NXP Semiconductors S9S08SG8E2CTGR
- Part No.:
- S9S08SG8E2CTGR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 16-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
S9S08SG8E2CTGR.pdf
- Description:
- IC MCU 8BIT 8KB FLASH 16TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S9S08SG8E2CTGR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 8 KB flash, 512 B RAM, and integrated peripherals including 10-bit ADC, analog comparator, SCI, SPI, I²C, TPM PWM timers, and RTC. It operates at up to 40 MHz CPU frequency and supports extended temperature range up to 125 °C - used in automotive body control modules and industrial sensor nodes requiring low-power operation and on-chip debug.
For engineers reviewing the S9S08SG8E2CTGR datasheet, S9S08SG8E2CTGR pinout, S9S08SG8E2CTGR application, or S9S08SG8E2CTGR equivalent, key selection criteria include flash endurance (100k erase/write cycles), stop3 mode current (1.5 µA typical), internal clock source accuracy (±1.5% over –40 to 125 °C), and single-wire background debug interface compatibility.
Technical Context
The S9S08SG8E2CTGR implements the HCS08 CPU core with HC08 instruction set extension (BGND), supporting up to 32 interrupt/reset sources and two very low-power stop modes. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference for bus frequencies from 2 MHz to 20 MHz.
Peripherals include a 12-channel 10-bit ADC with 2.5 µs conversion time and temperature sensor, dual 2-channel TPM modules supporting edge- or center-aligned PWM, and real-time counter (RTC) with free-running 1 kHz low-power oscillator enabling cyclic wake-up in all MCU modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core with BGND instruction and 36–40 MHz operation (derated to 36 MHz above 125 °C) |
| Flash Memory | 8 KB on-chip flash with 100,000 erase/write cycles and block protection |
| RAM Size | 512 bytes of random-access memory, retained in stop3 mode |
| ADC Resolution | 10-bit SAR ADC with 12 input channels, 2.5 µs conversion time, and internal bandgap reference |
| Operating Temp | –40 °C to +125 °C ambient; validated for automotive and industrial environments |
| Power Modes | Run, wait, stop2, and stop3 - stop3 draws 1.5 µA typical with RTC active |
| Debug Interface | Single-wire background debug (BDM) with one hardware breakpoint and on-chip ICE module |
Pinout & Package
Package: 16-pin TSSOP (JEDEC MO-153, 4.4 mm × 5.0 mm), lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Supply voltage (2.7–5.5 V) | Main power rail for digital and analog domains; decoupling required near pin |
| VSS | Ground reference | Digital and analog common return; separate VSSAD recommended for ADC noise reduction |
| PTA0/IRQ | Programmable GPIO / interrupt input | Edge-selectable interrupt pin with hysteresis and pull-up; supports wake-from-stop |
| PTA1/TPM1CH0 | GPIO / TPM1 channel 0 output | Configurable as general-purpose output or PWM signal source for motor control or LED dimming |
| PTB0/SCI1TX | GPIO / SCI transmit | Full-duplex UART output with LIN break generation capability for automotive diagnostics |
| PTB1/SCI1RX | GPIO / SCI receive | SCI input with LIN break detection and wake-on-active-edge support |
| PTB2/SPI1SCK | GPIO / SPI clock | Master or slave clock output/input; supports up to 10 MHz operation |
| PTB3/SPI1MOSI | GPIO / SPI master-out-slave-in | Double-buffered data line; enables high-throughput sensor or EEPROM communication |
| PTB4/SPI1MISO | GPIO / SPI master-in-slave-out | Input-only during master mode; supports daisy-chain configurations |
| PTB5/IIC1SCL | GPIO / I²C clock | Open-drain output with programmable slew rate; compliant with 100 kbps standard-mode I²C |
| PTB6/IIC1SDA | GPIO / I²C data | Open-drain bidirectional line; supports multi-master arbitration and broadcast addressing |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external reset supervisor or manual pushbutton |
| BKGD/MS | Background debug / mode select | Single-wire BDM interface pin; also selects boot mode on power-up |
| XTAL/EXTAL | Crystal oscillator input/output | Supports 31.25 kHz–16 MHz crystals or ceramic resonators; optional external clock input |
| VDDAD/VREFH | Analog supply / ADC reference high | Connects to main VDD or external precision reference; determines full-scale ADC range |
| VSSAD/VREFL | Analog ground / ADC reference low | Separate analog ground plane recommended to minimize noise coupling into ADC inputs |
Key Features
| Feature | Design Value |
|---|---|
| Stop3 ultra-low-power mode | 1.5 µA typical current draw with RTC running - enables battery-powered sensor nodes with >10-year life |
| On-chip RTC with 1 kHz LPO | Free-running real-time counter using internal low-power oscillator - eliminates need for external 32.768 kHz crystal |
| Integrated temperature sensor | Calibrated on-die sensor connected to ADC channel - provides system thermal monitoring without external components |
| Single-wire BDM interface | Minimal PCB footprint debug solution - requires only BKGD/MS and VDD/VSS connections for programming and runtime inspection |
| Flash block protection | Hardware-enforced write/erase lock per 512-byte sector - prevents accidental firmware corruption in field-deployed units |
| Ganged GPIO output | Simultaneous state update across PTB[5:2] or PTC[3:0] - simplifies LED array or relay bank control with single register write |
Applications
| Automotive Body Control Unit | Industrial Temperature Monitor |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, and interior lighting in entry-level vehicles. IC Role / Device Role / Timing Role: Main system controller executing CAN/LIN gateway logic, PWM-driven actuator drivers, and fault-safe diagnostics. Use Value: Stop3 mode enables always-on intrusion detection with <2 µA quiescent current; integrated ADC reads cabin thermistor and battery voltage without external signal conditioning. |
Use Scenario: Standalone DIN-rail mounted sensor node measuring ambient and process temperature in HVAC or factory automation. IC Role / Device Role / Timing Role: Self-contained data logger with RTC timestamping, local alarm thresholds, and RS-485/SCI-based reporting. Use Value: On-chip temperature sensor and 10-bit ADC eliminate external sensing ICs; RTC with 1 kHz LPO ensures accurate timekeeping without crystal load or board space. |
| Smart Appliance Power Management | Medical Diagnostic Handheld |
Use Scenario: Energy-efficient control of compressor, fan, and display backlight in refrigerators and air conditioners. IC Role / Device Role / Timing Role: Real-time PWM generator for variable-speed motors and precise timing supervisor for defrost cycles. Use Value: Dual TPM modules deliver independent center-aligned PWM outputs for inverter drives; low-voltage detect interrupts trigger graceful shutdown before brownout. |
Use Scenario: Portable blood glucose or pulse oximeter with battery operation, touch interface, and Bluetooth LE connectivity. IC Role / Device Role / Timing Role: Sensor hub aggregating analog biosignals, managing button/touch inputs, and coordinating wireless transmission bursts. Use Value: 12-channel ADC supports simultaneous multi-sensor acquisition; ganged GPIO simplifies LED status indicator control; stop3 mode extends battery life between measurements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08SG4CTG | 4 KB flash, 256 B RAM, identical peripheral set and pinout | Lower code density requirement; suitable for simpler control tasks with reduced firmware footprint | Select when application fits within 4 KB flash and cost sensitivity outweighs future scalability needs |
| S9S08SG16E2CTGR | 16 KB flash, 1 KB RAM, same package and peripheral complement | Supports larger firmware images, bootloader implementation, and enhanced feature sets | Choose for designs requiring field-upgradable firmware or anticipated feature expansion without PCB change |
Compared with S9S08SG8E2CTGR, MC9S08SG4CTG reduces memory capacity but maintains identical low-power behavior and debug interface, while S9S08SG16E2CTGR scales flash/RAM upward with no architectural or layout impact - enabling seamless migration paths within the same footprint and toolchain.
Availability
S9S08SG8E2CTGR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart appliance controllers, and portable medical devices requiring stable component supply and long-term manufacturability.
Supply support for S9S08SG8E2CTGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The S9S08SG8E2CTGR belongs to NXP's legacy HCS08 microcontroller family, designed for cost-sensitive, low-power embedded control in harsh environments - emphasizing robustness, debug accessibility, and minimal external component count.
FAQ
What is the maximum operating frequency of the S9S08SG8E2CTGR CPU?
The S9S08SG8E2CTGR CPU runs at up to 40 MHz under standard temperature conditions (–40 °C to 105 °C). At ambient temperatures above 125 °C, the maximum supported frequency is derated to 36 MHz to ensure reliable operation and meet electrical specifications across the extended range.
Does the S9S08SG8E2CTGR support in-circuit debugging?
Yes, the S9S08SG8E2CTGR features a single-wire background debug (BDM) interface compatible with standard Freescale/NXP BDM tools. It supports real-time register inspection, memory read/write, and one hardware breakpoint - all accessible via the BKGD/MS pin without requiring additional debug headers or pins.
Can the S9S08SG8E2CTGR operate from an internal clock source only?
Yes, the S9S08SG8E2CTGR integrates an Internal Clock Source (ICS) module with a frequency-locked loop (FLL) and precision-trimmed internal reference. It delivers bus frequencies from 2 MHz to 20 MHz without external crystals or resonators - ideal for cost-constrained or space-limited designs where external timing components are undesirable.
What power-saving modes does the S9S08SG8E2CTGR offer?
The S9S08SG8E2CTGR provides three low-power modes: wait mode (CPU halted, peripherals active), stop2 (deep sleep with wake on reset or IRQ), and stop3 (ultra-low-power mode drawing 1.5 µA typical while keeping RTC and certain wakeup sources active). All modes retain RAM contents and support fast wake-up times.
Is the S9S08SG8E2CTGR pin-compatible with other members of the SG8 family?
Yes, the S9S08SG8E2CTGR in 16-TSSOP packaging shares identical pinout and electrical characteristics with MC9S08SG4CTG and S9S08SG16E2CTGR - enabling direct substitution within the same package variant. This allows scalable memory selection without PCB redesign or layout changes.
S9S08SG8E2CTGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 16-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 12
- Program Memory Size:
- 8KB (8K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512 x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08SG8E2CTGR FAQ
1.How can I place an order for S9S08SG8E2CTGR through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08SG8E2CTGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08SG8E2CTGR reliable?
The price and inventory of S9S08SG8E2CTGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG8E2CTGR is usually 5 days.
3.What payment methods are accepted for S9S08SG8E2CTGR?
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S9S08SG8E2CTGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08SG8E2CTGR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08SG8E2CTGR?
For technical support, including S9S08SG8E2CTGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG8E2CTGR requirements.
6.How does Aetrix verify that S9S08SG8E2CTGR is sourced from the original manufacturer or authorized distributors?
All S9S08SG8E2CTGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG8E2CTGR meets industry standards.
7.What is the process for return or replacement of S9S08SG8E2CTGR?
All S9S08SG8E2CTGR units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG8E2CTGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08SG8E2CTGR part is unused and in its original packaging.
Return procedure for S9S08SG8E2CTGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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