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NXP Semiconductors S9S08SL16F1MTJ

Part No.:
S9S08SL16F1MTJ
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
20-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixS9S08SL16F1MTJ.pdf
Description:
IC MCU 8BIT 16KB FLASH 20TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,368

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Product details

Overview

S9S08SL16F1MTJ from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB flash, 1 KB RAM, and integrated LIN 2.0/SAE J2602 slave interface. It features a 40-MHz CPU, 10-bit ADC with temperature sensor, two analog comparators, and real-time counter. Used in automotive body electronics for LIN node control.

For engineers reviewing the S9S08SL16F1MTJ datasheet, S9S08SL16F1MTJ pinout, S9S08SL16F1MTJ application, or S9S08SL16F1MTJ equivalent, key selection criteria include LIN protocol compliance, 20-TSSOP package compatibility, stop3-mode operation with peripheral wake-up, and on-chip EEPROM programmability during flash execution.

Technical Context

The S9S08SL16F1MTJ implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference (±0.2% resolution, ±2% deviation over voltage/temperature), enabling bus frequencies from 2–20 MHz.

Peripherals include a dedicated Slave LIN Interface Controller (SLIC) compliant with LIN 2.0 and SAE J2602, supporting up to 120 kbps, full message buffering, automatic bit-rate synchronization, and checksum generation/verification. The ADC operates in stop3 mode with 2.5 μs conversion time and internal bandgap reference.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 8-bit core with 40-MHz max frequency and BGND instruction support
Flash Memory16 KB on-chip flash with read/program/erase over full operating voltage/temperature range
RAM1 KB random-access memory with security protection against unauthorized access
ADC16-channel, 10-bit resolution, 2.5 μs conversion time, includes temperature sensor and internal bandgap reference
LIN InterfaceSLIC module compliant with LIN 2.0 and SAE J2602, supports up to 120 kbps and automatic frame synchronization
Power ModesTwo very low-power stop modes (stop2, stop3), reduced-power wait mode, and real-time interrupt capability in all modes
Package20-pin TSSOP (thin shrink small outline package) per ordering code F1MTJ

Pinout & Package

Package: 20-pin TSSOP (Thin Shrink Small Outline Package), 0.65 mm pitch, body size 6.5 × 4.4 mm, lead count 20, exposed pad not present.

Pin/TerminalCircuit RoleDesign Meaning
VDDSupply voltageMain digital supply (2.7–5.5 V); powers CPU, RAM, flash, and most peripherals
VSSGroundDigital ground reference for VDD domain
XTALOscillator inputConnects to crystal or ceramic resonator (1–16 MHz or 31.25–38.4 kHz)
EXTALOscillator outputDrives external crystal/resonator; forms Pierce oscillator with XTAL
RESETReset inputActive-low asynchronous reset; internal pull-up enabled by default
BKGD/MSBackground debug / mode selectSingle-wire debug interface pin; also selects active background mode at power-on
PTA0–PTA7Port A I/O8-bit general-purpose port with configurable pull-up, slew rate, and drive strength; PTA0–PTA3 support pin interrupts
PTB0–PTB3Port B I/O4-bit general-purpose port; PTB0–PTB1 support analog comparator inputs ACMP0P/ACMP0N
AD0–AD7ADC input channelsShared with PTA0–PTA7 and PTB0–PTB3; selectable via APCTL registers
SLIC_TX / SLIC_RXLIN transceiver interfaceDedicated pins for LIN bus communication; SLIC handles protocol framing, checksum, and synchronization

Key Features

FeatureDesign Value
On-chip SLIC moduleFull hardware LIN 2.0/SAE J2602 slave implementation eliminates need for external LIN transceiver or software protocol stack
Stop3-mode peripheral operationADC, ACMP, RTC, and SLIC remain functional during deepest low-power state, enabling wake-up without full MCU restart
In-circuit EEPROM programmingEEPROM can be programmed and erased while executing code from flash memory, enabling field firmware updates and data logging
Internal clock trimmingICS supports ±0.2% resolution and ±2% stability over temperature/voltage, reducing need for external crystal in cost-sensitive applications
Security circuitryPrevents unauthorized read-out of flash, EEPROM, and RAM contents via background debug interface or illegal address access

Applications

Automotive Door ModuleSeat Position Control

Use Scenario: Centralized LIN node managing window lift, mirror adjustment, and lock actuation in vehicle door assemblies.

IC Role / Device Role / Timing Role: Primary LIN slave controller coordinating multiple actuators via standardized message frames and checksum validation.

Use Value: Reduces BOM cost by integrating LIN protocol handling, ADC for position feedback, and PWM for motor control in single 20-TSSOP package.

Use Scenario: Motor-driven seat track and backrest positioning with feedback from potentiometers and limit switches.

IC Role / Device Role / Timing Role: Sensor interface and motion controller using ADC inputs, analog comparators for switch detection, and TPM-generated PWM for DC motor drive.

Use Value: Enables precise closed-loop positioning with <2.5 μs ADC conversion and real-time interrupt wake-up from stop3 mode during idle periods.

Roof Console Switch PanelTrunk Release Actuator

Use Scenario: Occupant-controlled overhead console with ambient light sensing, map light dimming, and sunroof control.

IC Role / Device Role / Timing Role: Mixed-signal controller interfacing photoresistors (via ADC), driving LEDs (via GPIO/TPM), and communicating status over LIN bus.

Use Value: Integrates 16-channel ADC, temperature sensor, and internal bandgap reference to calibrate light sensing across temperature without external components.

Use Scenario: Electromechanical trunk latch release triggered by remote keyless entry or interior switch.

IC Role / Device Role / Timing Role: Safety-critical LIN slave node validating command authenticity, monitoring solenoid current (via ACMP), and providing timed actuation pulses.

Use Value: Leverages illegal opcode/address detection and COP watchdog with dedicated 1-kHz clock to ensure fail-safe behavior during power transients.

Equivalent & Alternatives

The following parts are listed as comparable options for similar LIN slave microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08SL8F1MTJ8 KB flash, 512 B RAM, identical peripheral set and pinout; lower memory densitySame automotive LIN slave use cases where firmware footprint ≤8 KB sufficesSelect when application code and data fit within reduced memory, enabling cost optimization without redesign
S9S08SG16E1MTJSame 16 KB flash/RAM but adds SPI and enhanced I²C; no SLIC - requires external LIN transceiverApplications needing SPI connectivity (e.g., EEPROM, display driver) and willing to add discrete LIN PHYChoose when system-level flexibility outweighs integration benefit, and board space allows external transceiver

Compared with MC9S08SL8F1MTJ and S9S08SG16E1MTJ, the S9S08SL16F1MTJ uniquely balances LIN protocol offload, memory headroom, and 20-TSSOP footprint - making it optimal for cost-constrained, space-limited automotive nodes requiring zero-software LIN stack overhead.

Availability

S9S08SL16F1MTJ is available at Aetrix Electronics and suitable for automotive body electronics, LIN-based sensor networks, and industrial control panels requiring stable component supply and long-term lifecycle support.

Supply support for S9S08SL16F1MTJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The S9S08SL16F1MTJ belongs to NXP's legacy HCS08 microcontroller family, designed specifically for cost-sensitive, low-power automotive LIN slave nodes requiring integrated protocol handling and mixed-signal peripheral integration.

FAQ

What is the maximum bus frequency supported by the S9S08SL16F1MTJ?

The S9S08SL16F1MTJ supports a maximum bus frequency of 20 MHz, achieved via its internal clock source (ICS) with frequency-locked loop (FLL). This is confirmed in the MC9S08EL32 Series and MC9S08SL16 Series Data Sheet Rev. 3, Section 8.1.2, which specifies 2–20 MHz operation under full temperature and voltage ranges. The S9S08SL16F1MTJ maintains timing integrity at this rate due to precision internal reference trimming.

Does the S9S08SL16F1MTJ include a hardware LIN interface?

Yes, the S9S08SL16F1MTJ integrates a dedicated Slave LIN Interface Controller (SLIC) compliant with LIN 2.0 and SAE J2602 standards. As documented in Chapter 12 of the datasheet, the SLIC handles bit-rate synchronization, checksum generation/verification, and full message buffering - eliminating software protocol stack overhead. This hardware LIN interface is a defining feature of the S9S08SL16F1MTJ.

Can the S9S08SL16F1MTJ operate in low-power stop modes while maintaining peripheral functionality?

Yes, the S9S08SL16F1MTJ supports stop3 mode, where the ADC, analog comparators, real-time counter (RTC), and SLIC remain fully operational and capable of generating wake-up interrupts. Per Section 3.6.1 and Chapter 10 of the datasheet, ADC conversions and SLIC frame reception continue autonomously during stop3, enabling responsive low-power operation without CPU intervention - a key capability of the S9S08SL16F1MTJ.

What package type does the S9S08SL16F1MTJ use, and is it RoHS-compliant?

The S9S08SL16F1MTJ uses a 20-pin TSSOP (Thin Shrink Small Outline Package) with 0.65 mm lead pitch, as specified in Appendix B of the MC9S08EL32 Series datasheet. All variants bearing the "MTJ" suffix, including the S9S08SL16F1MTJ, are RoHS-compliant and halogen-free per NXP's product change notices and packaging specifications dated 2008 onward.

Is on-chip EEPROM available in the S9S08SL16F1MTJ, and can it be programmed during flash execution?

Yes, the S9S08SL16F1MTJ includes in-circuit programmable EEPROM with erase-abort capability. Crucially, the datasheet (Section 4.5.10) confirms that EEPROM can be programmed and erased while the CPU executes code from flash memory - enabling runtime data logging, calibration storage, and firmware update staging without halting application execution. This dual-operation capability is a verified feature of the S9S08SL16F1MTJ.

S9S08SL16F1MTJ Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
20-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
512 x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08SL16F1MTJ FAQ

1.How can I place an order for S9S08SL16F1MTJ through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S08SL16F1MTJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S08SL16F1MTJ reliable?

The price and inventory of S9S08SL16F1MTJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SL16F1MTJ is usually 5 days.

3.What payment methods are accepted for S9S08SL16F1MTJ?

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4.How is shipping managed for S9S08SL16F1MTJ?

S9S08SL16F1MTJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S08SL16F1MTJ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S08SL16F1MTJ?

For technical support, including S9S08SL16F1MTJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SL16F1MTJ requirements.

6.How does Aetrix verify that S9S08SL16F1MTJ is sourced from the original manufacturer or authorized distributors?

All S9S08SL16F1MTJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SL16F1MTJ meets industry standards.

7.What is the process for return or replacement of S9S08SL16F1MTJ?

All S9S08SL16F1MTJ units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SL16F1MTJ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08SL16F1MTJ part is unused and in its original packaging.

Return procedure for S9S08SL16F1MTJ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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