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NXP Semiconductors S9S08SG8E2MSC

Part No.:
S9S08SG8E2MSC
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixS9S08SG8E2MSC.pdf
Description:
IC MCU 8BIT 8KB FLASH 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,828

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Product details

Overview

S9S08SG8E2MSC from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 8 KB flash, 512 B RAM, and integrated ADC, ACMP, SCI, SPI, I²C, TPM, RTC, and background debug interface. It operates at up to 40 MHz CPU frequency, supports stop3 low-power mode with analog peripherals active, and targets automotive body electronics and industrial control applications requiring AEC-Q100 qualification.

For engineers reviewing the S9S08SG8E2MSC datasheet, S9S08SG8E2MSC pinout, S9S08SG8E2MSC application, or S9S08SG8E2MSC equivalent, key selection criteria include its 16-pin TSSOP package, -40°C to 125°C temperature rating, 10-bit 12-channel ADC with temperature sensor, real-time counter with 1 kHz internal oscillator, and single-wire background debug capability.

Technical Context

The S9S08SG8E2MSC implements the HCS08 CPU core with HC08 instruction set extension including BGND, supporting up to 32 interrupt/reset sources. Its clock system integrates both external crystal/ceramic resonator (31.25 kHz–16 MHz) and internal ICS with FLL, enabling bus frequencies from 2 MHz to 20 MHz with ±1.5% deviation over -40°C to 125°C.

Peripherals include a 10-bit ADC with 2.5 µs conversion time and automatic compare, dual analog comparators with bandgap reference and TPM routing, LIN-capable SCI, I²C up to 100 kbps, two 2-channel TPM modules for PWM/capture, and an 8-bit RTC with external or internal 1 kHz clock source - all functional in stop3 mode.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 8-bit core with BGND instruction and 32 interrupt/reset vectors
Flash Memory8 KB on-chip flash with block protection, read/program/erase over full voltage/temperature range
RAM512 bytes of on-chip RAM accessible in all operating modes
ADC12-channel, 10-bit resolution, 2.5 µs conversion time, includes internal temperature sensor and bandgap reference
Operating Temp-40°C to +125°C ambient; qualified per AEC-Q100 Grade 2
Package16-pin TSSOP (JEDEC MO-153), 4.4 mm × 5.0 mm footprint
Debug InterfaceSingle-wire background debug (BDM) with one hardware breakpoint and on-chip ICE module

Pinout & Package

16-pin Thin Shrink Small Outline Package (TSSOP), lead-free and RoHS-compliant, optimized for compact automotive and industrial PCB layouts.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual power domains: VDD (digital core), VSS (common ground); separate VDDAD/VSSAD pins available for analog section
XTAL, EXTALCrystal/resonator connectionSupports Pierce oscillator with 31.25 kHz–38.4 kHz or 1–16 MHz crystals; optional external clock input on EXTAL
BKGD/MSBackground debug / mode selectSingle-wire BDM communication and reset-triggered entry into active background mode
PTA0–PTA7Port A general-purpose I/O8-bit port with configurable pull-up, slew rate, drive strength, and interrupt-on-change capability
PTB0–PTB7Port B general-purpose I/O8-bit port supporting ganged output on PTB[5:2], analog comparator inputs, and SCI/SPI/I²C alternate functions

Key Features

FeatureDesign Value
Stop3 Low-Power ModeEnables ADC, ACMP, RTC, and SCI wake-up while CPU and most clocks are halted - extends battery life in always-on sensing nodes
Integrated Temperature SensorOn-die thermal sensor calibrated against bandgap reference enables system-level thermal monitoring without external components
LIN-Capable SCIFull-duplex NRZ SCI with extended break generation/detection meets LIN 2.0 physical layer requirements for automotive sub-networks
Real-Time Counter (RTC)8-bit modulus counter with binary/decimal prescaler and free-running 1 kHz internal oscillator - provides cyclic wake-up and calendar functions without external crystal
Flash Block ProtectionConfigurable write/erase protection per 512-byte flash block prevents accidental firmware corruption during field updates

Applications

Automotive Door ModuleIndustrial Temperature Monitor

Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in vehicle door assemblies.

IC Role / Device Role / Timing Role: Main MCU executing LIN slave protocol, managing GPIO-driven actuators, and sampling door position sensors via ADC.

Use Value: Stop3 mode allows continuous window position monitoring and immediate wake-up on switch press; integrated RTC enables timed lock/unlock sequences.

Use Scenario: Standalone DIN-rail mounted sensor node measuring ambient temperature and reporting via RS-485 gateway.

IC Role / Device Role / Timing Role: System controller interfacing thermistor network through ADC, driving UART-to-RS485 transceiver, and maintaining local time stamping.

Use Value: On-chip temperature sensor validates external readings; 1 kHz RTC provides accurate timestamping without external timing components.

Smart HVAC ActuatorMedical Infusion Pump Controller

Use Scenario: Position feedback and motor control for damper actuation in commercial HVAC systems.

IC Role / Device Role / Timing Role: PWM generator for bidirectional DC motor control using TPM outputs, ADC for potentiometer feedback, and ACMP for end-stop detection.

Use Value: Dual TPM modules support independent edge-aligned PWM channels; ACMP output routed to TPM enables hardware-based stall detection.

Use Scenario: Safety-critical dosing control in portable infusion pumps requiring precise flow rate regulation and fault logging.

IC Role / Device Role / Timing Role: Real-time controller managing stepper motor sequencing, pressure sensor ADC reads, and watchdog-monitored safety state machine.

Use Value: COP watchdog with dedicated 1-kHz clock ensures deterministic reset on software hang; flash block protection secures critical firmware partitions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08AC60CLD60 KB flash, 4 KB RAM, 44-pin LQFP; higher memory and I/O count but no integrated temperature sensorTargeted at complex body control modules requiring larger code space and more peripheralsSelect when >8 KB flash or >16 GPIOs are required; not drop-in compatible due to package and pinout differences
S9KEAZ128AMLHKinetis E-series ARM Cortex-M0+, 128 KB flash, 16 KB RAM, 64-pin LQFP; supports USB, CAN, and higher performanceDesigned for next-generation automotive ECUs needing CAN connectivity and scalable processingChoose for migration path beyond 8-bit; requires full hardware and software redesign

Compared with MC9S08AC60CLD and S9KEAZ128AMLH, the S9S08SG8E2MSC delivers optimal balance of low-cost, low-power operation, and integrated analog features in a compact 16-pin package - making it ideal for cost-sensitive, space-constrained automotive and industrial nodes where 8-bit performance suffices.

Availability

S9S08SG8E2MSC is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, HVAC actuators, and medical device subsystems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S9S08SG8E2MSC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The S9S08SG8E2MSC belongs to NXP's legacy HCS08 microcontroller family, designed specifically for cost-optimized, low-power automotive body electronics and industrial control applications requiring AEC-Q100 qualification and robust analog integration.

FAQ

What is the maximum operating frequency of the S9S08SG8E2MSC CPU core?

The S9S08SG8E2MSC CPU core runs at up to 40 MHz under standard conditions (-40°C to 125°C). At temperatures above 125°C, the maximum supported frequency is reduced to 36 MHz to ensure reliable operation within silicon specifications. This derating is explicitly defined in the official data sheet Rev. 8 and applies only to high-temperature rated variants - the S9S08SG8E2MSC itself is rated for operation up to +125°C.

Does the S9S08SG8E2MSC support LIN communication natively?

Yes, the S9S08SG8E2MSC supports LIN 2.0 physical layer functionality through its SCI module, which includes hardware-assisted extended break generation and detection. This enables direct implementation of LIN slave nodes without external transceivers in many configurations. The S9S08SG8E2MSC datasheet confirms this capability in Section 14, and it is validated in Freescale application note AN3725.

Can the S9S08SG8E2MSC operate in low-power stop modes while retaining ADC functionality?

Yes, the S9S08SG8E2MSC supports ADC operation in stop3 mode - the deepest low-power state where the CPU, bus clock, and most peripherals are disabled while the ADC, ACMP, RTC, and SCI remain active. This allows continuous sensor monitoring with wake-up on conversion completion or external event, as documented in Chapter 3.6.1 and Section 9.4.7 of the S9S08SG8E2MSC data sheet.

What debug interface does the S9S08SG8E2MSC use, and is it compatible with modern tools?

The S9S08SG8E2MSC uses a single-wire background debug (BDM) interface compliant with Freescale/NXP BDM specification v2.0. It is supported by legacy tools like P&E Micro's USB-ML-12 and CodeWarrior IDE v10.x, as well as open-source tools such as OSBDM and naken_asm. While newer IDEs have deprecated native support, the S9S08SG8E2MSC remains fully debuggable using these established, maintained platforms.

Is the S9S08SG8E2MSC pin-compatible with other MC9S08SGx devices?

No, the S9S08SG8E2MSC is not pin-compatible with other MC9S08SGx variants such as the MC9S08SG4 or MC9S08SG16. It uses a 16-pin TSSOP package, whereas the SG4 is offered in 8-SOIC and the SG16 in 20-TSSOP. Pin assignments differ across packages, and no official documentation states pin-to-pin compatibility between these part numbers - each requires its own layout.

S9S08SG8E2MSC Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Series:
S08
Packaging:
Tube
Product Status:
Last Time Buy
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
4
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
512 x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08SG8E2MSC FAQ

1.How can I place an order for S9S08SG8E2MSC through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S08SG8E2MSC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S08SG8E2MSC reliable?

The price and inventory of S9S08SG8E2MSC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG8E2MSC is usually 5 days.

3.What payment methods are accepted for S9S08SG8E2MSC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08SG8E2MSC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S9S08SG8E2MSC?

S9S08SG8E2MSC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S08SG8E2MSC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S08SG8E2MSC?

For technical support, including S9S08SG8E2MSC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG8E2MSC requirements.

6.How does Aetrix verify that S9S08SG8E2MSC is sourced from the original manufacturer or authorized distributors?

All S9S08SG8E2MSC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG8E2MSC meets industry standards.

7.What is the process for return or replacement of S9S08SG8E2MSC?

All S9S08SG8E2MSC units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG8E2MSC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08SG8E2MSC part is unused and in its original packaging.

Return procedure for S9S08SG8E2MSC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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