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NXP Semiconductors S9S08SG8E2CTJ
- Part No.:
- S9S08SG8E2CTJ
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
S9S08SG8E2CTJ.pdf
- Description:
- IC MCU 8BIT 8KB FLASH 20TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,180
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Product details
Overview
S9S08SG8E2CTJ from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 8 KB flash, 512 B RAM, and integrated ADC, ACMP, SCI, SPI, I²C, TPM, RTC, and background debug interface. It operates at up to 40 MHz CPU frequency, supports stop3 low-power mode, and delivers real-time control in automotive body electronics and industrial sensor nodes.
For engineers reviewing the S9S08SG8E2CTJ datasheet, S9S08SG8E2CTJ pinout, S9S08SG8E2CTJ application, or S9S08SG8E2CTJ equivalent, key selection criteria include its 16-TSSOP package, −40 °C to 125 °C temperature rating, 10-bit 12-channel ADC with temperature sensor, single-wire BDM debug support, and LIN-capable SCI for automotive sub-systems.
Technical Context
The S9S08SG8E2CTJ implements the HCS08 CPU core with HC08 instruction set extension (including BGND), supporting up to 32 interrupt/reset sources and a 3-stage pipeline. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference (±1.5% deviation from −40 °C to 125 °C).
Peripherals are fully integrated on-die: 10-bit ADC runs in stop3 mode with automatic compare and internal bandgap reference; analog comparator (ACMP) supports edge-triggered interrupts and routing to TPM; SCI includes LIN master break generation and wake-on-edge; RTC uses a free-running 1 kHz on-chip oscillator for cyclic wake-up without external components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core with BGND instruction and 36–40 MHz operation (derated to 36 MHz above 125 °C) |
| Flash Memory | 8 KB on-chip flash with read/program/erase over full voltage/temperature range and block protection |
| RAM | 512 bytes of on-chip RAM accessible in all operating modes including stop3 |
| ADC | 12-channel, 10-bit resolution, 2.5 µs conversion time, internal temperature sensor, and bandgap reference channel |
| Power Modes | Two very low-power stop modes (stop2, stop3), reduced-power wait mode, and real-time interrupt capability in all modes |
| Debug Interface | Single-wire background debug (BDM) with one hardware breakpoint and on-chip ICE module (two comparators, nine trigger modes, eight-deep FIFO) |
| Operating Temp | −40 °C to +125 °C (industrial grade); not rated for 150 °C - high-temp variants use different orderable part numbers |
Pinout & Package
Package: 16-pin Thin Shrink Small Outline Package (16-TSSOP), 4.4 mm × 5.0 mm body, 0.65 mm pitch, lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power domains: VDD (digital supply), VSS (digital ground); separate VDDAD/VSSAD pins available for analog section isolation |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit bidirectional port with configurable pull-ups, slew rate, drive strength, and interrupt capability on all pins |
| PTB0–PTB7 | Port B general-purpose I/O | 8-bit bidirectional port; PTB6/SDA/XTAL supports I²C data or crystal input; PTB7/SCL/EXTAL supports I²C clock or crystal input |
| BKGD/MS | Background debug / mode select | Single-wire BDM communication and MCU mode configuration during reset; requires external pull-up |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; supports external reset generator or manual push-button |
| TPM1CH0–TPM1CH1 TPM2CH0–TPM2CH1 | Timer PWM outputs | Four dedicated PWM output pins across two 2-channel TPM modules; support edge- or center-aligned PWM with input capture and output compare |
Key Features
| Feature | Design Value |
|---|---|
| Stop3 Mode Operation | Entire MCU (including ADC, ACMP, RTC, and SCI wake logic) remains functional while CPU and bus clocks halt - enables µA-level system sleep with event-driven wake-up |
| Integrated Temperature Sensing | On-die temperature sensor connected to ADC channel provides calibrated thermal monitoring without external components |
| LIN-Capable SCI | SCI module generates and detects extended LIN breaks per ISO 9141-2 and SAE J2602, enabling cost-effective body control networking |
| Real-Time Counter (RTC) | 8-bit modulus counter with binary/decimal prescaler and free-running 1 kHz internal oscillator - supports calendar/time-of-day functions without external crystal |
| Flash Security & Protection | FLASH block protect and security byte prevent unauthorized read-out or reprogramming; FOPT/NVOPT registers enable field-configurable lock options |
Applications
| Automotive Door Module | Industrial Sensor Node |
|---|---|
Use Scenario: Centralized control of window lift, mirror adjustment, and interior lighting in vehicle door assemblies. IC Role / Device Role / Timing Role: Main system controller executing motor sequencing, LIN communication with body controller, and fault monitoring via ADC/ACMP. Use Value: Stop3 mode reduces quiescent current to <10 µA during vehicle sleep; integrated LIN-SCI eliminates external transceiver; 10-bit ADC monitors motor current and thermistor feedback. | Use Scenario: Battery-powered environmental monitor measuring temperature, humidity (via analog sensor), and ambient light in factory settings. IC Role / Device Role / Timing Role: Low-power data acquisition node with scheduled wake-up (RTC), sensor signal conditioning (ADC/ACMP), and UART-based telemetry reporting. Use Value: On-chip temperature sensor and bandgap reference enable self-calibrated measurements; RTC's 1 kHz oscillator allows precise 1-second sampling intervals without external timing components. |
| Smart HVAC Actuator | Appliance Motor Control |
Use Scenario: Position feedback and proportional control of damper actuators in commercial HVAC systems using potentiometer and PWM-driven DC motors. IC Role / Device Role / Timing Role: Closed-loop actuator controller interfacing with potentiometer (ADC), driving H-bridge (TPM PWM), and communicating status via I²C to main controller. Use Value: Ganged GPIO writes simplify multi-pin direction/state changes; TPM modules deliver jitter-free 16 kHz PWM for smooth motor commutation; ACMP provides fast overcurrent detection. | Use Scenario: Speed-regulated BLDC motor driver in washing machines, using hall-effect sensors and phase current sensing. IC Role / Device Role / Timing Role: Real-time motor commutation sequencer with hall input capture (TPM), current sense ADC sampling, and fault-safe shutdown logic. Use Value: Input capture on TPM channels precisely timestamps hall sensor edges; ADC conversion time (2.5 µs) supports >10 kHz sampling for current loop control; COP watchdog ensures fail-safe motor stop on software hang. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08SH8CTJ | 16 KB flash, same 16-TSSOP package, identical peripheral set but higher memory density and extended voltage range (2.7–5.5 V vs. 3.0–5.5 V) | Preferred where firmware growth headroom or wider supply tolerance is required - e.g., battery-backed industrial controllers | Select MC9S08SH8CTJ if future firmware expansion or brown-out resilience below 3.0 V is needed; pin-compatible but requires updated flash programming setup. |
| S9S08SG4E2CTJ | 4 KB flash, 256 B RAM, otherwise identical architecture, peripherals, and package; shares same datasheet revision (Rev. 8, Jan 2014) | Cost-optimized variant for simpler control tasks with minimal code footprint - e.g., basic LED drivers or single-sensor interfaces | Select S9S08SG4E2CTJ only when application fits within 4 KB flash and 256 B RAM; identical pinout and debug interface simplify migration. |
Compared with MC9S08SH8CTJ and S9S08SG4E2CTJ, the S9S08SG8E2CTJ offers optimal balance of memory (8 KB), low-power capability (stop3), and peripheral integration for mid-complexity embedded control - making it ideal for automotive sub-modules and industrial edge nodes where cost, size, and reliability are jointly constrained.
Availability
S9S08SG8E2CTJ is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart HVAC actuators, and appliance motor control requiring stable component supply across extended temperature ranges.
Supply support for S9S08SG8E2CTJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, mobile, and communication infrastructure markets.
The S9S08SG8E2CTJ belongs to the legacy HCS08 microcontroller family designed for cost-sensitive, low-power embedded control in harsh environments - emphasizing robustness, integrated analog peripherals, and debug simplicity for Tier 2 automotive and industrial applications.
FAQ
What is the maximum operating frequency of the S9S08SG8E2CTJ at 125 °C?
The S9S08SG8E2CTJ is rated for 36 MHz maximum CPU frequency when operating above 125 °C. At temperatures from −40 °C to 125 °C, it supports up to 40 MHz. This derating ensures timing margin and reliability under thermal stress. The S9S08SG8E2CTJ datasheet Rev. 8 (Jan 2014) specifies this limit explicitly in Section 1.1 and Appendix A electrical characteristics.
Does the S9S08SG8E2CTJ support LIN communication natively?
Yes, the S9S08SG8E2CTJ supports LIN communication through its SCI module, which includes hardware-assisted LIN master break generation and LIN slave extended break detection per ISO 9141-2 and SAE J2602. This capability is confirmed in the "Peripherals" section of the MC9S08SG8 datasheet Rev. 8 and requires no external transceiver for basic LIN node implementation. The S9S08SG8E2CTJ leverages this for automotive body electronics.
Can the S9S08SG8E2CTJ operate in stop3 mode while using the ADC?
Yes, the S9S08SG8E2CTJ supports full ADC operation-including conversions, automatic compare, and temperature sensor reads-while in stop3 mode. This is documented in Section 9.4.7 of the MC9S08SG8 datasheet Rev. 8. The ADC continues sampling using the internal bus clock or alternate clock source, enabling ultra-low-power data acquisition without waking the CPU. This feature is critical for battery-operated sensor nodes using the S9S08SG8E2CTJ.
What debug interface does the S9S08SG8E2CTJ provide, and is external hardware required?
The S9S08SG8E2CTJ features a single-wire background debug (BDM) interface compliant with the Freescale BDM specification. It requires only one dedicated pin (BKGD/MS) and supports in-circuit debugging, flash programming, and real-time register inspection. No external debug probe is mandatory - basic functionality works with NXP's DEMO9S08SG8 evaluation board or compatible BDM adapters. The S9S08SG8E2CTJ integrates on-chip debug logic eliminating need for JTAG headers.
Is the S9S08SG8E2CTJ pin-compatible with the S9S08SG4E2CTJ?
Yes, the S9S08SG8E2CTJ and S9S08SG4E2CTJ share identical 16-TSSOP package, pin assignment, and peripheral mapping per the MC9S08SG8/SG4 datasheet Rev. 8. Both parts use the same pinout diagram in Chapter 2 and support identical I/O configurations, interrupt routing, and peripheral pin multiplexing. Firmware and PCB layout can be reused directly - only flash size and RAM differ. This compatibility simplifies scaling across product tiers using the S9S08SG8E2CTJ or S9S08SG4E2CTJ.
S9S08SG8E2CTJ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 16
- Program Memory Size:
- 8KB (8K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512 x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08SG8E2CTJ FAQ
1.How can I place an order for S9S08SG8E2CTJ through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08SG8E2CTJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08SG8E2CTJ reliable?
The price and inventory of S9S08SG8E2CTJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG8E2CTJ is usually 5 days.
3.What payment methods are accepted for S9S08SG8E2CTJ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08SG8E2CTJ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S08SG8E2CTJ?
S9S08SG8E2CTJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08SG8E2CTJ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08SG8E2CTJ?
For technical support, including S9S08SG8E2CTJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG8E2CTJ requirements.
6.How does Aetrix verify that S9S08SG8E2CTJ is sourced from the original manufacturer or authorized distributors?
All S9S08SG8E2CTJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG8E2CTJ meets industry standards.
7.What is the process for return or replacement of S9S08SG8E2CTJ?
All S9S08SG8E2CTJ units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG8E2CTJ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08SG8E2CTJ part is unused and in its original packaging.
Return procedure for S9S08SG8E2CTJ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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