NXP Semiconductors S9S08SG8E2VTGR
- Part No.:
- S9S08SG8E2VTGR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 16-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
S9S08SG8E2VTGR.pdf
- Description:
- IC MCU 8BIT 8KB FLASH 16TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:4,493
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S9S08SG8E2VTGR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 8 KB flash, 512 B RAM, and integrated ADC, ACMP, SCI, SPI, I²C, TPM, RTC, and background debug interface. It operates at up to 40 MHz (36 MHz above 125 °C), supports stop3 low-power mode, and targets automotive body electronics and industrial control systems requiring AEC-Q100 qualification and extended temperature operation.
For engineers reviewing the S9S08SG8E2VTGR datasheet, S9S08SG8E2VTGR pinout, S9S08SG8E2VTGR application, or S9S08SG8E2VTGR equivalent, key selection criteria include its 16-pin TSSOP package, -40 °C to +150 °C operating range, on-chip 10-bit ADC with temperature sensor, real-time counter with 1 kHz internal oscillator, and single-wire background debug interface for in-circuit development.
Technical Context
The S9S08SG8E2VTGR implements the HCS08 CPU core with HC08 instruction set extension (including BGND), supporting up to 32 interrupt/reset sources and two very low-power stop modes. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference (±1.5% deviation from −40 °C to 125 °C; ±3% above 125 °C), enabling bus frequencies from 2 MHz to 20 MHz without external crystal.
Peripherals include a 12-channel 10-bit ADC with 2.5 μs conversion time and automatic compare, a 5-V analog comparator with edge-selectable interrupt and bandgap reference option, and dual 2-channel TPM modules supporting input capture, output compare, and PWM generation. All critical peripherals-including ADC, ACMP, RTC, and SCI-remain functional in stop3 mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU, 40 MHz max (36 MHz >125 °C) |
| Flash Memory | 8 KB on-chip flash with block protection and read/program/erase over full voltage/temperature range |
| RAM | 512 bytes of on-chip RAM, retained in stop3 mode |
| ADC | 12-channel, 10-bit resolution, 2.5 μs conversion time, includes internal temperature sensor and bandgap reference channel |
| Real-Time Counter | 8-bit modulus counter with binary/decimal prescaler; runs free on 1 kHz internal oscillator in all modes including stop3 |
| Debug Interface | Single-wire background debug (BDM) with breakpoint support and on-chip ICE module (two comparators, nine trigger modes, eight-deep FIFO) |
| Operating Temperature | −40 °C to +150 °C (qualified per AEC-Q100 Grade 0) |
| Supply Voltage | 2.7 V to 5.5 V; low-voltage detect (LVD) with configurable reset/interrupt thresholds |
Pinout & Package
Package: 16-pin TSSOP (lead-free, RoHS-compliant, moisture sensitivity level 3). This package supports high-temperature operation up to +150 °C and is not available in 20-TSSOP or 8-SOIC variants for this grade.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power domains: VDD powers digital logic and I/O; VSS is common return; separate analog ground (VSSAD) and analog power (VDDAD) pins ensure ADC/ACMP noise immunity |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit bidirectional port with configurable pull-up, slew rate, drive strength, and interrupt-on-change capability; PTA0–PTA1 support alternate functions (SCI RX/TX) |
| PTB0–PTB7 | Port B general-purpose I/O | 8-bit bidirectional port; PTB6/PTB7 serve as I²C SDA/SCL; PTB0–PTB1 support SPI MOSI/MISO; all pins support ganged output and hysteresis |
| BKGD/MS | Background debug / mode select | Single-wire BDM communication and programming interface; also used during reset to select boot mode (internal flash vs. test mode) |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external reset signal or watchdog/COP timeout assertion |
| XTAL, EXTAL | Crystal/resonator connection | Supports 31.25 kHz–38.4 kHz or 1–16 MHz crystals/ceramic resonators; optional external clock input on EXTAL when XOSC disabled |
Key Features
| Feature | Design Value |
|---|---|
| Stop3 ultra-low-power mode | Enables RTC, ADC, ACMP, and SCI wake-up while consuming <1 μA typical; retains RAM and register state without external components |
| On-chip 1 kHz low-power oscillator | Provides precise time base for RTC and cyclic wake-up in all MCU modes - eliminates need for external 32.768 kHz crystal in battery-backed applications |
| Integrated temperature sensor | Calibrated 10-bit ADC channel enables system-level thermal monitoring without external sensors or calibration circuitry |
| Single-wire BDM interface | Reduces debug footprint to one pin; supports full in-circuit emulation including breakpoints, trace, and memory access without halting real-time operation |
| Peripheral clock gating | Independent enable/disable control per module (TPM, ADC, SCI, etc.) allows dynamic power optimization during runtime without firmware overhead |
| Flash security and protection | Configurable block-level flash protection prevents unauthorized read/write/erase; supports secure boot and intellectual property retention |
Applications
| Automotive Body Control Module | Industrial Sensor Node |
|---|---|
Use Scenario: Central controller for door lock actuation, window lift, mirror adjustment, and interior lighting in passenger vehicles. IC Role / Device Role / Timing Role: Main system MCU executing CAN/LIN gateway logic, PWM motor control, and analog sensor acquisition. Use Value: S9S08SG8E2VTGR's AEC-Q100 Grade 0 rating, 150 °C operation, and stop3 wake-up via LIN/SCI enable reliable operation in under-hood environments with minimal external components. | Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and vibration data in factory settings. IC Role / Device Role / Timing Role: Low-power data acquisition node with RTC-triggered sampling, ADC-based sensor interfacing, and SPI-connected transceiver. Use Value: S9S08SG8E2VTGR's 1 kHz internal RTC oscillator and stop3 current <1 μA extend battery life beyond 5 years while maintaining accurate time-stamped measurements. |
| Smart Actuator Driver | Appliance Motor Controller |
Use Scenario: Closed-loop DC motor driver for HVAC dampers or automated valves requiring position feedback and thermal derating. IC Role / Device Role / Timing Role: Real-time motion controller using TPM-generated PWM, ADC for current sensing, and ACMP for overcurrent detection. Use Value: S9S08SG8E2VTGR's simultaneous ADC+ACMP operation in stop3 mode allows continuous fault monitoring during idle periods without waking the CPU. | Use Scenario: Wash-cycle sequencer and motor speed regulator in front-load washing machines. IC Role / Device Role / Timing Role: Primary MCU managing user interface, water valve timing, spin cycle PWM, and thermal cutoff logic. Use Value: S9S08SG8E2VTGR's integrated temperature sensor and LVD/LVW features provide direct thermal and brown-out protection without adding discrete ICs or external references. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08SG4E2VTGR | 4 KB flash, 256 B RAM; identical peripheral set, package, and temperature rating | Lower memory footprint suits simpler control tasks (e.g., basic LED drivers, single-sensor nodes) | Select when code size ≤3.5 KB and no future feature expansion is planned |
| S9S08SG16E2VTGR | 16 KB flash, 1 KB RAM; same core, peripherals, and package; higher memory density only | Required for complex protocols (LIN stack + diagnostics), multi-sensor fusion, or bootloader-resident firmware updates | Select when application requires >8 KB flash or anticipates field-upgradable firmware |
Compared with MC9S08SG4E2VTGR and S9S08SG16E2VTGR, the S9S08SG8E2VTGR delivers optimal balance of memory headroom, peripheral integration, and thermal robustness for mid-tier automotive and industrial control - avoiding over-provisioning while ensuring upgrade path to 16 KB if needed.
Availability
S9S08SG8E2VTGR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart actuator drivers, and appliance motor controllers requiring stable component supply across extended temperature and long product lifecycles.
Supply support for S9S08SG8E2VTGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The S9S08SG8E2VTGR belongs to NXP's legacy HCS08 microcontroller family, designed specifically for cost-sensitive, high-reliability embedded control applications where extended temperature operation, low-power sleep modes, and integrated analog peripherals reduce BOM count and board space.
FAQ
What is the maximum operating temperature supported by the S9S08SG8E2VTGR?
The S9S08SG8E2VTGR is qualified for operation from −40 °C to +150 °C per AEC-Q100 Grade 0 specifications. This high-temperature rating is enabled by its 16-pin TSSOP package and process optimization, making it suitable for under-hood automotive applications and industrial environments where ambient heat exceeds standard commercial-grade limits. The S9S08SG8E2VTGR maintains full functionality - including ADC, RTC, and stop3 mode - across this entire range.
Does the S9S08SG8E2VTGR support in-circuit debugging without additional hardware?
Yes, the S9S08SG8E2VTGR integrates a single-wire background debug (BDM) interface accessible via the BKGD/MS pin. This allows full in-circuit emulation - including breakpoints, memory inspection, register read/write, and real-time execution control - using only a standard BDM pod or compatible debugger. No external JTAG header or auxiliary circuitry is required, reducing debug footprint and simplifying PCB layout for the S9S08SG8E2VTGR.
Can the S9S08SG8E2VTGR operate without an external crystal?
Yes, the S9S08SG8E2VTGR can operate entirely from its internal clock source (ICS) module, which includes a frequency-locked loop (FLL) and precision-trimmed internal reference oscillator. This configuration supports bus frequencies from 2 MHz to 20 MHz and eliminates the need for external crystals or resonators - a key advantage for cost-sensitive and space-constrained designs using the S9S08SG8E2VTGR.
What low-power modes are available on the S9S08SG8E2VTGR, and which peripherals remain active in stop3 mode?
The S9S08SG8E2VTGR supports two very low-power stop modes (stop2, stop3), reduced-power wait mode, and real-time interrupt capability in all states. In stop3 mode - its deepest low-power state - the S9S08SG8E2VTGR retains RAM and register contents while keeping the RTC, ADC, ACMP, SCI, and TPM modules fully operational and capable of generating wake-up events. Typical stop3 current is less than 1 μA.
Is the S9S08SG8E2VTGR pin-compatible with other members of the SG8 family?
Yes, the S9S08SG8E2VTGR is pin-compatible with other 16-pin TSSOP variants in the MC9S08SG8 family, including the MC9S08SG4E2VTGR and S9S08SG16E2VTGR. All share identical pin assignments, electrical characteristics, and thermal specifications - enabling drop-in memory scalability within the same PCB layout. This compatibility simplifies design reuse and migration paths for the S9S08SG8E2VTGR across different firmware complexity tiers.
S9S08SG8E2VTGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 16-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 12
- Program Memory Size:
- 8KB (8K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512 x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08SG8E2VTGR FAQ
1.How can I place an order for S9S08SG8E2VTGR through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08SG8E2VTGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08SG8E2VTGR reliable?
The price and inventory of S9S08SG8E2VTGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG8E2VTGR is usually 5 days.
3.What payment methods are accepted for S9S08SG8E2VTGR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08SG8E2VTGR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S08SG8E2VTGR?
S9S08SG8E2VTGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08SG8E2VTGR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08SG8E2VTGR?
For technical support, including S9S08SG8E2VTGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG8E2VTGR requirements.
6.How does Aetrix verify that S9S08SG8E2VTGR is sourced from the original manufacturer or authorized distributors?
All S9S08SG8E2VTGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG8E2VTGR meets industry standards.
7.What is the process for return or replacement of S9S08SG8E2VTGR?
All S9S08SG8E2VTGR units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG8E2VTGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08SG8E2VTGR part is unused and in its original packaging.
Return procedure for S9S08SG8E2VTGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S9S08SG8E2VTGR Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

