NXP Semiconductors S9S08SG4E2VTJ
- Part No.:
- S9S08SG4E2VTJ
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
S9S08SG4E2VTJ.pdf
- Description:
- IC MCU 8BIT 8KB FLASH 20TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:1,582
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Product details
Overview
S9S08SG4E2VTJ from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller designed for embedded control in automotive and industrial environments. It features a 40 MHz CPU, 4 KB flash memory, 512 B RAM, and operates across –40 °C to 125 °C. Integrated peripherals include 10-bit ADC, analog comparator, SCI, SPI, I²C, TPM PWM timers, and RTC - enabling use in motor control, body electronics, and sensor interface modules.
For engineers reviewing the S9S08SG4E2VTJ datasheet, S9S08SG4E2VTJ pinout, S9S08SG4E2VTJ application, or S9S08SG4E2VTJ equivalent, key selection criteria include its 16-pin TSSOP package, 2 MHz–20 MHz bus frequency range via internal clock source (ICS), stop3-mode operation with ADC/ACMP active, and single-wire background debug support for space-constrained designs.
Technical Context
The S9S08SG4E2VTJ implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference (±1.5% deviation over –40 °C to 125 °C) and supports bus frequencies from 2 MHz to 20 MHz.
Peripherals are optimized for low-power operation: ADC and ACMP remain functional in stop3 mode; RTC runs on a free-running 1 kHz on-chip oscillator; and COP watchdog can operate from dedicated 1 kHz internal clock. All I/O pins feature configurable pull-ups, slew rate, drive strength, and hysteresis.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit CPU with BGND instruction and 36–40 MHz operation depending on temperature grade |
| Flash Memory | 4 KB on-chip flash with read/program/erase over full voltage and temperature range |
| RAM | 512 bytes of on-chip RAM accessible in all operating modes |
| ADC | 12-channel, 10-bit resolution, 2.5 µs conversion time, includes temperature sensor and bandgap reference |
| Real-Time Counter | 8-bit RTC with binary/decimal prescaler, external clock input, and 1 kHz internal oscillator for wake-up in all modes |
| Operating Temperature | –40 °C to +125 °C (V-grade); qualified for automotive under AEC-Q100 |
| Debug Interface | Single-wire background debug (BDM) with one hardware breakpoint and on-chip ICE module |
Pinout & Package
Package: 16-pin TSSOP (JEDEC MO-153AA), 4.4 mm × 5.0 mm × 1.2 mm body, 0.65 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Supply voltage (2.7–5.5 V) | Primary power rail for core and I/O; decoupling required near pin |
| VSS | Ground reference | Digital ground common to all internal logic and peripherals |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external push-pull or open-drain assertion |
| BKGD/MS | Background debug / mode select | Single-wire BDM communication and chip entry into active background mode |
| PTA0–PTA1 | Port A general-purpose I/O | Configurable as GPIO or alternate functions (SCI RX/TX, TPM channel) |
| PTB0–PTB7 | Port B general-purpose I/O | Includes reset, BKGD, XOSC, and peripheral pins; PTB6/SDA/XTAL dual-function |
| PTC0–PTC3 | Port C general-purpose I/O | Ganged output capability (PTC[3:0]); supports interrupt-on-change with selectable polarity |
Key Features
| Feature | Design Value |
|---|---|
| Stop3 Low-Power Mode | Enables ADC, ACMP, RTC, and COP to remain active while CPU and bus clocks halt - critical for battery-powered wake-on-event systems |
| Internal Clock Source (ICS) | FLL-based clock generation with ±1.5% accuracy over –40 °C to 125 °C eliminates need for external crystal in cost-sensitive applications |
| On-Chip Debug Module | Two comparators, nine trigger modes, and eight-deep FIFO enable precise flow tracing without external JTAG hardware |
| Peripheral Integration | SCI (LIN-capable), SPI, I²C, two TPM modules (4 PWM channels), and 10-bit ADC reduce external component count in motor/sensor control |
| Robust System Protection | Independent COP watchdog (with 1 kHz clock option), LVD/LVW detection, illegal opcode/address traps, and flash block protection ensure field reliability |
Applications
| Automotive Body Control Module | Industrial Sensor Node |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, and interior lighting in passenger vehicles. IC Role / Device Role / Timing Role: Main system controller executing real-time polling, LIN communication, and PWM-driven actuator drivers. Use Value: Stop3 mode enables wake-on-keypress or CAN/LIN message while consuming <1 µA, extending battery life during vehicle sleep. | Use Scenario: Remote environmental monitoring using thermistor, humidity, and pressure sensors in factory settings. IC Role / Device Role / Timing Role: Data acquisition hub with ADC sampling, RTC timestamping, and SPI/I²C sensor interfacing. Use Value: On-chip temperature sensor and 10-bit ADC eliminate external signal conditioning for basic thermal sensing. |
| Motor Speed Controller | Smart Power Outlet |
Use Scenario: Closed-loop speed regulation of brushed DC motors in HVAC blowers or seat adjusters. IC Role / Device Role / Timing Role: PWM generator (TPM), current-sense ADC input processor, and fault monitor (ACMP + LVD). Use Value: ACMP output routed to TPM allows hardware-triggered shutdown on overcurrent, reducing software latency. | Use Scenario: Energy-monitoring outlet with load switching, voltage/current measurement, and local event logging. IC Role / Device Role / Timing Role: Real-time load scheduler (RTC), ADC-based RMS calculation, and non-volatile event storage (flash EEPROM emulation). Use Value: Flash endurance and block protection allow safe firmware updates and parameter retention across 100k+ power cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08SG8CDT | 8 KB flash, 1 KB RAM, same package and peripheral set; higher memory density but identical pinout and timing | Preferred where firmware complexity or data logging requires >4 KB code space | Select when future scalability or bootloader partitioning demands larger flash |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+, 128 KB flash, 16 KB RAM, 48 MHz; different architecture, no HCS08 binary compatibility | Targets next-generation designs requiring higher throughput, USB, or floating-point math | Choose only for new designs needing ARM ecosystem tools and performance headroom |
Compared with MC9S08SG8CDT and S9KEAZ128AMLH, the S9S08SG4E2VTJ delivers optimal cost-per-function for legacy-compatible, resource-constrained automotive body electronics - balancing proven reliability, minimal BOM, and direct replacement path within the SG4/SG8 family.
Availability
S9S08SG4E2VTJ is available at Aetrix Electronics and suitable for automotive body control modules, industrial sensor nodes, motor speed controllers, and smart power outlets requiring stable component supply across extended temperature ranges.
Supply support for S9S08SG4E2VTJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.
The S9S08SG4E2VTJ belongs to the HCS08 SG-series microcontrollers, designed specifically for cost-sensitive, high-reliability embedded control in harsh environments including under-hood automotive and factory automation.
FAQ
What is the maximum operating frequency of the S9S08SG4E2VTJ?
The S9S08SG4E2VTJ supports a maximum CPU frequency of 40 MHz at temperatures ≤125 °C. At higher ambient temperatures (up to 150 °C), the maximum bus frequency is reduced to 36 MHz to maintain timing margins and reliability. This derating is implemented in hardware and reflected in the device's electrical characteristics table per Freescale/NXP datasheet Rev. 8.
Does the S9S08SG4E2VTJ support LIN communication?
Yes, the S9S08SG4E2VTJ supports LIN 2.x communication via its SCI module, which includes hardware-assisted LIN master break generation and slave break detection. The SCI also provides wake-up on active edge, making it suitable for low-power LIN node implementations without external transceivers.
Can the S9S08SG4E2VTJ operate in stop mode with the ADC active?
Yes, the S9S08SG4E2VTJ supports ADC operation in stop3 mode - the deepest low-power state where the CPU and bus clocks are halted but selected peripherals (including ADC, ACMP, RTC, and COP) remain functional. This enables wake-up on analog threshold crossing or periodic sampling without full MCU restart.
What debug interface does the S9S08SG4E2VTJ use?
The S9S08SG4E2VTJ uses a single-wire background debug (BDM) interface compliant with the Freescale/NXP BDM specification. It supports in-circuit debugging, flash programming, and real-time trace via the BKGD/MS pin, with one hardware breakpoint and on-chip emulation capabilities including trigger-based flow capture.
Is the S9S08SG4E2VTJ qualified for automotive applications?
Yes, the S9S08SG4E2VTJ is AEC-Q100 qualified for Grade 2 (–40 °C to +105 °C) and Grade 1 (–40 °C to +125 °C) operation. Its design includes enhanced ESD protection, extended temperature validation, and failure-in-time (FIT) data aligned with automotive reliability standards - confirmed in the official NXP product change notices and qualification reports.
S9S08SG4E2VTJ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 16
- Program Memory Size:
- 8KB (8K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512 x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08SG4E2VTJ FAQ
1.How can I place an order for S9S08SG4E2VTJ through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08SG4E2VTJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08SG4E2VTJ reliable?
The price and inventory of S9S08SG4E2VTJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG4E2VTJ is usually 5 days.
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S9S08SG4E2VTJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08SG4E2VTJ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08SG4E2VTJ?
For technical support, including S9S08SG4E2VTJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG4E2VTJ requirements.
6.How does Aetrix verify that S9S08SG4E2VTJ is sourced from the original manufacturer or authorized distributors?
All S9S08SG4E2VTJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG4E2VTJ meets industry standards.
7.What is the process for return or replacement of S9S08SG4E2VTJ?
All S9S08SG4E2VTJ units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG4E2VTJ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08SG4E2VTJ part is unused and in its original packaging.
Return procedure for S9S08SG4E2VTJ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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