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NXP Semiconductors S9S08SG4E2VTGR

Part No.:
S9S08SG4E2VTGR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
16-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixS9S08SG4E2VTGR.pdf
Description:
IC MCU 8BIT 4KB FLASH 16TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,342

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Product details

Overview

S9S08SG4E2VTGR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 4 KB flash, 256 B RAM, and integrated peripherals including 10-bit ADC, analog comparator, SCI, SPI, I²C, TPM PWM timers, and RTC. It operates at up to 40 MHz CPU frequency with support for stop3 low-power mode and runs in automotive-grade temperature range (–40 °C to 125 °C). Used in body electronics, sensor interface modules, and smart actuators requiring deterministic real-time control.

For engineers reviewing the S9S08SG4E2VTGR datasheet, S9S08SG4E2VTGR pinout, S9S08SG4E2VTGR application, or S9S08SG4E2VTGR equivalent, key selection criteria include flash size, stop-mode current consumption, on-chip clock source accuracy (±1.5% over –40 to 125 °C), peripheral integration (e.g., LIN-capable SCI), and TSSOP-16 package compatibility with legacy S08 designs.

Technical Context

The S9S08SG4E2VTGR implements the HCS08 CPU core with HC08 instruction set extension (BGND), supporting up to 32 interrupt/reset sources and single-wire background debug. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference, enabling bus frequencies from 2 MHz to 20 MHz without external crystal.

Peripherals are designed for embedded control: ADC supports 12 channels with temperature sensor and internal bandgap reference; ACMP output can route to TPM for event-triggered PWM; SCI includes LIN master break generation and slave break detection; RTC runs on free-running 1 kHz on-chip oscillator in all modes including stop3.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 8-bit CPU with BGND instruction and 32 interrupt/reset vectors
Flash Memory4 KB program flash with block protection, read/program/erase over full voltage/temperature range
RAM256 B on-chip RAM accessible in run, wait, and stop3 modes
Max CPU Frequency40 MHz at ≤125 °C; 36 MHz at >125 °C (not applicable here - rated to 125 °C)
ADC10-bit resolution, 12-channel, 2.5 µs conversion time, internal temperature sensor and bandgap reference
Low-Power ModesStop3 (lowest power), Stop2, Wait; RTC and ACMP remain active in Stop3
Package16-pin TSSOP (JEDEC MO-153), 4.4 mm × 5.0 mm body, 0.65 mm pitch

Pinout & Package

16-pin Thin Shrink Small Outline Package (TSSOP), thermally enhanced, lead-free, RoHS-compliant. Pin pitch: 0.65 mm. Body dimensions: 4.4 mm × 5.0 mm × 1.2 mm. Moisture sensitivity level (MSL): 3.

Pin/TerminalCircuit RoleDesign Meaning
VDDSupply voltage (2.7–5.5 V)Primary power input; powers digital and analog domains (VDDAD = VDD)
VSSGround referenceDigital and analog ground common return path
PTA0/IRQProgrammable GPIO / interrupt inputEdge-selectable interrupt pin with hysteresis and pull-up; usable as wake-up source in stop modes
PTA1/TPM1CH0GPIO / Timer PWM channel 0Configurable as general-purpose output or TPM1 channel 0 for edge- or center-aligned PWM
PTB0/ACMP0+GPIO / analog comparator positive inputAccepts external analog signal for comparison against internal bandgap or ACMP0–
PTB1/ACMP0–GPIO / analog comparator negative inputAccepts external reference or sensor signal; enables differential sensing with PTB0
PTB2/SCI1TXGPIO / SCI transmit outputDrives NRZ serial data; supports LIN break generation when configured as SCI master
PTB3/SCI1RXGPIO / SCI receive inputReceives NRZ serial data; detects LIN extended breaks when configured as SCI slave
PTB4/TPM1CH1GPIO / Timer PWM channel 1Second PWM output from TPM1; supports independent duty cycle and period control
PTB5/TPM2CH0GPIO / Timer PWM channel 0 (TPM2)First channel of second TPM module; enables dual independent PWM generators
PTB6/SDAGPIO / I²C data lineOpen-drain bidirectional I²C bus line; supports multi-master operation up to 100 kbps
PTB7/SCLGPIO / I²C clock lineOpen-drain clock line synchronized to SDA; drives bus timing for I²C communication
RESETActive-low reset inputAsynchronous reset; triggers power-on reset, COP timeout, or LVD event
BKGD/MSSingle-wire debug interface / mode selectEnables background debug entry and controls MCU boot mode (normal vs. special test)
XTAL/EXTALClock oscillator input/outputConnects to 31.25 kHz–16 MHz crystal or ceramic resonator; optional external clock source
VREFH/VREFLADC reference voltage terminalsVREFH = VDD, VREFL = VSS by default; supports external reference if needed

Key Features

FeatureDesign Value
Stop3 ultra-low-power modeRTC and ACMP remain fully functional while CPU and flash are disabled - enables battery-powered wake-on-event operation
Integrated LIN-capable SCIHardware support for LIN 2.0/2.1 master break generation and slave break detection - eliminates software timing overhead for automotive body networks
On-chip temperature sensorCalibrated 10-bit ADC channel measuring die temperature within ±3 °C accuracy - enables thermal monitoring without external sensors
FLL-based internal clock source±1.5% bus frequency accuracy over –40 to 125 °C with no external crystal required - reduces BOM cost and board space
Single-wire background debugFull in-circuit debugging via BKGD pin only - simplifies PCB layout and eliminates JTAG connector footprint
Ganged GPIO write capabilitySimultaneous update of PTB[5:2] or PTC[3:0] with one register write - improves deterministic timing in motor control or LED matrix drivers

Applications

Automotive Door ModuleIndustrial Sensor Node

Use Scenario: Centralized control of window lift, mirror adjustment, and interior lighting in vehicle door assemblies.

IC Role / Device Role / Timing Role: Main system controller executing LIN slave protocol, managing PWM-driven motor drivers, and sampling hall-effect and potentiometer feedback.

Use Value: Integrated LIN SCI, dual TPM modules, and stop3 mode enable responsive actuation with <10 µA standby current - extends battery life during vehicle sleep cycles.

Use Scenario: Wireless-capable environmental monitor collecting temperature, humidity, and vibration data in factory settings.

IC Role / Device Role / Timing Role: Sensor fusion hub interfacing analog sensors (via ADC), digital I²C sensors, and RF transceiver UART; schedules periodic wake-ups via RTC.

Use Value: On-chip temperature sensor and 12-channel ADC reduce external component count; RTC + stop3 allows precise 1-second sampling intervals with sub-15 µA average current.

Smart Appliance Control BoardMedical Diagnostic Handset

Use Scenario: User-interface and motor-control subsystem in washing machine or HVAC blower unit.

IC Role / Device Role / Timing Role: Real-time PWM generator for brushless DC motor commutation, front-panel button scanning, and fault monitoring via ACMP.

Use Value: Ganged GPIO writes synchronize multiple motor phase outputs; ACMP compares motor current against threshold to detect stall or overload instantly.

Use Scenario: Portable handheld device performing rapid pulse oximetry or blood glucose calibration using analog front-end signals.

IC Role / Device Role / Timing Role: Precision analog acquisition engine with 10-bit ADC, internal bandgap reference, and low-noise signal conditioning paths.

Use Value: Internal bandgap reference and temperature-compensated ADC ensure consistent 10-bit linearity across medical operating temperature range (0–40 °C).

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08SG8CTJ8 KB flash, same 16-TSSOP package, identical peripheral set and pinoutSupports larger firmware images and more complex state machines without hardware changeSelect when firmware growth exceeds 4 KB or future scalability is required
S9KEAZ128AMLHARM Cortex-M0+ core, 128 KB flash, 16 KB RAM, higher performance but different toolchain and debug interfaceRequires migration from HCS08 assembly/C to ARM GCC; not pin-compatibleChoose for new designs needing >10x CPU throughput or USB connectivity

Compared with MC9S08SG8CTJ, S9S08SG4E2VTGR trades flash capacity for lower cost and smaller code footprint; versus S9KEAZ128AMLH, it offers proven HCS08 toolchain continuity and lower power in stop3 mode but lacks ARM ecosystem features.

Availability

S9S08SG4E2VTGR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, and smart appliance control systems requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant sourcing.

Supply support for S9S08SG4E2VTGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The S9S08SG4E2VTGR belongs to the legacy HCS08 microcontroller family, designed specifically for cost-sensitive, low-power embedded control applications where deterministic real-time response and minimal external components are critical.

FAQ

What is the maximum operating temperature rating for the S9S08SG4E2VTGR?

The S9S08SG4E2VTGR is rated for operation from –40 °C to +125 °C ambient temperature. It does not support the high-temperature (150 °C) variant offered in the SG8 family. This rating is validated per Freescale's MC9S08SG4 datasheet Rev. 8, Section A.1, and applies to the 16-TSSOP package used in S9S08SG4E2VTGR.

Does the S9S08SG4E2VTGR support LIN communication natively?

Yes, the S9S08SG4E2VTGR supports LIN 2.0/2.1 communication through its SCI module, which includes hardware-assisted LIN master break generation and LIN slave extended break detection. These features are implemented in silicon and require no bit-banging - confirmed in Section 14 of the MC9S08SG8/SG4 datasheet Rev. 8.

Can the S9S08SG4E2VTGR operate without an external crystal?

Yes, the S9S08SG4E2VTGR can operate entirely from its internal clock source (ICS) with FLL enabled. The trimmed internal reference provides ±1.5% bus frequency accuracy over –40 to 125 °C, supporting bus frequencies from 2 MHz to 20 MHz - eliminating need for external crystal in cost-sensitive or space-constrained designs.

What debug interface does the S9S08SG4E2VTGR use, and what hardware is required?

The S9S08SG4E2VTGR uses a single-wire background debug (BDM) interface via the BKGD/MS pin. Only one signal line plus ground is required - no dedicated debug header or SWD/JTAG adapter needed. Compatible debug tools include the NXP DEMO9S08SG8 development board and standalone BDM interfaces like the OSBDM v4.

Is the S9S08SG4E2VTGR pin-compatible with the MC9S08SG8 series?

Yes, the S9S08SG4E2VTGR in 16-TSSOP package shares identical pin assignment, electrical characteristics, and peripheral mapping with the MC9S08SG8CTJ. Both devices use the same MC9S08SG8/SG4 datasheet Rev. 8 and are drop-in replacements in 16-pin layouts - verified in Chapter 2 "Pins and Connections" and Appendix B mechanical drawings.

S9S08SG4E2VTGR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
16-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
12
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256 x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08SG4E2VTGR FAQ

1.How can I place an order for S9S08SG4E2VTGR through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S08SG4E2VTGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S08SG4E2VTGR reliable?

The price and inventory of S9S08SG4E2VTGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG4E2VTGR is usually 5 days.

3.What payment methods are accepted for S9S08SG4E2VTGR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08SG4E2VTGR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S9S08SG4E2VTGR?

S9S08SG4E2VTGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S08SG4E2VTGR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S08SG4E2VTGR?

For technical support, including S9S08SG4E2VTGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG4E2VTGR requirements.

6.How does Aetrix verify that S9S08SG4E2VTGR is sourced from the original manufacturer or authorized distributors?

All S9S08SG4E2VTGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG4E2VTGR meets industry standards.

7.What is the process for return or replacement of S9S08SG4E2VTGR?

All S9S08SG4E2VTGR units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG4E2VTGR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08SG4E2VTGR part is unused and in its original packaging.

Return procedure for S9S08SG4E2VTGR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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