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NXP Semiconductors S9S08SG4E2MTJR

Part No.:
S9S08SG4E2MTJR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
20-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixS9S08SG4E2MTJR.pdf
Description:
IC MCU 8BIT 4KB FLASH 20TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,588

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Product details

Overview

S9S08SG4E2MTJR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 4 KB flash, 256 B RAM, and integrated ADC, ACMP, SCI, SPI, I²C, TPM, and RTC peripherals. It operates at up to 40 MHz CPU frequency, supports stop3 low-power mode, and includes single-wire background debug interface. Used in automotive body electronics and industrial sensor nodes requiring compact, cost-optimized MCU control.

For engineers reviewing the S9S08SG4E2MTJR datasheet, S9S08SG4E2MTJR pinout, S9S08SG4E2MTJR application, or S9S08SG4E2MTJR equivalent, key selection criteria include flash endurance over temperature, real-time interrupt capability in stop3 mode, internal clock source accuracy (±1.5% over –40°C to 125°C), and compatibility with legacy HCS08 toolchains and debug infrastructure.

Technical Context

The S9S08SG4E2MTJR implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference for bus frequencies from 2 MHz to 20 MHz.

Peripherals include a 12-channel 10-bit ADC with 2.5 µs conversion time and temperature sensor, dual 2-channel TPM modules supporting edge- or center-aligned PWM, and an 8-bit RTC with 1 kHz on-chip oscillator enabling cyclic wake-up in all power modes.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core HCS08 8-bit core with BGND instruction and 40 MHz max operation (36 MHz above 125°C)
Flash Memory 4 KB on-chip flash with read/program/erase across full voltage and temperature range
RAM 256 bytes of on-chip RAM, retained in stop3 mode
ADC 10-bit, 12-channel SAR ADC with 2.5 µs conversion time, internal bandgap reference, and temperature sensor
Power Modes Run, wait, stop2, and stop3 - stop3 enables RTC and ACMP wake-up with ultra-low current draw
Clock Sources External crystal/ceramic (31.25 kHz–16 MHz) + internal ICS with FLL (±1.5% deviation, –40°C to 125°C)
Debug Interface Single-wire background debug (BDM) with one hardware breakpoint and on-chip ICE module

Pinout & Package

Package: 16-pin TSSOP (JEDEC MO-153, 4.4 mm × 5.0 mm, 0.65 mm pitch). Pinout validated per MC9S08SG4 datasheet Rev. 8, Section 2.1.

Pin/Terminal Circuit Role Design Meaning
VDD, VSS Power supply and ground Separate analog/digital supply pins not present; single VDD/VSS pair supports mixed-signal operation up to 5.5 V
XTAL, EXTAL Clock input/output Supports Pierce oscillator with crystals 31.25 kHz–38.4 kHz or 1–16 MHz; optional external clock input
BKGD/MS Background debug / mode select Single-wire BDM interface; pulled high internally during reset; used for programming and in-circuit debugging
RESET Active-low reset input Asynchronous reset with internal pull-up; accepts external reset signal or watchdog timeout assertion
PTA0–PTA7 Port A general-purpose I/O 8-bit port with configurable pull-up, slew rate, and drive strength; PTA0–PTA1 support SCI functions
PTB0–PTB7 Port B general-purpose I/O 8-bit port; PTB6/PTB7 support I²C (SDA/SCL); PTB0–PTB1 support SPI (MISO/MOSI)

Key Features

Feature Design Value
Stop3 low-power mode Enables RTC, ACMP, and ADC wake-up while drawing sub-1 µA current - ideal for battery-powered sensor polling
Internal clock source (ICS) FLL-based clock generation with ±1.5% accuracy over –40°C to 125°C eliminates need for external crystal in cost-sensitive designs
Temperature sensor Integrated diode-based sensor with ADC channel mapping - enables on-die thermal monitoring without external components
Single-wire BDM Reduces debug footprint to one pin and eliminates need for dedicated JTAG header - simplifies PCB layout and test access
Flash block protection Configurable write/erase protection per 512-byte block prevents accidental firmware corruption during field updates

Applications

Automotive Door Module Industrial Temperature Monitor

Use Scenario: Central control unit for window lift, mirror adjustment, and lock actuation in entry-level vehicles.

IC Role / Device Role / Timing Role: Main system controller executing motor sequencing, LIN communication, and fault detection logic.

Use Value: Stop3 mode enables periodic door position sensing and wake-on-LIN activity, extending battery life in parked state.

Use Scenario: Standalone DIN-rail mounted sensor node measuring ambient and enclosure temperature in PLC cabinets.

IC Role / Device Role / Timing Role: Data acquisition engine with local processing, RTC-based logging interval control, and UART reporting.

Use Value: Integrated temperature sensor + 10-bit ADC eliminates external sensing IC, reducing BOM count and calibration overhead.

Smart Lighting Dimmer Appliance Motor Control

Use Scenario: Phase-cut dimmer for residential LED drivers with soft-start and overtemperature shutdown.

IC Role / Device Role / Timing Role: Real-time PWM generator synchronized to AC line zero-crossing via GPIO interrupt.

Use Value: Dual TPM modules provide independent 8-bit PWM outputs for dimming and auxiliary status indication with <1% duty cycle resolution.

Use Scenario: Brushless DC fan controller in HVAC systems requiring speed regulation and thermal derating.

IC Role / Device Role / Timing Role: Closed-loop motor commutation controller using ADC feedback and TPM-driven gate timing.

Use Value: On-chip ACMP compares back-EMF signals to enable sensorless commutation without external comparators.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S08SG8CDT 8 KB flash, 512 B RAM, identical peripheral set and pinout; higher memory density but same 16-TSSOP package Preferred where firmware growth headroom or bootloader partitioning is required Select when future firmware expansion is anticipated without changing PCB layout
S9KEAZ128AMLH Kinetis E-series ARM Cortex-M0+ core, 128 KB flash, 16 KB RAM, enhanced ADC (16-bit), no HCS08 code compatibility Targeting next-generation designs needing higher performance, RTOS support, or advanced connectivity Choose for new designs prioritizing scalability over legacy toolchain reuse

Compared with MC9S08SG8CDT, S9S08SG4E2MTJR offers sufficient memory for basic control tasks with lower cost and smaller footprint; versus S9KEAZ128AMLH, it provides proven HCS08 ecosystem compatibility but lacks ARM-class throughput and peripheral depth.

Availability

S9S08SG4E2MTJR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart lighting controls, and appliance motor management requiring stable component supply across extended temperature ranges.

Supply support for S9S08SG4E2MTJR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The S9S08SG4E2MTJR belongs to the legacy HCS08 MCU family, designed for cost-sensitive, low-power embedded control applications where deterministic real-time response and long-term supply stability are critical.

FAQ

What is the maximum operating temperature rating for S9S08SG4E2MTJR?

The S9S08SG4E2MTJR is rated for operation from –40°C to 125°C. Unlike some variants in the SG8/SG4 family, it is not qualified for the extended 150°C high-temperature grade. Its ICS accuracy specification (±1.5%) applies across this full industrial temperature range, and flash endurance is guaranteed under these conditions.

Does S9S08SG4E2MTJR support in-circuit debugging via standard JTAG?

No, the S9S08SG4E2MTJR uses a proprietary single-wire background debug (BDM) interface, not JTAG. Debugging requires an NXP-compatible BDM pod (e.g., OSBDM or DEMO9S08SG8 board) and CodeWarrior Development Studio v6.3 or later. The BKGD/MS pin serves as the sole debug communication path.

Can S9S08SG4E2MTJR operate without an external crystal?

Yes, the S9S08SG4E2MTJR can run entirely from its internal clock source (ICS) with FLL enabled. The ICS provides bus frequencies from 2 MHz to 20 MHz and maintains ±1.5% accuracy over –40°C to 125°C, making external crystals optional for non-precision timing applications like motor control or sensor polling.

What power-saving modes are available on S9S08SG4E2MTJR, and which peripherals remain active in stop3 mode?

The S9S08SG4E2MTJR supports run, wait, stop2, and stop3 modes. In stop3, the RTC, ACMP, and ADC remain functional and can generate wake-up interrupts. The CPU, flash, and most clocks halt, reducing current draw to sub-1 µA. This enables ultra-low-power periodic sensing while retaining precise timekeeping and analog event detection.

Is S9S08SG4E2MTJR pin-compatible with MC9S08SG8 devices in the same package?

Yes, the S9S08SG4E2MTJR in 16-TSSOP is pin-compatible with MC9S08SG8CDT and other 16-pin SG8/SG4 variants. All share identical pin assignments, electrical characteristics, and peripheral mappings per the shared MC9S08SG8/SG4 datasheet Rev. 8, enabling direct substitution where flash/RAM requirements align.

S9S08SG4E2MTJR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
20-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256 x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08SG4E2MTJR FAQ

1.How can I place an order for S9S08SG4E2MTJR through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S08SG4E2MTJR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S08SG4E2MTJR reliable?

The price and inventory of S9S08SG4E2MTJR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG4E2MTJR is usually 5 days.

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S9S08SG4E2MTJR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S08SG4E2MTJR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S08SG4E2MTJR?

For technical support, including S9S08SG4E2MTJR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG4E2MTJR requirements.

6.How does Aetrix verify that S9S08SG4E2MTJR is sourced from the original manufacturer or authorized distributors?

All S9S08SG4E2MTJR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG4E2MTJR meets industry standards.

7.What is the process for return or replacement of S9S08SG4E2MTJR?

All S9S08SG4E2MTJR units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG4E2MTJR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08SG4E2MTJR part is unused and in its original packaging.

Return procedure for S9S08SG4E2MTJR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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