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NXP Semiconductors S9S08SG8E2MTJ
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- Part No.:
- S9S08SG8E2MTJ
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
S9S08SG8E2MTJ.pdf
- Description:
- IC MCU 8BIT 8KB FLASH 20TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,860
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Product details
Overview
S9S08SG8E2MTJ from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 8 KB flash, 512 B RAM, and integrated peripherals including 10-bit ADC, analog comparator, SCI/IIC/SPI interfaces, TPM PWM timers, and RTC. It operates at up to 40 MHz CPU frequency, supports -40°C to 125°C temperature range, and targets embedded control in automotive body electronics and industrial sensors.
For engineers reviewing the S9S08SG8E2MTJ datasheet, S9S08SG8E2MTJ pinout, S9S08SG8E2MTJ application, or S9S08SG8E2MTJ equivalent, key selection criteria include its 16-pin TSSOP package, single-wire background debug interface, stop3 mode operation with ADC/ACMP active, internal clock source (ICS) with ±1.5% FLL accuracy over temperature, and LIN-compliant SCI for automotive network nodes.
Technical Context
The S9S08SG8E2MTJ implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources and two very low-power stop modes. Its ICS module integrates a frequency-locked loop (FLL) with precision-trimmed internal reference, enabling bus frequencies from 2 MHz to 20 MHz without external crystal.
Peripherals include a 12-channel 10-bit ADC with 2.5 µs conversion time and temperature sensor, dual 2-channel TPM modules supporting edge- or center-aligned PWM, and SCI with LIN master break generation and slave break detection - all functional in stop3 mode for ultra-low-power wake-up sensing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core with BGND instruction; enables on-chip debugging without dedicated debug pins. |
| Flash Memory | 8 KB on-chip flash with read/program/erase over full voltage/temperature; supports block protection for secure firmware updates. |
| RAM | 512 bytes of on-chip RAM; retains data in wait and stop3 modes for fast wake-up context preservation. |
| ADC | 12-channel, 10-bit resolution, 2.5 µs conversion time; includes internal bandgap reference and temperature sensor channel. |
| Operating Temp | -40°C to +125°C; qualified for under-hood automotive and industrial environments without derating. |
| Package | 16-pin TSSOP (JEDEC MO-153); footprint-compatible with MC9S08SG4E2MTJ and MC9S08SG8E2CTJ variants. |
| Debug Interface | Single-wire background debug (BDM); enables full in-circuit emulation with breakpoint support using only BKGD pin. |
Pinout & Package
16-pin Thin Shrink Small Outline Package (TSSOP), 4.4 mm × 5.0 mm body, 0.65 mm pitch. Pinout validated per MC9S08SG8 Rev. 8 datasheet Section 2.1 and Freescale mechanical drawing S9S08SG8E2MTJ.pdf.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power domains: VDD powers digital logic; separate VDDAD/VSSAD pins available for analog section isolation. |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit port with configurable pull-ups, slew rate, drive strength; PTA0–PTA1 support reset and BKGD functions. |
| PTB0–PTB7 | Port B general-purpose I/O | 8-bit port; PTB6/SDA and PTB7/SCL support I²C; PTB0–PTB1 support SCI TX/RX; ganged output option on PTB[5:2]. |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; supports external reset supervisor or manual reset button connection. |
| BKGD/MS | Background debug / mode select | Single-wire debug communication path; also selects boot mode (internal flash vs. test ROM) at power-on. |
Key Features
| Feature | Design Value |
|---|---|
| Stop3 Low-Power Mode | Entire MCU halted except RTC, ACMP, and ADC - enables sub-µA wake-up sensing with no external components. |
| Internal Clock Source (ICS) | FLL-based clock generator with ±1.5% deviation over -40°C to 125°C; eliminates need for external crystal in cost-sensitive designs. |
| LIN-Compliant SCI | Full-duplex NRZ SCI with hardware extended break generation/detection; meets LIN 2.1 physical layer timing for automotive sub-networks. |
| On-Chip Debug Module | Two comparators, nine trigger modes, eight-deep FIFO; supports tag/force breakpoints and real-time trace during development. |
| Flash Security | Block-level protection via FOPT/NVOPT registers; prevents unauthorized read-out or reprogramming of firmware in deployed units. |
Applications
| Automotive Door Module | Industrial Temperature Sensor Node |
|---|---|
|
Use Scenario: Central control unit managing window lift, mirror fold, and interior lighting in vehicle door panels. IC Role / Device Role / Timing Role: Main system controller executing motor control logic, LIN communication with body control module, and analog sensing of switch states and temperature. Use Value: Stop3 mode enables <1 µA sleep current while monitoring door open/close via ACMP; 10-bit ADC reads thermistor for cabin comfort adjustment. |
Use Scenario: Battery-powered wireless node measuring ambient temperature in HVAC ducts or factory machinery enclosures. IC Role / Device Role / Timing Role: Sensor fusion hub acquiring temperature via on-die sensor and external thermistor, then transmitting via SPI to RF transceiver. Use Value: On-chip 1 kHz RTC provides precise wake-up intervals; internal bandgap reference ensures stable ADC readings across voltage and temperature drift. |
| Smart Appliance Motor Control | Medical Infusion Pump Monitor |
|
Use Scenario: Brushless DC motor commutation and fault monitoring in washing machine drum drive. IC Role / Device Role / Timing Role: Real-time PWM generator (TPM modules), current sense ADC acquisition, and over-temperature shutdown supervisor. Use Value: Center-aligned PWM reduces EMI; ACMP compares motor phase voltage against reference for zero-crossing detection without external op-amps. |
Use Scenario: Safety-critical monitoring of syringe position, pressure, and battery level in portable infusion pumps. IC Role / Device Role / Timing Role: Fault-tolerant controller running COP watchdog, LVD reset, illegal opcode detection, and real-time dose scheduling via RTC. Use Value: Dual reset sources (COP + LVD) ensure fail-safe shutdown; FLASH block protect prevents accidental firmware corruption during field updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08SG4E2MTJ | 4 KB flash, 256 B RAM; identical peripheral set and pinout; lower memory density. | Suitable for simpler control tasks with minimal firmware footprint; same power/performance envelope in stop3 mode. | Select when application firmware fits within 4 KB and cost optimization is prioritized over future scalability. |
| S9S08SG8E2CTJ | Same 8 KB flash and peripherals, but rated for -40°C to 85°C commercial temperature range. | Not qualified for under-hood or high-temp industrial use; lacks high-temperature qualification testing. | Choose only for non-automotive consumer or office equipment where ambient temperature stays below 85°C. |
Compared with MC9S08SG4E2MTJ and S9S08SG8E2CTJ, the S9S08SG8E2MTJ uniquely combines 8 KB flash, 125°C rating, and 16-pin TSSOP in a single qualified automotive-grade part - enabling design reuse across thermal grades without PCB redesign.
Availability
S9S08SG8E2MTJ is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart appliance control, and medical device monitoring requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S9S08SG8E2MTJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now headquartered in Eindhoven, Netherlands, with R&D centers worldwide.
The S9S08SG8E2MTJ belongs to the legacy HCS08 microcontroller family designed for cost-sensitive, low-power embedded control in automotive, industrial, and consumer applications where reliability and toolchain maturity are critical.
FAQ
What is the maximum operating frequency of the S9S08SG8E2MTJ CPU core?
The S9S08SG8E2MTJ features an HCS08 CPU core rated for up to 40 MHz operation at temperatures ≤125°C. At higher ambient temperatures (>125°C), the maximum supported bus frequency is reduced to 36 MHz to maintain timing margin and reliability - a specification confirmed in the MC9S08SG8 Rev. 8 datasheet Section 1.1 and Appendix A electrical characteristics.
Does the S9S08SG8E2MTJ support LIN communication natively?
Yes, the S9S08SG8E2MTJ supports LIN communication through its SCI module, which includes hardware-assisted extended break generation (for LIN master) and extended break detection (for LIN slave), compliant with LIN 2.1 physical layer requirements. This capability is documented in Section 14 of the MC9S08SG8 Rev. 8 datasheet and requires no external transceiver for basic node functionality.
Can the S9S08SG8E2MTJ operate in ultra-low-power modes with analog peripherals active?
Yes, the S9S08SG8E2MTJ supports stop3 mode where the CPU, flash, and most peripherals are disabled while the RTC, ADC, and ACMP remain fully operational - enabling wake-up on analog threshold crossing or periodic sampling with typical current consumption below 1 µA. This behavior is verified in Section 3.6.1 and Chapter 9/8 of the MC9S08SG8 Rev. 8 datasheet.
What debug interface does the S9S08SG8E2MTJ use, and how many pins are required?
The S9S08SG8E2MTJ uses a single-wire background debug (BDM) interface implemented on the BKGD/MS pin, requiring only one dedicated signal plus VDD and VSS for full in-circuit debugging, breakpoint setting, and flash programming - eliminating the need for JTAG headers or additional debug pins in space-constrained layouts.
Is the S9S08SG8E2MTJ pin-compatible with other members of the SG8 family?
Yes, the S9S08SG8E2MTJ in 16-pin TSSOP is pin-compatible with MC9S08SG4E2MTJ (4 KB flash) and S9S08SG8E2CTJ (commercial temp grade), sharing identical pin assignments, peripheral mappings, and register layout - allowing hardware reuse across memory and temperature variants without PCB modification.
S9S08SG8E2MTJ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 16
- Program Memory Size:
- 8KB (8K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512 x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08SG8E2MTJ FAQ
1.How can I place an order for S9S08SG8E2MTJ through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08SG8E2MTJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08SG8E2MTJ reliable?
The price and inventory of S9S08SG8E2MTJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG8E2MTJ is usually 5 days.
3.What payment methods are accepted for S9S08SG8E2MTJ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08SG8E2MTJ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S08SG8E2MTJ?
S9S08SG8E2MTJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08SG8E2MTJ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08SG8E2MTJ?
For technical support, including S9S08SG8E2MTJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG8E2MTJ requirements.
6.How does Aetrix verify that S9S08SG8E2MTJ is sourced from the original manufacturer or authorized distributors?
All S9S08SG8E2MTJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG8E2MTJ meets industry standards.
7.What is the process for return or replacement of S9S08SG8E2MTJ?
All S9S08SG8E2MTJ units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG8E2MTJ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08SG8E2MTJ part is unused and in its original packaging.
Return procedure for S9S08SG8E2MTJ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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