| PTB4/AD8/IIC1SDA | Multi-function I/O | Configurable as GPIO, ADC input channel 8, or I²C1 data line with open-drain control |
| PTB5/AD9/IIC1SCL | Multi-function I/O | Configurable as GPIO, ADC input channel 9, or I²C1 clock line with open-drain control |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external reset signal or watchdog timeout |
| BKGD/MS | Background debug / mode select | Single-wire BDM communication pin; also selects active background mode during reset |
| XTAL/EXTAL | Crystal/resonator connection | Connects to 31.25 kHz–16 MHz crystal or ceramic resonator for XOSC clock source |
| VDDAD/VSSAD | Analog supply/ground | Separate analog power and ground pins; must be decoupled independently from digital VDD/VSS |
Key Features
| Feature | Design Value |
|---|---|
| Stop3 Low-Power Mode | Entire MCU halts except RTC, ACMP, and ADC - enables sub-1 µA current draw while retaining wake-on-event capability |
| LIN-Compliant SCI | Hardware support for LIN 2.0/2.1 extended break generation and detection; eliminates software timing overhead for automotive network nodes |
| On-Chip RTC with 1 kHz Oscillator | Free-running real-time counter powered by dedicated low-power oscillator; provides precise time-of-day/calendar without external crystal |
| Integrated Temperature Sensor | Factory-calibrated on-die sensor connected to ADC channel; delivers ±3°C accuracy across –40°C to 125°C for thermal monitoring |
| Ganged Output Control | Single write to PTB[5:2] or PTC[3:0] simultaneously updates four GPIOs - simplifies LED bank or relay driver control logic |
Applications
| Automotive Door Module | Industrial Motor Controller |
|---|---|
|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in passenger vehicles. IC Role / Device Role / Timing Role: Main system controller executing LIN slave protocol, reading switch inputs, driving relays/LEDs, and monitoring motor current via ADC. Use Value: Stop3 mode enables <1 µA sleep current during vehicle off-state; integrated LIN SCI reduces external transceiver count and PCB area. |
Use Scenario: Closed-loop speed and direction control of 24 V DC brush motors in HVAC actuators and valve positioners. IC Role / Device Role / Timing Role: Real-time PWM generator (via TPM modules), current sensing interface (ADC), and fault monitor (ACMP + LVD). Use Value: Edge-aligned and center-aligned PWM outputs enable precise torque control; on-chip RTC schedules maintenance alerts without external timer IC. |
| Smart Thermostat Node | Medical Infusion Pump Monitor |
|
Use Scenario: Battery-powered residential thermostat with ambient temperature, humidity (via I²C sensor), and display control. IC Role / Device Role / Timing Role: System manager handling sensor polling, LCD segment drive, button debounce, and scheduled wake-ups via RTC. Use Value: Integrated temperature sensor eliminates external thermistor; low-voltage detection triggers graceful shutdown before battery depletion. |
Use Scenario: Safety-critical monitoring unit tracking motor stall, occlusion pressure, and battery status in portable infusion pumps. IC Role / Device Role / Timing Role: Fault-detection co-processor validating primary controller outputs using independent ADC, ACMP, and COP watchdog. Use Value: Dual-clock domain (bus clock + 1 kHz RTC) ensures deterministic response to pressure spikes; flash block protection prevents accidental firmware overwrite. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S08SG8E2CTJR | 8 KB flash, 512 B RAM, identical peripheral set and pinout; same 16-TSSOP package and temperature grade | Higher memory headroom for bootloader + application; suitable where future firmware expansion is anticipated | Select when >4 KB code space is required without changing PCB layout or toolchain |
| MKE02Z64VQH2 | ARM Cortex-M0+ core, 64 KB flash, 8 KB RAM, 48 MHz max; different architecture, no HCS08 compatibility | Requires full firmware rewrite; offers higher performance, USB, and enhanced analog features but larger footprint (32-QFN) | Choose for new designs needing scalability beyond 8-bit constraints; not drop-in compatible |
Compared with S9S08SG4E2CTJR, the S9S08SG8E2CTJR provides double flash/RAM in identical packaging for seamless upgrade, while MKE02Z64VQH2 offers modern ARM architecture and expanded peripherals at the cost of complete software rework and board redesign.
Availability
S9S08SG4E2CTJR is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, smart building sensors, and medical device monitoring requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S9S08SG4E2CTJR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now headquartered in Eindhoven, Netherlands, delivering secure connectivity solutions for automotive, industrial, and IoT markets.
The S9S08SG4E2CTJR belongs to the legacy HCS08 microcontroller family designed specifically for cost-sensitive, high-reliability automotive and industrial control applications requiring AEC-Q100 qualification, low-power operation, and robust on-chip peripherals.
FAQ
What is the maximum operating frequency of the S9S08SG4E2CTJR CPU?
The S9S08SG4E2CTJR features an HCS08 CPU core with a maximum bus frequency of 40 MHz at temperatures up to 125°C. At junction temperatures above 125°C, the maximum supported bus frequency is reduced to 36 MHz to maintain timing integrity and reliability under extreme thermal conditions. This specification is verified in the MC9S08SG4 Data Sheet Rev. 8, Section 3.2.
Does the S9S08SG4E2CTJR support LIN communication natively?
Yes, the S9S08SG4E2CTJR supports LIN 2.0/2.1 communication natively through its SCI module, which includes hardware-assisted extended break generation (for master) and extended break detection (for slave). This eliminates software-based timing loops and ensures robust frame synchronization in automotive networks. The feature is documented in Section 14.3.2 of the MC9S08SG4 Data Sheet Rev. 8.
What power-saving modes are available on the S9S08SG4E2CTJR?
The S9S08SG4E2CTJR supports three low-power modes: wait mode (reduced power), stop2 (very low power), and stop3 (ultra-low power). In stop3 mode, only the RTC, ACMP, and ADC remain active - enabling wake-up from external pins, comparator events, or RTC overflow while drawing less than 1 µA. All modes are detailed in Chapter 3 of the MC9S08SG4 Data Sheet Rev. 8.
Is the S9S08SG4E2CTJR qualified for automotive applications?
Yes, the S9S08SG4E2CTJR is AEC-Q100 qualified for Grade 2 (–40°C to +125°C ambient), making it suitable for under-hood and cabin automotive applications such as door modules, seat controls, and lighting systems. Its flash memory, ADC, and clock system are characterized across this full temperature range, and the device meets automotive reliability and stress test requirements per the qualification report.
How many ADC channels does the S9S08SG4E2CTJR have, and what is their resolution?
The S9S08SG4E2CTJR integrates a 12-channel, 10-bit successive-approximation ADC with 2.5 µs conversion time, internal bandgap reference, and dedicated temperature sensor channel. All 12 inputs are multiplexed onto shared analog pins (PTA0–PTA3, PTB0–PTB5, PTC0–PTC3), and the module remains fully operational in stop3 mode. Full specifications appear in Section 9.1 of the MC9S08SG4 Data Sheet Rev. 8.
S9S08SG4E2CTJR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 16
- Program Memory Size:
- 4KB (4K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256 x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08SG4E2CTJR FAQ
1.How can I place an order for S9S08SG4E2CTJR through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08SG4E2CTJR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08SG4E2CTJR reliable?
The price and inventory of S9S08SG4E2CTJR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG4E2CTJR is usually 5 days.
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S9S08SG4E2CTJR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08SG4E2CTJR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08SG4E2CTJR?
For technical support, including S9S08SG4E2CTJR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG4E2CTJR requirements.
6.How does Aetrix verify that S9S08SG4E2CTJR is sourced from the original manufacturer or authorized distributors?
All S9S08SG4E2CTJR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG4E2CTJR meets industry standards.
7.What is the process for return or replacement of S9S08SG4E2CTJR?
All S9S08SG4E2CTJR units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG4E2CTJR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08SG4E2CTJR part is unused and in its original packaging.
Return procedure for S9S08SG4E2CTJR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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