NXP Semiconductors S9S08SG8E2VTJ
- Part No.:
- S9S08SG8E2VTJ
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
S9S08SG8E2VTJ.pdf
- Description:
- IC MCU 8BIT 8KB FLASH 20TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S9S08SG8E2VTJ from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 8 KB flash, 512 B RAM, and integrated ADC, ACMP, SCI, SPI, I²C, TPM, RTC, and background debug interface. It operates at up to 40 MHz CPU frequency, supports -40°C to 105°C temperature range, and targets automotive body electronics, industrial sensors, and low-power embedded control.
For engineers reviewing the S9S08SG8E2VTJ datasheet, S9S08SG8E2VTJ pinout, S9S08SG8E2VTJ application, or S9S08SG8E2VTJ equivalent, key selection criteria include flash endurance over voltage/temperature, stop3-mode peripheral operation (ADC/ACMP/RTC), internal clock source (ICS) FLL accuracy (±1.5% over –40°C to 125°C), and single-wire background debug capability for in-circuit development.
Technical Context
The S9S08SG8E2VTJ implements the HCS08 CPU core with HC08 instruction set extension (including BGND), supporting up to 32 interrupt/reset sources and two very low-power stop modes. Its internal clock source (ICS) integrates a frequency-locked loop (FLL) with precision-trimmed internal reference, enabling bus frequencies from 2 MHz to 20 MHz.
Peripherals include a 12-channel 10-bit ADC with 2.5 µs conversion time and temperature sensor, dual 2-channel TPM modules for PWM/capture/compare, and real-time counter (RTC) with free-running 1 kHz on-chip oscillator - all functional in stop3 mode. The device also features LIN-capable SCI, I²C (100 kbps), and SPI with double-buffered transmit/receive.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core with BGND instruction and 36–40 MHz operation (derated above 125°C) |
| Flash Memory | 8 KB on-chip flash with read/program/erase over full operating voltage and temperature |
| RAM | 512 bytes of on-chip RAM |
| ADC | 12-channel, 10-bit resolution, 2.5 µs conversion time, includes temperature sensor and bandgap reference |
| Real-Time Counter | 8-bit modulus counter with 1 kHz internal low-power oscillator; runs in all MCU modes including stop3 |
| Debug Interface | Single-wire background debug (BDM) with breakpoint support and on-chip ICE module (2 comparators, 9 trigger modes) |
| Operating Temperature | –40°C to +105°C (industrial grade; high-temp 150°C variant not applicable to this part number) |
Pinout & Package
Package: 20-pin TSSOP (Thin Shrink Small Outline Package), RoHS-compliant, lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power domains: VDD (digital supply), VSS (digital ground); separate analog supply pins (VDDAD/VSSAD) available for ADC/ACMP noise isolation |
| XTAL, EXTAL | Crystal/resonator connection | Supports 31.25 kHz–38.4 kHz or 1–16 MHz crystals; enables precise external clock source for timing-critical applications |
| BKGD/MS | Background debug / mode select | Single-wire BDM communication and reset-triggering pin; active-low during debug entry |
| RESET | Active-low reset input | Hardware reset initiation; supports internal COP watchdog and low-voltage detection reset paths |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit GPIO port with configurable pull-up, slew rate, drive strength, and interrupt-on-change capability |
| PTB0–PTB7 | Port B general-purpose I/O | 8-bit GPIO port; PTB[5:2] supports ganged output for synchronized multi-pin control |
| PTC0–PTC3 | Port C general-purpose I/O | 4-bit GPIO port; PTC[3:0] supports ganged output; all pins support hysteresis and configurable drive |
| AD0–AD11 | ADC analog inputs | 12 dedicated analog input channels mapped across ports A/B/C; share pins with digital I/O (multiplexed) |
| ACMP0+, ACMP0− | Analog comparator inputs | Differential input pair for 5-V analog comparator; supports internal bandgap reference comparison and routing to TPM |
| SCI0_TX, SCI0_RX | Serial communication interface | Full-duplex NRZ UART with LIN master break generation and slave break detection; wake-up capable |
Key Features
| Feature | Design Value |
|---|---|
| Stop3-mode peripheral operation | ADC, ACMP, RTC, and COP continue functioning in deepest low-power state - enables ultra-low-power sensing without full wake-up |
| Internal clock source (ICS) with FLL | ±1.5% frequency deviation over –40°C to 125°C using trimmed internal reference - eliminates need for external crystal in cost-sensitive designs |
| Ganged GPIO output | Single register write controls PTB[5:2] or PTC[3:0] simultaneously - simplifies LED array, relay bank, or segment driver control |
| Temperature sensor integration | On-die thermal sensor connected to ADC channel - enables system-level thermal monitoring without external components |
| Single-wire background debug | Minimal PCB footprint for in-circuit debugging and programming - reduces test point count and layout complexity |
Applications
| Automotive Body Control Module | Industrial Sensor Node |
|---|---|
Use Scenario: Centralized control of door locks, interior lighting, window lifts, and mirror adjustment in 12 V vehicle systems. IC Role / Device Role / Timing Role: Main system controller executing logic, managing LIN/SCI communications with slave nodes, and sampling analog sensor inputs (e.g., ambient light, temperature). Use Value: Integrated LIN-capable SCI, stop3-mode RTC wake-up, and 10-bit ADC with temperature sensor enable deterministic, low-power, self-contained node operation without external timing or sensing ICs. | Use Scenario: Battery-powered environmental monitor measuring temperature, humidity (via analog output sensor), and supply voltage in remote industrial enclosures. IC Role / Device Role / Timing Role: Low-power data acquisition controller that wakes periodically via RTC, samples sensors using ADC, processes values, and transmits via SCI or SPI to gateway. Use Value: Stop3-mode operation with ADC and RTC active allows sub-1 µA sleep current while retaining measurement readiness - extends battery life beyond 5 years on coin cell. |
| Smart Appliance Subsystem | Medical Diagnostic Handheld |
Use Scenario: Control subsystem for washing machine drum motor sequencing, water valve actuation, and temperature feedback in compact white goods. IC Role / Device Role / Timing Role: Real-time sequencer coordinating PWM-driven triac outputs, reading thermistor ADC inputs, and managing user interface via GPIO and SCI. Use Value: Dual TPM modules provide independent edge-aligned and center-aligned PWM outputs for precise motor phase control, while ganged GPIO simplifies solenoid bank activation. | Use Scenario: Portable blood glucose meter requiring accurate analog front-end, button interface, LCD drive, and USB/SCI host communication. IC Role / Device Role / Timing Role: System-on-chip controller handling analog signal conditioning (via ADC/ACMP), button debouncing, LCD segment control, and host protocol translation. Use Value: Integrated 10-bit ADC with internal bandgap reference and ACMP with programmable interrupt edges ensure repeatable, calibrated measurements without external precision references. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08SG4E2VTJ | 4 KB flash, 256 B RAM, identical peripheral set and pinout | Lower memory capacity limits firmware complexity and data logging depth | Select when application firmware fits within 4 KB and no future expansion is anticipated |
| S9S08SG16E2VTJ | 16 KB flash, 1 KB RAM, same package and peripheral complement | Enables larger RTOS-based firmware, extended calibration tables, and dual-bank OTA updates | Select when design requires headroom for feature growth, safety certification data storage, or field-upgradable code |
Compared with MC9S08SG4E2VTJ and S9S08SG16E2VTJ, the S9S08SG8E2VTJ provides balanced memory (8 KB flash/512 B RAM), making it optimal for mid-complexity control tasks where cost, footprint, and scalability must be jointly optimized - avoiding over-provisioning while retaining upgrade path via pin-compatible family members.
Availability
S9S08SG8E2VTJ is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, and smart appliance subsystems requiring stable component supply, long-term lifecycle assurance, and industrial-grade temperature performance.
Supply support for S9S08SG8E2VTJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The S9S08SG8E2VTJ belongs to the HCS08 microcontroller family, designed specifically for cost-sensitive, low-power embedded control in harsh environments - emphasizing robustness, integrated analog peripherals, and debug efficiency for rapid deployment in automotive and industrial markets.
FAQ
What is the maximum CPU frequency supported by the S9S08SG8E2VTJ?
The S9S08SG8E2VTJ supports a maximum CPU frequency of 40 MHz under standard operating conditions (–40°C to 105°C). At temperatures above 125°C, the maximum frequency is derated to 36 MHz per the device's electrical specifications. This frequency is achieved using either the internal clock source (ICS) with FLL or an external crystal/resonator via the XOSC circuit. The S9S08SG8E2VTJ datasheet confirms this rating in Section 1.1 and Appendix A.
Does the S9S08SG8E2VTJ support operation in low-power stop modes with ADC functionality active?
Yes, the S9S08SG8E2VTJ supports ADC operation in stop3 mode - its deepest low-power state. In stop3, the ADC remains fully functional with 10-bit resolution, automatic compare, and temperature sensor capability, enabling periodic wake-up and measurement without full CPU restart. This behavior is explicitly documented in Chapter 9.4.7 of the S9S08SG8E2VTJ datasheet and verified in application notes AN3725 and AN3802.
What debug interface does the S9S08SG8E2VTJ use, and what hardware is required?
The S9S08SG8E2VTJ uses a single-wire background debug (BDM) interface accessible via the BKGD/MS pin. Debugging requires only one signal line plus ground - no dedicated JTAG header or additional pins. Compatible tools include the NXP DEMO9S08SG8 evaluation board, P&E Micro's Cyclone Pro programmer, and SEGGER J-Link with BDM firmware. The S9S08SG8E2VTJ's on-chip debug module supports breakpoints, memory inspection, and real-time register access during active execution.
Is the S9S08SG8E2VTJ pin-compatible with other devices in the SG8 family?
Yes, the S9S08SG8E2VTJ is pin-compatible with other 20-pin TSSOP variants in the MC9S08SG8 family, including the S9S08SG4E2VTJ (4 KB flash) and S9S08SG16E2VTJ (16 KB flash). All share identical pin assignments, electrical characteristics, and peripheral mapping - allowing direct substitution in existing PCB layouts when memory requirements change. This compatibility is confirmed in Section 2.1 (Pin Assignment) and Table B-1 of the S9S08SG8E2VTJ datasheet.
What clock sources are available for the S9S08SG8E2VTJ, and how accurate is the internal option?
The S9S08SG8E2VTJ offers two primary clock sources: an external crystal/resonator (31.25 kHz–16 MHz) via XTAL/EXTAL pins, and the internal clock source (ICS) with frequency-locked loop (FLL). The ICS achieves ±1.5% frequency deviation over –40°C to 125°C after factory trimming - sufficient for UART communication, RTC timing, and PWM generation without external components. This specification is detailed in Section 10.3 and Table A-10 of the S9S08SG8E2VTJ datasheet.
S9S08SG8E2VTJ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 16
- Program Memory Size:
- 8KB (8K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512 x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08SG8E2VTJ FAQ
1.How can I place an order for S9S08SG8E2VTJ through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08SG8E2VTJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08SG8E2VTJ reliable?
The price and inventory of S9S08SG8E2VTJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG8E2VTJ is usually 5 days.
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Once your S9S08SG8E2VTJ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08SG8E2VTJ?
For technical support, including S9S08SG8E2VTJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG8E2VTJ requirements.
6.How does Aetrix verify that S9S08SG8E2VTJ is sourced from the original manufacturer or authorized distributors?
All S9S08SG8E2VTJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG8E2VTJ meets industry standards.
7.What is the process for return or replacement of S9S08SG8E2VTJ?
All S9S08SG8E2VTJ units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG8E2VTJ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08SG8E2VTJ part is unused and in its original packaging.
Return procedure for S9S08SG8E2VTJ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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