NXP Semiconductors S9S08SG8E2CTG
- Part No.:
- S9S08SG8E2CTG
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 16-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
S9S08SG8E2CTG.pdf
- Description:
- IC MCU 8BIT 8KB FLASH 16TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S9S08SG8E2CTG from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 8 KB flash, 512 B RAM, and integrated peripherals including 10-bit ADC, analog comparator, SCI, SPI, I²C, TPM PWM timers, and RTC. It operates at up to 40 MHz (36 MHz above 125 °C), supports stop3 low-power mode, and targets automotive body electronics and industrial control.
For engineers reviewing the S9S08SG8E2CTG datasheet, S9S08SG8E2CTG pinout, S9S08SG8E2CTG application, or S9S08SG8E2CTG equivalent, key selection criteria include its -40 °C to 150 °C extended temperature rating, single-wire background debug interface, on-chip FLL clock source with ±1.5% deviation over temperature, and support for LIN-compliant SCI wake-up and break handling.
Technical Context
The S9S08SG8E2CTG implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) trimmed for ±0.2% resolution and ±1.5% deviation from –40 °C to 125 °C - extended to ±3% above 125 °C.
Peripherals include a 12-channel 10-bit ADC with 2.5 µs conversion time and temperature sensor, dual 2-channel TPM modules supporting edge- or center-aligned PWM, and SCI with LIN master break generation and slave break detection. All major peripherals remain functional in stop3 mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU, 40 MHz max (36 MHz >125 °C) |
| Flash Memory | 8 KB on-chip flash with block protection and read/program/erase over full voltage/temperature range |
| RAM | 512 bytes of on-chip RAM, retained in stop3 mode |
| ADC | 12-channel, 10-bit resolution, 2.5 µs conversion time, internal bandgap reference, runs in stop3 |
| Temperature Range | -40 °C to +150 °C (qualified for high-temp automotive use) |
| Debug Interface | Single-wire background debug (BDM) with one hardware breakpoint and on-chip ICE module |
| Clock Sources | External crystal/ceramic (31.25 kHz–16 MHz) + internal FLL with ±1.5% accuracy (–40 to 125 °C) |
Pinout & Package
Package: 16-pin TSSOP (lead-free, RoHS-compliant). This package supports the full -40 °C to +150 °C operating range and is qualified for high-temperature automotive applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power domains: VDD/VSS for digital core and I/O; separate VDDAD/VSSAD pins required for analog ADC/ACMP operation |
| XTAL, EXTAL | Crystal oscillator input/output | Supports 31.25 kHz–38.4 kHz or 1–16 MHz crystals/resonators; optional external clock input on EXTAL |
| BKGD/MS | Background debug / mode select | Single-wire BDM interface pin; also selects active background mode during reset |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external reset signal or watchdog timeout assertion |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit port with configurable pull-ups, slew rate, drive strength, and interrupt-on-change capability |
| PTB0–PTB7 | Port B general-purpose I/O | 8-bit port; PTB6/PTB7 multiplexed with I²C SDA/SCL; PTB0–PTB1 with SCI TXD/RXD |
| PTC0–PTC3 | Port C general-purpose I/O | 4-bit port; PTC0–PTC3 support ganged output; PTC2/PTC3 multiplexed with SPI MOSI/MISO |
Key Features
| Feature | Design Value |
|---|---|
| Stop3 ultra-low-power mode | Real-time interrupt (RTI) and selected peripherals (ADC, ACMP, RTC, SCI) remain active while CPU and bus clocks halt - enables battery-powered wake-on-event operation |
| Integrated LIN-capable SCI | Hardware support for LIN 2.x master break generation (13-bit dominant) and slave break detection, enabling direct integration into automotive body networks without external transceivers |
| On-chip temperature sensor | Calibrated 10-bit ADC channel with ±3 °C accuracy across –40 °C to +150 °C, eliminating need for external thermal monitoring in engine bay or under-hood modules |
| FLL-based internal clock | Frequency-locked loop with factory-trimmed internal reference achieves ±1.5% bus frequency accuracy from –40 °C to 125 °C - reduces BOM cost by eliminating external crystal in non-precision timing applications |
| Flash security and protection | Programmable flash block protection (FPROT/NVPROT) and security byte prevent unauthorized read-out or reprogramming - meets basic automotive ECU firmware protection requirements |
Applications
| Automotive Door Module | Industrial Motor Control |
|---|---|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in modern vehicle door assemblies. IC Role / Device Role / Timing Role: Main system controller managing LIN communication with body control module, local sensor inputs (switches, position sensors), and PWM-driven motor drivers. Use Value: Integrated LIN SCI, stop3 wake-on-event, and 150 °C rating allow direct mounting inside door panels exposed to extreme ambient temperatures and eliminate need for external timing components. | Use Scenario: Closed-loop speed and direction control of 12–24 V DC brush motors in HVAC actuators, valve positioners, and conveyor drives. IC Role / Device Role / Timing Role: Real-time motor controller executing PID algorithms, generating complementary PWM outputs via TPM modules, and reading feedback from hall-effect or potentiometer sensors. Use Value: Dual TPM modules with buffered edge-aligned PWM, 10-bit ADC with internal reference, and robust I/O drive strength enable precise motor control without external signal conditioning or gate drivers. |
| Smart Lighting Node | Engine Bay Sensor Hub |
Use Scenario: Distributed LED driver node in commercial building lighting systems, communicating via I²C to central controller and adjusting brightness based on ambient light and occupancy. IC Role / Device Role / Timing Role: Peripheral node MCU handling analog ambient light sensing, PWM dimming control, and I²C slave communication with master lighting controller. Use Value: On-chip 10-bit ADC with temperature sensor and internal bandgap reference ensures stable light measurement across temperature; I²C supports multi-master operation for daisy-chained topology. | Use Scenario: Consolidated sensor interface mounted near engine manifold, aggregating signals from oil pressure, coolant temperature, and intake air temperature sensors for transmission to ECU. IC Role / Device Role / Timing Role: Signal-conditioning and preprocessing unit converting analog sensor outputs to digital values, performing basic diagnostics, and transmitting via SCI UART to main ECU. Use Value: 150 °C qualification, on-chip temperature sensor, and ADC with internal reference allow reliable operation adjacent to hot engine surfaces without external thermal compensation circuitry. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08SG4E2CTG | 4 KB flash, 256 B RAM, identical peripheral set and pinout | Lower memory capacity limits firmware complexity and data logging depth | Select when application firmware fits within 4 KB and cost sensitivity outweighs future scalability needs |
| S9S08SG16E2CTG | 16 KB flash, 1 KB RAM, same package and peripheral complement | Enables larger RTOS footprint, extended diagnostics, and dual-bank firmware updates | Select when field-upgradeability, enhanced safety monitoring, or expanded feature set requires >8 KB code space |
Compared with MC9S08SG4E2CTG and S9S08SG16E2CTG, the S9S08SG8E2CTG delivers optimal balance of memory headroom, thermal robustness, and peripheral integration for mid-tier automotive and industrial control nodes - avoiding both under-provisioning and unnecessary cost premium.
Availability
S9S08SG8E2CTG is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor controllers, smart lighting nodes, and engine bay sensor hubs requiring stable component supply across extended temperature ranges.
Supply support for S9S08SG8E2CTG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's embedded MCU heritage.
The S9S08SG8E2CTG belongs to the HCS08 SG-series - a family of cost-optimized, high-temperature-rated 8-bit MCUs designed specifically for automotive body electronics and industrial control where reliability, low power, and LIN/UART interoperability are critical.
FAQ
What is the maximum operating temperature specification for the S9S08SG8E2CTG?
The S9S08SG8E2CTG is rated for continuous operation from –40 °C to +150 °C. This extended temperature range is validated per Freescale/NXP qualification standards for automotive under-hood and engine bay applications. The CPU frequency is derated to 36 MHz above 125 °C to maintain timing integrity, and the internal FLL accuracy specification changes from ±1.5% to ±3% across the full range. S9S08SG8E2CTG maintains full peripheral functionality - including ADC, ACMP, RTC, and SCI - throughout this range.
Does the S9S08SG8E2CTG support LIN communication natively?
Yes, the S9S08SG8E2CTG supports LIN 2.x communication natively through its SCI module. It provides hardware-level generation of extended dominant breaks (13-bit) required for LIN master nodes and detection of extended breaks for slave node synchronization. No external LIN transceiver is needed for basic point-to-point or single-master network topologies. The S9S08SG8E2CTG SCI also supports wake-up on active edge and automatic baud rate detection, simplifying implementation in automotive body networks.
What debug interface does the S9S08SG8E2CTG use, and what capabilities does it provide?
The S9S08SG8E2CTG uses a single-wire background debug (BDM) interface accessible via the BKGD/MS pin. It supports real-time in-circuit debugging, including run/stop control, register and memory inspection, and single-step execution. The on-chip debug module provides one hardware breakpoint and two additional breakpoints via the ICE module, along with an eight-deep FIFO for trace data. This interface enables full firmware development and validation without requiring dedicated JTAG headers or external emulators - reducing test fixture complexity for S9S08SG8E2CTG-based designs.
Can the S9S08SG8E2CTG operate in low-power modes while maintaining analog peripheral functionality?
Yes, the S9S08SG8E2CTG supports stop3 mode - an ultra-low-power state where the CPU and bus clocks are halted but key analog and timing peripherals remain active. In stop3, the 10-bit ADC, 5-V analog comparator (ACMP), real-time counter (RTC), and SCI with wake-up capability continue to function. This allows battery-powered applications to perform periodic sensor sampling, detect threshold crossings, or respond to serial events without waking the CPU, significantly extending operational life. S9S08SG8E2CTG retains RAM contents and register states across stop3 entry/exit.
What clock sources are available on the S9S08SG8E2CTG, and how accurate is the internal option?
The S9S08SG8E2CTG offers two primary clock sources: an external crystal/ceramic resonator (31.25 kHz–16 MHz) via XTAL/EXTAL pins, and an internal clock source (ICS) with frequency-locked loop (FLL). The ICS uses a factory-trimmed internal reference to achieve ±0.2% resolution and ±1.5% deviation over –40 °C to 125 °C - extended to ±3% above 125 °C. This eliminates the need for external crystals in cost-sensitive applications while maintaining sufficient accuracy for UART, LIN, and PWM timing. S9S08SG8E2CTG supports bus frequencies from 2 MHz to 20 MHz using the ICS.
S9S08SG8E2CTG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 16-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 12
- Program Memory Size:
- 8KB (8K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512 x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08SG8E2CTG FAQ
1.How can I place an order for S9S08SG8E2CTG through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08SG8E2CTG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08SG8E2CTG reliable?
The price and inventory of S9S08SG8E2CTG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG8E2CTG is usually 5 days.
3.What payment methods are accepted for S9S08SG8E2CTG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08SG8E2CTG transactions.
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4.How is shipping managed for S9S08SG8E2CTG?
S9S08SG8E2CTG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08SG8E2CTG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08SG8E2CTG?
For technical support, including S9S08SG8E2CTG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG8E2CTG requirements.
6.How does Aetrix verify that S9S08SG8E2CTG is sourced from the original manufacturer or authorized distributors?
All S9S08SG8E2CTG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG8E2CTG meets industry standards.
7.What is the process for return or replacement of S9S08SG8E2CTG?
All S9S08SG8E2CTG units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG8E2CTG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08SG8E2CTG part is unused and in its original packaging.
Return procedure for S9S08SG8E2CTG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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