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NXP Semiconductors S9S08SG4E2MTG

Part No.:
S9S08SG4E2MTG
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
16-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixS9S08SG4E2MTG.pdf
Description:
IC MCU 8BIT 4KB FLASH 16TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,223

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Product details

Overview

S9S08SG4E2MTG from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 4 KB flash, 256 B RAM, and integrated ADC, ACMP, SCI, SPI, I²C, TPM, RTC, and background debug interface. It operates at up to 40 MHz CPU frequency, supports stop3 low-power mode, and targets automotive body electronics and industrial control applications requiring extended temperature operation.

For engineers reviewing the S9S08SG4E2MTG datasheet, S9S08SG4E2MTG pinout, S9S08SG4E2MTG application, or S9S08SG4E2MTG equivalent, key selection criteria include its 16-TSSOP package, -40°C to 125°C operating range, 10-bit 12-channel ADC with temperature sensor, internal clock source with ±1.5% FLL accuracy over temperature, and single-wire BDM debug support.

Technical Context

The S9S08SG4E2MTG implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) trimmed for ±1.5% deviation from –40°C to 125°C, enabling bus frequencies from 2 MHz to 20 MHz without external crystal.

Peripherals include a 10-bit ADC with 2.5 µs conversion time and automatic compare, a 5-V analog comparator with edge-selectable interrupt and bandgap reference, and two 2-channel TPM modules supporting input capture, output compare, and PWM. All operate in stop3 mode, enabling ultra-low-power wake-up capability.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 8-bit core with BGND instruction and 36–40 MHz operation depending on temperature grade
Flash Memory4 KB on-chip flash with read/program/erase over full voltage and temperature range
RAM256 bytes of on-chip RAM accessible in all operating modes
ADC12-channel, 10-bit resolution, 2.5 µs conversion time, includes internal temperature sensor and bandgap reference
Operating Temp-40°C to +125°C ambient; qualified for automotive and industrial environments
Package16-pin TSSOP (lead-free, RoHS-compliant); no high-temp variant in 20-TSSOP or 8-SOIC
Debug InterfaceSingle-wire background debug (BDM) with one hardware breakpoint and on-chip ICE module

Pinout & Package

Package: 16-pin Thin Shrink Small Outline Package (TSSOP), 4.4 mm × 5.0 mm body, 0.65 mm pitch, lead-free and RoHS compliant.

Pin/TerminalCircuit RoleDesign Meaning
VDDSupply voltageMain digital supply (2.7–5.5 V); powers CPU, peripherals, and I/O
VSSGroundDigital ground reference for all internal logic and I/O buffers
PTA0/BKGDBackground debug / GPIOSingle-wire BDM communication and general-purpose I/O with interrupt capability
PTA1/RESETReset input / GPIOActive-low reset with internal pull-up; also functions as GPIO with configurable polarity
PTB0–PTB7General-purpose I/OEight bidirectional pins with hysteresis, configurable pull-up, slew rate, and drive strength
PTC0–PTC3General-purpose I/OFour additional GPIOs; PTC[3:0] support ganged output for simultaneous state change
XOSC/XFCCrystal oscillator input/outputConnects to 31.25 kHz–16 MHz crystal or ceramic resonator for precision timing
VDDAD/VSSADAnalog power/groundSeparate analog supply and ground pins for ADC and ACMP to reduce noise coupling

Key Features

FeatureDesign Value
Stop3 ultra-low-power modeEnables real-time interrupt wake-up using internal 1-kHz oscillator - no external components required
Integrated temperature sensorOn-die sensor calibrated against internal bandgap reference, usable via ADC channel for thermal monitoring
Flexible clock architectureICS with FLL supports bus frequencies from 2–20 MHz using internal or external reference; eliminates need for multiple crystals
Peripheral operation in stop3ADC, ACMP, RTC, and TPM retain functionality during stop3, enabling event-triggered wake-up and measurement
Hardware security featuresFLASH block protection, illegal opcode/address detection, and COP watchdog with dedicated 1-kHz clock source

Applications

Automotive Body Control ModuleIndustrial Sensor Node

Use Scenario: Centralized control of door locks, window lifts, and interior lighting in passenger vehicles.

IC Role / Device Role / Timing Role: Main system controller executing real-time logic, managing LIN/SCI communication, and sampling analog sensors (e.g., ambient light, temperature).

Use Value: S9S08SG4E2MTG's stop3 mode enables periodic wake-up to monitor switch inputs while consuming <1 µA, extending battery life in always-on modules.

Use Scenario: Wireless-capable environmental sensor node measuring temperature, humidity, and voltage in factory automation systems.

IC Role / Device Role / Timing Role: Data acquisition and preprocessing unit interfacing with analog sensors, driving SPI-connected transceivers, and scheduling transmissions via RTC.

Use Value: Integrated 10-bit ADC with internal temperature sensor and bandgap reference allows accurate calibration without external components, reducing BOM cost and board space.

Smart Appliance Control UnitLow-Power HVAC Thermostat

Use Scenario: Microcontroller in washing machine control panel handling user interface, motor sequencing, and safety interlocks.

IC Role / Device Role / Timing Role: Real-time executor of state machines, PWM generation for motor drivers (via TPM), and fault detection using ACMP and LVD.

Use Value: Ganged GPIO output on PTC[3:0] allows synchronized activation of multiple relays or LEDs with a single register write, simplifying firmware logic.

Use Scenario: Battery-powered residential thermostat requiring multi-year operation on AA cells.

IC Role / Device Role / Timing Role: System supervisor managing sensor reads, display updates, and wireless wake-up events using RTC and stop3 mode.

Use Value: Internal 1-kHz low-power oscillator drives RTC and cyclic wake-up independently of main clock, eliminating external timing components and minimizing quiescent current.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08SG8CDT8 KB flash, same 16-TSSOP package, identical peripheral set and pinoutHigher memory headroom for larger firmware or bootloader storageSelect when >4 KB code space is required; otherwise S9S08SG4E2MTG offers optimal cost/performance balance
S9S08SG32E2MTJ32 KB flash, 2 KB RAM, same HCS08 core and peripheral IP but in 20-TSSOP packageSupports more complex control algorithms and additional communication stacks (e.g., LIN + I²C + SPI simultaneously)Choose for scalability path; note 20-TSSOP requires PCB redesign versus 16-TSSOP of S9S08SG4E2MTG

Compared with MC9S08SG8CDT and S9S08SG32E2MTJ, the S9S08SG4E2MTG delivers the minimal viable feature set for cost-sensitive, thermally demanding embedded control - retaining full peripheral compatibility and stop3 operation while reducing flash footprint and package size.

Availability

S9S08SG4E2MTG is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart appliance control units, and low-power HVAC thermostats requiring stable component supply across extended temperature ranges.

Supply support for S9S08SG4E2MTG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The S9S08SG4E2MTG belongs to the HCS08 SG-series microcontrollers, designed specifically for cost-optimized, thermally robust embedded control in automotive and industrial environments where reliability under extended temperature and low-power operation are critical.

FAQ

What is the maximum operating frequency of the S9S08SG4E2MTG CPU core?

The S9S08SG4E2MTG CPU core operates at up to 40 MHz at temperatures ≤125°C. At higher ambient temperatures (up to 125°C), the maximum guaranteed frequency is 36 MHz per the device's electrical specifications. This derating ensures stable execution under thermal stress without requiring external clock adjustment - the internal ICS automatically maintains bus timing within specification.

Does the S9S08SG4E2MTG support debugging in-circuit without additional hardware?

Yes, the S9S08SG4E2MTG integrates a single-wire background debug (BDM) interface that enables full in-circuit debugging using only the BKGD pin and ground. No external JTAG adapter or debug probe is required - standard BDM tools like P&E Multilink or OpenSDA-based debuggers connect directly. The S9S08SG4E2MTG also includes an on-chip ICE module with two comparators and eight-deep FIFO for trace capture.

Can the S9S08SG4E2MTG ADC operate while the MCU is in stop3 mode?

Yes, the S9S08SG4E2MTG ADC remains fully functional in stop3 mode. It supports hardware-triggered conversions using the real-time counter (RTC) or external events, and its automatic compare function can generate interrupts to wake the CPU. This capability allows precise, low-power sensor sampling - for example, reading the integrated temperature sensor every 500 ms without exiting stop3.

What is the purpose of the separate VDDAD and VSSAD pins on the S9S08SG4E2MTG?

The S9S08SG4E2MTG provides dedicated analog supply (VDDAD) and ground (VSSAD) pins to isolate noise-sensitive analog circuitry - including the 10-bit ADC and 5-V analog comparator - from digital switching noise. Routing these pins to a clean analog power domain improves measurement accuracy and reduces quantization error, especially critical when using the internal temperature sensor or bandgap reference channel.

Is the S9S08SG4E2MTG pin-compatible with other members of the HCS08 SG-series?

The S9S08SG4E2MTG in 16-TSSOP is pin-compatible with the MC9S08SG8CDT (8 KB flash) and MC9S08SG16CDT (16 KB flash) in the same package. However, it is not pin-compatible with 20-TSSOP variants like S9S08SG32E2MTJ. Pin compatibility is limited to devices sharing identical pin count, physical layout, and signal mapping - verified in Section 2.1 of the MC9S08SG8 Rev. 8 datasheet covering the SG4/SG8/SG16 family.

S9S08SG4E2MTG Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
16-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
12
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256 x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08SG4E2MTG FAQ

1.How can I place an order for S9S08SG4E2MTG through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S08SG4E2MTG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S08SG4E2MTG reliable?

The price and inventory of S9S08SG4E2MTG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG4E2MTG is usually 5 days.

3.What payment methods are accepted for S9S08SG4E2MTG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08SG4E2MTG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S9S08SG4E2MTG?

S9S08SG4E2MTG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S08SG4E2MTG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S08SG4E2MTG?

For technical support, including S9S08SG4E2MTG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG4E2MTG requirements.

6.How does Aetrix verify that S9S08SG4E2MTG is sourced from the original manufacturer or authorized distributors?

All S9S08SG4E2MTG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG4E2MTG meets industry standards.

7.What is the process for return or replacement of S9S08SG4E2MTG?

All S9S08SG4E2MTG units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG4E2MTG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08SG4E2MTG part is unused and in its original packaging.

Return procedure for S9S08SG4E2MTG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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