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NXP Semiconductors S9S08SG4E2MSC

Part No.:
S9S08SG4E2MSC
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixS9S08SG4E2MSC.pdf
Description:
IC MCU 8BIT 4KB FLASH 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,355

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Product details

Overview

S9S08SG4E2MSC from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 4 KB flash, 256 B RAM, and integrated ADC, ACMP, SCI, SPI, I²C, TPM, RTC, and background debug interface. It operates at up to 40 MHz CPU frequency, supports stop3 low-power mode, and targets automotive body electronics and industrial control applications requiring extended temperature operation.

For engineers reviewing the S9S08SG4E2MSC datasheet, S9S08SG4E2MSC pinout, S9S08SG4E2MSC application, or S9S08SG4E2MSC equivalent, key selection criteria include its 16-pin TSSOP package, -40°C to 125°C operating range, 10-bit 12-channel ADC with temperature sensor, single-wire BDM debug support, and real-time counter with on-chip 1 kHz oscillator for wake-up in all power modes.

Technical Context

The S9S08SG4E2MSC implements the HCS08 CPU core with HC08 instruction set extension (including BGND), supporting up to 32 interrupt/reset sources and a 3-stage pipeline. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference (±1.5% deviation over –40°C to 125°C) to generate bus frequencies from 2 MHz to 20 MHz.

Peripherals include a 10-bit ADC with 2.5 µs conversion time and automatic compare, dual analog comparators with bandgap reference option and TPM routing capability, full-duplex SCI with LIN break generation/detection, and two 2-channel TPM modules supporting input capture, output compare, and edge-/center-aligned PWM - all functional in stop3 mode.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 8-bit core with 3-stage pipeline and BGND instruction for debug entry
Max CPU Frequency40 MHz at ≤125°C; 36 MHz above 125°C - defines maximum instruction throughput and real-time response
Flash Memory4 KB on-chip flash with read/program/erase over full voltage/temperature range and block protection
RAM256 bytes of random-access memory for variables, stack, and temporary data storage
ADC12-channel, 10-bit resolution, 2.5 µs conversion time, internal temperature sensor, and bandgap reference channel
Power ModesRun, Wait, Stop2, and Stop3 - Stop3 enables ultra-low-power operation with RTC and ACMP active
Debug InterfaceSingle-wire background debug mode (BDM) with one hardware breakpoint and on-chip ICE module

Pinout & Package

Package: 16-pin Thin Shrink Small Outline Package (TSSOP), RoHS-compliant, 4.4 mm × 5.0 mm body, 0.65 mm pitch.

Pin/TerminalCircuit RoleDesign Meaning
VDDSupply voltageMain digital supply (2.7–5.5 V); powers CPU, peripherals, and I/O
VSSGroundDigital ground reference for all internal logic and I/O buffers
RESETReset inputActive-low asynchronous reset; initiates cold start or recovery from fault condition
BKGD/MSBackground debug / Mode selectSingle-wire BDM communication and programming interface; also selects boot mode
PTA0–PTA1GPIO / SCI RX/TXProgrammable I/O pins; default as full-duplex SCI interface for serial communication
PTB0–PTB7GPIO / TPM / ADC / SPIMulti-function port with timer channels, ADC inputs, and SPI signals; supports ganged output
PTC0–PTC3GPIO / I²C / ACMPConfigurable I/O; default I²C SDA/SCL and analog comparator inputs with internal reference option

Key Features

FeatureDesign Value
Stop3 Low-Power ModeEnables RTC, ACMP, and ADC to remain active while CPU and most peripherals halt - extends battery life in sensing applications
On-Chip 1 kHz RTC OscillatorProvides precise cyclic wake-up timing without external crystal - reduces BOM cost and board space
Integrated Temperature SensorDelivers calibrated die temperature readings via ADC channel - eliminates need for external thermal monitoring IC
LIN-Compatible SCISupports master extended break generation and slave extended break detection - enables direct integration into automotive LIN networks
Flash Block ProtectionPrevents unauthorized read/write/erase of protected sectors - secures firmware and calibration data in field-deployed systems

Applications

Automotive Body Control ModuleIndustrial Sensor Node

Use Scenario: Centralized control of door locks, window lifts, and interior lighting in 12 V vehicle electrical architecture.

IC Role / Device Role / Timing Role: Main system controller executing real-time state machines, managing LIN communication with slave nodes, and monitoring switch inputs via GPIO and ACMP.

Use Value: Integrated LIN-capable SCI, 16 GPIOs with configurable pull-ups/slew rate, and stop3 mode enable reliable low-power standby with fast wake-on-event response.

Use Scenario: Battery-powered environmental monitor measuring temperature, humidity (via analog signal conditioning), and ambient light.

IC Role / Device Role / Timing Role: Data acquisition hub performing ADC sampling, local threshold comparison via ACMP, and scheduled wireless transmission using RTC-triggered wake-up.

Use Value: On-chip temperature sensor, 10-bit ADC with internal bandgap reference, and RTC with free-running 1 kHz oscillator eliminate external components and reduce sleep current to sub-µA levels.

Home Appliance Motor ControlMedical Diagnostic Handheld

Use Scenario: Fan speed regulation and thermal protection in HVAC blower units using PWM-driven DC motors.

IC Role / Device Role / Timing Role: PWM generator and thermal supervisor - TPM channels produce center-aligned PWM outputs; ADC monitors motor winding temperature and supply voltage.

Use Value: Two independent TPM modules with buffered edge- and center-aligned PWM, plus ADC with automatic compare, enable closed-loop motor control without external timers or comparators.

Use Scenario: Portable blood glucose meter requiring accurate analog measurement, button interface, and low-power display backlight control.

IC Role / Device Role / Timing Role: Signal conditioner and system manager - ADC digitizes electrochemical sensor output; GPIO drives LED backlight; RTC manages timed test sequences.

Use Value: 10-bit ADC with 2.5 µs conversion and internal reference ensures repeatable sensor accuracy; stop3 mode with RTC wake-up extends single-battery life beyond 12 months.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08SG8CTJ8 KB flash, 512 B RAM, identical peripheral set and pinout in 16-TSSOP packageHigher code density requirement; same footprint upgrade pathSelect when firmware size exceeds 4 KB or future scalability is needed without PCB change
S9S08SG16E2MTJ16 KB flash, 1 KB RAM, same HCS08 core and peripheral complement in 16-TSSOPComplex control algorithms or protocol stacks requiring larger memoryChoose for designs anticipating feature expansion or multi-protocol support (e.g., LIN + I²C + SPI simultaneously)

Compared with MC9S08SG8CTJ and S9S08SG16E2MTJ, the S9S08SG4E2MSC provides optimal balance of cost, power efficiency, and peripheral functionality for resource-constrained embedded control - especially where <4 KB flash and sub-1 µA stop3 current are design-critical.

Availability

S9S08SG4E2MSC is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, home appliance motor control, and portable medical diagnostics requiring stable component supply across extended temperature ranges.

Supply support for S9S08SG4E2MSC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The S9S08SG4E2MSC belongs to the HCS08 SG-series microcontrollers designed for cost-sensitive, low-power embedded control in harsh environments - emphasizing robustness, integrated analog peripherals, and debug accessibility for rapid development.

FAQ

What is the maximum operating temperature specification for the S9S08SG4E2MSC?

The S9S08SG4E2MSC is rated for operation from –40°C to +125°C. This extended temperature range is validated per Freescale's MC9S08SG8/SG4 data sheet Rev. 8 (January 2014), and applies specifically to the 16-TSSOP package variant. High-temperature devices up to 150°C are available only in selected SG8 variants, not the S9S08SG4E2MSC.

Does the S9S08SG4E2MSC support LIN bus communication natively?

Yes, the S9S08SG4E2MSC supports LIN 2.x communication through its SCI module, which includes dedicated hardware features: LIN master extended break generation and LIN slave extended break detection. These capabilities are documented in Chapter 14 of the MC9S08SG8/SG4 data sheet and require no external transceiver for basic node implementation - though a LIN physical layer transceiver is still required for bus compliance.

How much flash memory does the S9S08SG4E2MSC contain, and is it reprogrammable in-system?

The S9S08SG4E2MSC contains 4 KB of on-chip flash memory that supports in-system programming (ISP) and in-application programming (IAP) over the full operating voltage (2.7–5.5 V) and temperature range (–40°C to +125°C). Flash erase and program operations are controlled via the FCMD register and supported by the FSTAT status register, enabling field firmware updates without removing the S9S08SG4E2MSC from the target board.

Can the S9S08SG4E2MSC operate in ultra-low-power mode while maintaining real-time wake-up capability?

Yes, the S9S08SG4E2MSC supports Stop3 mode - its deepest low-power state - where the CPU, flash, and most peripherals are disabled, yet the real-time counter (RTC), analog comparators (ACMP), and ADC remain operational using the on-chip 1 kHz low-power oscillator. This allows deterministic wake-up intervals or event-triggered resume without external components, achieving sub-microamp quiescent current.

What debug interface does the S9S08SG4E2MSC use, and what hardware is required?

The S9S08SG4E2MSC uses a single-wire background debug mode (BDM) interface accessible via the BKGD/MS pin. Debugging requires an NXP-compatible BDM pod (e.g., DEMO9S08SG8 evaluation board or standalone P&E Micro Cyclone PRO), which connects to a host PC via USB or RS-232. No JTAG header or additional pins are needed - the interface shares the BKGD/MS signal with boot-mode selection functionality.

S9S08SG4E2MSC Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Series:
S08
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
4
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256 x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08SG4E2MSC FAQ

1.How can I place an order for S9S08SG4E2MSC through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S08SG4E2MSC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S08SG4E2MSC reliable?

The price and inventory of S9S08SG4E2MSC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG4E2MSC is usually 5 days.

3.What payment methods are accepted for S9S08SG4E2MSC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08SG4E2MSC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S9S08SG4E2MSC?

S9S08SG4E2MSC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S08SG4E2MSC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S08SG4E2MSC?

For technical support, including S9S08SG4E2MSC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG4E2MSC requirements.

6.How does Aetrix verify that S9S08SG4E2MSC is sourced from the original manufacturer or authorized distributors?

All S9S08SG4E2MSC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG4E2MSC meets industry standards.

7.What is the process for return or replacement of S9S08SG4E2MSC?

All S9S08SG4E2MSC units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG4E2MSC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08SG4E2MSC part is unused and in its original packaging.

Return procedure for S9S08SG4E2MSC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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