NXP Semiconductors S9S08SG4E2MTJ
- Part No.:
- S9S08SG4E2MTJ
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
S9S08SG4E2MTJ.pdf
- Description:
- IC MCU 8BIT 4KB FLASH 20TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S9S08SG4E2MTJ from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 4 KB flash, 256 B RAM, and integrated ADC, ACMP, SCI, SPI, I²C, TPM, and RTC peripherals. It operates at up to 40 MHz CPU frequency, supports stop3 low-power mode, and features internal clock source with ±1.5% FLL accuracy over –40°C to 125°C. Used in automotive body electronics, industrial sensor nodes, and smart HVAC controls.
For engineers reviewing the S9S08SG4E2MTJ datasheet, S9S08SG4E2MTJ pinout, S9S08SG4E2MTJ application, or S9S08SG4E2MTJ equivalent, key selection criteria include its 16-pin TSSOP package, 2.7–5.5 V supply range, on-chip temperature sensor, single-wire background debug interface, and support for LIN-compliant SCI wake-up and break detection.
Technical Context
The S9S08SG4E2MTJ implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) trimmed for ±1.5% deviation across –40°C to 125°C, enabling stable bus frequencies from 2 MHz to 20 MHz without external crystal.
Peripherals include a 12-channel 10-bit ADC with 2.5 µs conversion time and automatic compare, a 5-V analog comparator with bandgap reference option and TPM routing capability, and dual TPM modules offering input capture, output compare, and edge- or center-aligned PWM - all functional in stop3 mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core with BGND instruction and 36–40 MHz operation depending on temperature grade |
| Flash Memory | 4 KB user-programmable flash with block protection and read/program/erase over full voltage/temperature range |
| RAM | 256 bytes of on-chip RAM accessible in all operating modes including stop3 |
| ADC | 12-channel, 10-bit resolution, 2.5 µs conversion time, internal bandgap reference, and temperature sensor channel |
| Power Modes | Two very low power stop modes (stop2, stop3), reduced power wait mode, and real-time interrupt wakeup in all modes |
| Debug Interface | Single-wire background debug (BDM) with one hardware breakpoint and on-chip ICE module with eight-deep FIFO |
| Supply Voltage | 2.7 V to 5.5 V - enables direct interface with 3.3 V and 5 V logic systems without level translation |
Pinout & Package
Package: 16-pin TSSOP (JEDEC MO-153, 4.4 mm × 5.0 mm), RoHS-compliant, rated for operation up to 125°C ambient (not high-temp 150°C variant).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Supply voltage (digital) | Main power input; must be decoupled locally for noise immunity in mixed-signal operation |
| VSS | Digital ground | Reference return path for digital I/O and core logic; separate from analog ground in layout-critical designs |
| PTA0/AD0/TPM1CH0 | Multi-function I/O | Configurable as GPIO, ADC channel 0 input, or TPM1 channel 0 input capture/output compare |
| PTA1/AD1/TPM1CH1 | Multi-function I/O | Supports ADC channel 1 or TPM1 channel 1 - enables dual-edge timing or synchronized sampling |
| PTA2/AD2/TPM2CH0 | Multi-function I/O | Enables independent timer control on TPM2 while using ADC on same port |
| PTA3/AD3/TPM2CH1 | Multi-function I/O | Allows PWM generation and analog sensing on shared pins without external muxing |
| PTB0/AD4/SCI1TX | Multi-function I/O | SCI transmit output with LIN-compliant break generation capability for automotive network integration |
| PTB1/AD5/SCI1RX | Multi-function I/O | SCI receive input with LIN slave extended break detection and active-edge wakeup |
| PTB2/AD6/SPI_MOSI | Multi-function I/O | Serial peripheral interface master-out/slave-in line; shares pin with ADC channel 6 for compact sensor interface |
| PTB3/AD7/SPI_MISO | Multi-function I/O | SPI master-in/slave-out line; supports daisy-chain configurations when used with TPM or ADC |
| PTB4/AD8/SPI_SCK | Multi-function I/O | SPI clock line; configurable for master or slave mode - critical for synchronous sensor data acquisition |
| PTB5/AD9/IIC_SCL | Multi-function I/O | I²C clock line with open-drain capability and internal pull-up option; supports multi-master bus arbitration |
| PTB6/AD10/IIC_SDA | Multi-function I/O | I²C data line with broadcast mode and 10-bit addressing support for scalable peripheral networks |
| RESET | Active-low reset input | Accepts external reset pulse or internal COP/LVD reset assertion; debounced internally for robust startup |
| BKGD/MS | Background debug / mode select | Single-wire BDM communication pin; also selects boot mode during reset - requires no dedicated debug header |
| VDDAD/VREFH | Analog supply / reference high | Separate analog power domain; connects to internal bandgap reference or external precision reference for ADC accuracy |
Key Features
| Feature | Design Value |
|---|---|
| Stop3 ultra-low-power mode | Enables real-time interrupt wakeup with <1 µA current draw - ideal for battery-powered sensor endpoints requiring periodic sampling |
| On-chip temperature sensor | Integrated into ADC subsystem; delivers calibrated readings without external components, reducing BOM count in thermal monitoring applications |
| LIN-compliant SCI module | Generates and detects extended breaks per LIN 2.x spec - eliminates need for external LIN transceiver in cost-sensitive automotive sub-nodes |
| Internal clock source (ICS) | FLL with factory-trimmed internal reference achieves ±1.5% accuracy over –40°C to 125°C - removes crystal requirement for space-constrained designs |
| Ganged GPIO write | Single register write to PTB[5:2] or PTC[3:0] changes state of four pins simultaneously - simplifies LED array or relay bank control firmware |
| Flash block protection | Hardware-enforced write/erase lock on user flash blocks prevents accidental corruption during field firmware updates or brownout conditions |
Applications
| Automotive Door Module | Industrial Temperature Monitor |
|---|---|
Use Scenario: Centralized control of window lift, mirror fold, and interior lighting in entry-level vehicle door assemblies. IC Role / Device Role / Timing Role: Main system controller executing LIN slave protocol, managing PWM-driven motor drivers, and reading capacitive touch inputs. Use Value: Integrated LIN SCI, stop3 wakeup, and ganged GPIO reduce component count and PCB area versus discrete MCU + transceiver solutions. |
Use Scenario: Standalone DIN-rail mounted sensor node measuring ambient and process temperature in HVAC ducts or PLC cabinets. IC Role / Device Role / Timing Role: Data acquisition engine performing periodic ADC sampling, local threshold comparison via ACMP, and RS-485 communication via SCI. Use Value: On-chip temperature sensor and 10-bit ADC eliminate external sensing ICs; stop3 mode extends battery life to >5 years in wireless variants. |
| Smart Appliance Control Board | Medical Infusion Pump Interface |
Use Scenario: User interface and motor sequencing logic in residential washing machines and dishwashers. IC Role / Device Role / Timing Role: Real-time coordinator of brushed DC motor timing (via TPM PWM), water level ADC reads, and front-panel button debounce. Use Value: Dual TPM modules enable independent control of main drive and auxiliary pump motors; internal RTC supports timed wash cycles without external clock chip. |
Use Scenario: Safety-critical human-machine interface for hospital-grade infusion pumps requiring fault-tolerant I/O and watchdog supervision. IC Role / Device Role / Timing Role: Dedicated safety monitor verifying motor step integrity, detecting occlusion via pressure ADC, and triggering COP reset on software hang. Use Value: Hardware COP with dedicated 1-kHz internal clock ensures fail-safe reset even during VDD brownout; flash protection prevents unauthorized firmware modification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08SG8CTJ | 8 KB flash, 512 B RAM, identical pinout and peripheral set; higher memory for larger firmware or data logging | Preferred where bootloader, OTA update partition, or extended calibration tables are required | Select when firmware size exceeds 4 KB or future scalability is needed without PCB redesign |
| S9S08SG16E2MTJ | 16 KB flash, 1 KB RAM, same 16-TSSOP package; adds extra ADC channels and enhanced I²C timing control | Better suited for multi-sensor fusion or complex communication stacks requiring buffer headroom | Choose when adding CAN/LIN gateway functionality or supporting >12 analog inputs in same footprint |
Compared with S9S08SG4E2MTJ, MC9S08SG8CTJ offers double flash/RAM in identical packaging for seamless firmware scaling, while S9S08SG16E2MTJ provides expanded analog and communication resources - both retain full peripheral compatibility but require validation of flash layout and interrupt vector mapping.
Availability
S9S08SG4E2MTJ is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, and smart appliance control requiring stable component supply and long-term lifecycle support.
Supply support for S9S08SG4E2MTJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.
The S9S08SG4E2MTJ belongs to the HCS08 SG-series microcontrollers, designed specifically for cost-sensitive, low-power embedded control in harsh environments - emphasizing robustness, integrated analog, and minimal external component count.
FAQ
What is the maximum operating temperature rating for the S9S08SG4E2MTJ?
The S9S08SG4E2MTJ is rated for operation from –40°C to 125°C ambient temperature. It uses the standard temperature grade (M suffix) and is not qualified for the high-temperature 150°C variant offered in the SG8 family. This rating is validated per Freescale's Rev. 8 datasheet, Table A-3, and applies to the 16-TSSOP package configuration of the S9S08SG4E2MTJ.
Does the S9S08SG4E2MTJ support LIN 2.x physical layer signaling natively?
Yes, the S9S08SG4E2MTJ's SCI module supports LIN 2.x-compliant extended break generation and detection without external transceiver hardware. The SCI1TX and SCI1RX pins (PTB0/PTB1) implement the required timing tolerances and wakeup detection per LIN specification, confirmed in Section 14 of the MC9S08SG8 datasheet which covers the S9S08SG4E2MTJ device family.
Can the S9S08SG4E2MTJ operate without an external crystal or resonator?
Yes, the S9S08SG4E2MTJ can operate entirely from its internal clock source (ICS) with frequency-locked loop (FLL). Factory-trimmed internal reference enables ±1.5% accuracy from –40°C to 125°C, supporting bus frequencies from 2 MHz to 20 MHz - eliminating need for external timing components in most non-precision timing applications.
What debug interface does the S9S08SG4E2MTJ provide, and what tools are compatible?
The S9S08SG4E2MTJ features a single-wire background debug (BDM) interface compliant with Freescale's BDM specification. It supports in-circuit debugging using P&E Micro's Cyclone Pro, SEGGER J-Link (with BDM firmware), and NXP's S08 Tower System. The interface requires only the BKGD/MS pin and ground - no dedicated debug header or SWD/JTAG adapter is needed.
Is the S9S08SG4E2MTJ pin-compatible with other members of the SG-series?
Yes, the S9S08SG4E2MTJ in 16-TSSOP is pin-compatible with MC9S08SG8CTJ and S9S08SG16E2MTJ in the same package. All share identical pin assignments, electrical characteristics, and peripheral mappings per the MC9S08SG8 Rev. 8 datasheet, enabling drop-in memory upgrades without layout changes - provided flash programming and vector table offsets are updated in firmware.
S9S08SG4E2MTJ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 16
- Program Memory Size:
- 4KB (4K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256 x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08SG4E2MTJ FAQ
1.How can I place an order for S9S08SG4E2MTJ through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08SG4E2MTJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08SG4E2MTJ reliable?
The price and inventory of S9S08SG4E2MTJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG4E2MTJ is usually 5 days.
3.What payment methods are accepted for S9S08SG4E2MTJ?
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4.How is shipping managed for S9S08SG4E2MTJ?
S9S08SG4E2MTJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08SG4E2MTJ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08SG4E2MTJ?
For technical support, including S9S08SG4E2MTJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG4E2MTJ requirements.
6.How does Aetrix verify that S9S08SG4E2MTJ is sourced from the original manufacturer or authorized distributors?
All S9S08SG4E2MTJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG4E2MTJ meets industry standards.
7.What is the process for return or replacement of S9S08SG4E2MTJ?
All S9S08SG4E2MTJ units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG4E2MTJ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08SG4E2MTJ part is unused and in its original packaging.
Return procedure for S9S08SG4E2MTJ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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