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NXP Semiconductors S9S08SG8E2MTGR

Part No.:
S9S08SG8E2MTGR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
16-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixS9S08SG8E2MTGR.pdf
Description:
IC MCU 8BIT 8KB FLASH 16TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,325

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Product details

Overview

S9S08SG8E2MTGR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 8 KB flash, 512 B RAM, and integrated ADC, ACMP, SCI, SPI, I²C, TPM, RTC, and background debug interface. It operates at up to 40 MHz CPU frequency, supports stop3 low-power mode, and includes internal clock source with FLL for 2–20 MHz bus frequencies. Used in automotive body electronics, industrial sensors, and battery-powered control modules.

For engineers reviewing the S9S08SG8E2MTGR datasheet, S9S08SG8E2MTGR pinout, S9S08SG8E2MTGR application, or S9S08SG8E2MTGR equivalent, key selection criteria include its 16-TSSOP package, -40°C to 125°C operating range, on-chip temperature sensor, real-time counter with 1 kHz oscillator, and single-wire background debug capability.

Technical Context

The S9S08SG8E2MTGR implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference (±1.5% deviation over –40°C to 125°C), enabling stable bus frequencies from 2 MHz to 20 MHz without external crystal.

Peripherals include a 12-channel 10-bit ADC (2.5 µs conversion, runs in stop3), dual analog comparators with bandgap reference and TPM routing, full-duplex SCI with LIN break support, and two 2-channel TPM modules supporting edge- or center-aligned PWM. All I/O pins feature configurable slew rate, drive strength, and hysteresis.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 8-bit core with BGND instruction and 36–40 MHz operation (derated to 36 MHz above 125°C)
Flash Memory8 KB on-chip flash with read/program/erase over full voltage/temperature range and block protection
RAM512 bytes of on-chip RAM accessible in all operating modes including stop3
ADC12-channel, 10-bit resolution, 2.5 µs conversion time, internal temperature sensor and bandgap reference channel
Power ModesTwo very low power stop modes (stop2, stop3), reduced power wait mode, and real-time interrupt wake-up in all modes
Clock SourcesInternal ICS with FLL (2–20 MHz bus), external crystal/ceramic resonator (31.25 kHz–16 MHz), and 1 kHz low-power RTC oscillator
I/O Pins16 GPIOs with configurable pull-up, hysteresis, slew rate, drive strength, and 8 interrupt-capable pins with selectable polarity

Pinout & Package

Package: 16-pin Thin Shrink Small Outline Package (TSSOP), RoHS-compliant, lead-free, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VDDSupply voltageCore and I/O supply (2.7–5.5 V); decoupling required per datasheet layout guidelines
VSSGroundDigital ground reference; separate analog ground (VSSAD) recommended for ADC/ACMP accuracy
PTA0/IRQGPIO / interrupt inputProgrammable interrupt pin with edge-selectable polarity; supports wake-up from stop modes
PTA1/TPM1CH0GPIO / timer channelConfigurable as general-purpose output or TPM1 channel 0 for input capture or PWM generation
PTB0/AD0/TPM2CH0GPIO / ADC input / timer channelAnalog input channel 0, also serves as TPM2 channel 0; multiplexed function requires software configuration
PTB1/AD1/TPM2CH1GPIO / ADC input / timer channelAnalog input channel 1, also serves as TPM2 channel 1; shares same port register control logic
PTB2/AD2/SCI1TXGPIO / ADC input / SCI transmitSCI1 serial transmit output; also functions as ADC channel 2; open-drain capable when configured for SCI
PTB3/AD3/SCI1RXGPIO / ADC input / SCI receiveSCI1 serial receive input; also functions as ADC channel 3; includes internal hysteresis for noise immunity
PTB4/AD4/SPI1MOSIGPIO / ADC input / SPI data outSPI1 master-out-slave-in; also ADC channel 4; supports bidirectional data flow in slave mode
PTB5/AD5/SPI1MISOGPIO / ADC input / SPI data inSPI1 master-in-slave-out; also ADC channel 5; automatically tri-stated during SPI master transmission
PTB6/SDA/IIC1GPIO / I²C dataI²C1 bidirectional data line with open-drain output and internal pull-up enable; supports multi-master arbitration
PTB7/SCL/IIC1GPIO / I²C clockI²C1 clock line with open-drain output; synchronized with internal bus clock for timing compliance
PTC0/AD6/TPM1CH1GPIO / ADC input / timer channelADC channel 6 and TPM1 channel 1; enables synchronized PWM and analog sampling in motor control
PTC1/AD7/TPM1CH2GPIO / ADC input / timer channelADC channel 7 and TPM1 channel 2; allows independent timing control for dual PWM outputs
RESETReset inputActive-low reset with internal pull-up; accepts external reset signal or watchdog timeout assertion
BKGD/MSBackground debug / mode selectSingle-wire debug interface pin; also selects active background mode during reset sequence

Key Features

FeatureDesign Value
On-chip temperature sensorIntegrated into ADC subsystem; enables closed-loop thermal monitoring without external components
Stop3 low-power modeRetains RAM and peripheral registers while disabling CPU and most clocks; wake-up via RTC, ACMP, or external interrupt
Real-time counter (RTC)8-bit modulus counter with binary/decimal prescaler and free-running 1 kHz internal oscillator for calendar/time-of-day functions
Single-wire background debugEnables in-circuit debugging using only BKGD/MS pin; supports breakpoint setting and on-chip ICE with 8-deep FIFO
Flash block protectionHardware-enforced write/erase lock for designated flash sectors; prevents accidental firmware corruption during field updates

Applications

Automotive Body Control ModuleIndustrial Temperature Sensor Node

Use Scenario: Centralized control of door locks, window lifts, and interior lighting in 12 V vehicle systems.

IC Role / Device Role / Timing Role: Main system controller executing CAN/LIN gateway logic, PWM motor drivers, and ADC-based switch monitoring.

Use Value: Integrated TPM PWM channels and LIN-capable SCI reduce external component count; stop3 mode extends battery life during vehicle sleep states.

Use Scenario: Standalone wireless sensor node measuring ambient temperature and reporting via UART or SPI to gateway MCU.

IC Role / Device Role / Timing Role: Primary sensing and processing unit with on-chip temperature sensor, ADC, and low-power RTC wake-up scheduler.

Use Value: Eliminates need for external temperature IC and crystal; 1 kHz RTC oscillator enables precise periodic wake-up without external timing components.

Smart Appliance Motor ControllerMedical Diagnostic Handheld

Use Scenario: Brushless DC motor commutation and current sensing in compact home appliances.

IC Role / Device Role / Timing Role: Real-time motor control processor managing six-step commutation, ADC-based current feedback, and fault detection.

Use Value: Dual TPM modules provide synchronized complementary PWM outputs; ACMP with bandgap reference enables fast overcurrent trip response.

Use Scenario: Portable diagnostic device requiring accurate analog front-end for ECG or pulse oximetry signal conditioning.

IC Role / Device Role / Timing Role: Signal acquisition controller handling analog sensor inputs, digital filtering, and USB/UART data streaming.

Use Value: 10-bit ADC with internal bandgap reference ensures consistent gain calibration; ganged I/O writes simplify LED status indicator control.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08SG4CTG4 KB flash, 256 B RAM, identical peripheral set and pinout; lower memory densityCost-sensitive designs with reduced firmware footprint and simpler feature requirementsSelect when application firmware fits within 4 KB and no additional flash headroom is needed for field updates
S9S08SG16E2MTGR16 KB flash, 1 KB RAM, same package and peripheral complement; higher memory capacityApplications requiring larger code space for protocol stacks, diagnostics, or future firmware expansionChoose when design anticipates firmware growth beyond 8 KB or requires dual-bank flash for safe OTA updates

Compared with MC9S08SG4CTG and S9S08SG16E2MTGR, the S9S08SG8E2MTGR provides optimal balance of memory (8 KB flash/512 B RAM), low-power capability (stop3), and peripheral integration for mid-complexity embedded control-making it ideal where cost, size, and feature set must be tightly aligned.

Availability

S9S08SG8E2MTGR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart appliance motor controllers, and medical handheld diagnostics requiring stable component supply across extended temperature ranges.

Supply support for S9S08SG8E2MTGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The S9S08SG8E2MTGR belongs to the legacy HCS08 microcontroller family designed for cost-sensitive, low-power embedded control in harsh environments-emphasizing robustness, integrated analog peripherals, and debug simplicity for rapid development.

FAQ

What is the maximum operating temperature specification for the S9S08SG8E2MTGR?

The S9S08SG8E2MTGR is rated for operation from –40°C to +125°C. It is not qualified for the high-temperature 150°C variant-those devices use different part numbering (e.g., suffix 'H') and are only offered in 16-TSSOP. The S9S08SG8E2MTGR maintains full electrical performance and flash reliability across its specified industrial temperature range.

Does the S9S08SG8E2MTGR support in-circuit debugging without additional hardware?

Yes, the S9S08SG8E2MTGR supports single-wire background debug using only the BKGD/MS pin-no dedicated JTAG header or external debugger probe is required. This interface enables breakpoint setting, memory inspection, and real-time register access during active execution, and is fully supported by standard Freescale/NXP Codewarrior and S32DS toolchains.

Can the S9S08SG8E2MTGR's ADC operate while the MCU is in stop3 mode?

Yes, the ADC in the S9S08SG8E2MTGR remains fully functional in stop3 mode, including automatic compare, temperature sensor readings, and conversions triggered by internal or external events. This capability allows continuous sensor monitoring with ultra-low power consumption-critical for battery-operated applications where wake-up latency must be minimized.

What clock sources are available for the S9S08SG8E2MTGR's real-time counter (RTC)?

The S9S08SG8E2MTGR's RTC can use either an external clock source (e.g., 32.768 kHz crystal) or the internal low-power oscillator (1 kHz, ±10% tolerance). The internal oscillator runs independently in all MCU modes-including stop3-enabling cyclic wake-up without external components, which simplifies PCB layout and reduces BOM cost.

Is the S9S08SG8E2MTGR pin-compatible with other members of the SG8 family?

Yes, the S9S08SG8E2MTGR in 16-TSSOP is pin-compatible with the MC9S08SG4CTG and S9S08SG16E2MTGR in the same package. All share identical pin assignments, electrical characteristics, and peripheral mapping-allowing memory-size-based scalability without PCB redesign or firmware porting effort.

S9S08SG8E2MTGR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
16-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
12
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
512 x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08SG8E2MTGR FAQ

1.How can I place an order for S9S08SG8E2MTGR through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S08SG8E2MTGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S08SG8E2MTGR reliable?

The price and inventory of S9S08SG8E2MTGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG8E2MTGR is usually 5 days.

3.What payment methods are accepted for S9S08SG8E2MTGR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08SG8E2MTGR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S9S08SG8E2MTGR?

S9S08SG8E2MTGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S08SG8E2MTGR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S08SG8E2MTGR?

For technical support, including S9S08SG8E2MTGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG8E2MTGR requirements.

6.How does Aetrix verify that S9S08SG8E2MTGR is sourced from the original manufacturer or authorized distributors?

All S9S08SG8E2MTGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG8E2MTGR meets industry standards.

7.What is the process for return or replacement of S9S08SG8E2MTGR?

All S9S08SG8E2MTGR units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG8E2MTGR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08SG8E2MTGR part is unused and in its original packaging.

Return procedure for S9S08SG8E2MTGR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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