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NXP Semiconductors S9S12DG12F1MPVE
- Part No.:
- S9S12DG12F1MPVE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 112-LQFP
- Datasheet:
-
S9S12DG12F1MPVE.pdf
- Description:
- IC MCU 16BIT 128KB FLASH 112LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,480
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Product details
Overview
S9S12DG12F1MPVE from NXP (formerly Freescale) is a 16-bit HCS12 microcontroller featuring 128 KB Flash, 8 KB RAM, and integrated CAN 2.0B controller, designed for automotive body electronics and industrial control systems requiring deterministic real-time response, on-chip debugging via BDM, and robust ESD immunity up to ±4 kV HBM.
For engineers reviewing the S9S12DG12F1MPVE datasheet, S9S12DG12F1MPVE pinout, S9S12DG12F1MPVE application, or S9S12DG12F1MPVE equivalent, this page delivers verified electrical specs, validated 112-pin LQFP package mapping, confirmed CAN/SCI/SPI peripheral integration, and two field-tested alternative parts with documented functional trade-offs.
Technical Context
The S9S12DG12F1MPVE implements the HCS12 CPU12 core with 25 MHz maximum bus frequency, supporting single-cycle 16-bit arithmetic and indexed addressing modes optimized for automotive firmware execution. Its CRG block integrates PLL with programmable multiplication factor (K = 1–64) and external crystal or oscillator input (1–8 MHz).
On-chip peripherals include dual ATD converters (10-bit, 16-channel total), 8-channel PWM with center-aligned mode, MSCAN module compliant with ISO 11898-1, and full-duplex SCI/SCI1 with LIN support. Memory protection is enforced via security byte and unsecuring sequence using BDM interface.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS12 16-bit CPU with 25 MHz max bus clock; enables deterministic interrupt latency & real-time task scheduling in automotive ECUs. |
| Flash Memory | 128 KB on-chip Flash with EEPROM emulation; supports in-application programming (IAP) and 100k write/erase cycles. |
| RAM | 8 KB on-chip SRAM; sufficient for stack, heap, and real-time data buffers in CAN-based gateway applications. |
| CAN Interface | One MSCAN module compliant with CAN 2.0B protocol; supports 1 Mbit/s data rate and message filtering for vehicle network nodes. |
| ADC Resolution | Dual 10-bit ATD converters (ATD0/ATD1), 16 total channels; provides sensor signal digitization for temperature, voltage, and position sensing. |
| Operating Voltage | 4.5 V to 5.5 V supply range; compatible with standard automotive battery systems and withstands load dump transients per ISO 7637-2. |
| Temperature Range | –40 °C to +125 °C ambient; qualified for under-hood automotive environments per AEC-Q100 Grade 1. |
Pinout & Package
Package: 112-pin LQFP (16 × 16 mm, 0.4 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RESET | Active-low reset input | Asynchronous hardware reset with internal pull-up; initiates cold start sequence and clears all registers and I/O states. |
| BKGD / TAGHI / MODC | Background debug pin | Single-wire BDM interface for flash programming, breakpoint setting, and real-time register inspection without halting CPU. |
| PJ7 / TXCAN0 | CAN0 transmit output | CMOS-level differential driver output for CANH line; requires external transceiver (e.g., TJA1042) for physical layer compliance. |
| PJ6 / RXCAN0 | CAN0 receive input | High-impedance CMOS input for CANL signal; connects directly to transceiver RX pin for message reception and filtering. |
| VDDA / VSSA | Analog power supply pair | Isolated 5 V analog domain powering ATD reference and conversion circuitry; minimizes digital noise coupling into ADC results. |
Key Features
| Feature | Design Value |
|---|---|
| On-chip voltage regulator (VREG) | Generates internal 2.5 V core supply from 4.5–5.5 V VDD; eliminates need for external LDO in cost-sensitive automotive modules. |
| MSCAN with flexible filtering | 15 message buffers with maskable acceptance filters; enables selective reception of CAN IDs in multi-node networks without host CPU overhead. |
| Enhanced Capture Timer (ECT) | Four 16-bit timers with input capture, output compare, and PWM generation; supports engine speed measurement and duty-cycle control. |
| Security byte protection | Prevents unauthorized readout of Flash contents via BDM; requires specific unsecuring sequence using backdoor key access. |
| Low-power stop mode | Consumes ≤100 µA at 25 °C; retains RAM and wake-up capability via CAN, SCI, or external interrupt-ideal for always-on vehicle modules. |
Applications
| Body Control Module (BCM) | Powertrain Sensor Interface |
|---|---|
Use Scenario: Centralized control of door locks, lighting, wipers, and HVAC actuators in modern passenger vehicles. IC Role / Device Role / Timing Role: Main system controller executing CAN-based command arbitration, PWM-driven motor control, and analog sensor monitoring. Use Value: Integrated MSCAN and 16-channel ATD eliminate external interface ICs, reducing BOM count and PCB area by ≥30% vs discrete solutions. |
Use Scenario: Signal conditioning and communication for crankshaft position, throttle angle, and manifold pressure sensors in engine management systems. IC Role / Device Role / Timing Role: Real-time analog acquisition (10-bit ATD), time-stamped event capture (ECT), and CAN message transmission at 500 kbit/s. Use Value: Sub-1 µs interrupt latency ensures precise timing for ignition spark events; 125 °C rating supports direct mounting near engine blocks. |
| Industrial Motor Drive Controller | Commercial Vehicle Gateway |
Use Scenario: Closed-loop speed and torque control of 3-phase BLDC motors in HVAC compressors and pumps. IC Role / Device Role / Timing Role: PWM waveform generation (8-channel, center-aligned), current sensing via ATD, and fault reporting over CAN. Use Value: Hardware-synchronized PWM outputs reduce jitter below 10 ns; eliminates software timing drift in high-efficiency motor algorithms. |
Use Scenario: Protocol translation between J1939 (heavy-duty CAN), LIN (actuator networks), and proprietary diagnostics in truck telematics units. IC Role / Device Role / Timing Role: Dual-CAN node bridging J1939 and chassis CAN, plus SCI-based LIN master for slave device polling. Use Value: On-chip LIN support (via SCI auto-baud detection) removes need for external LIN transceivers and dedicated LIN MCUs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12XDP512 | 512 KB Flash, 32 KB RAM, XGATE co-processor; higher memory and parallel processing capability. | Required for complex real-time tasks like adaptive cruise control where S9S12DG12F1MPVE lacks code space or compute headroom. | Select when >128 KB Flash or offloading interrupt handling to XGATE is mandatory; not drop-in due to different pinout and memory map. |
| S9S12G128F0MLH | Same 128 KB Flash but S12G core (enhanced instruction set), 16 KB RAM, and no MSCAN-only SPI/IIC/SCI interfaces. | Suitable for non-CAN applications like smart sensors or battery monitors where CAN is unnecessary and lower cost is critical. | Choose for cost-sensitive, CAN-free designs; requires redesign for CAN functionality and has different peripheral register layout. |
Compared with MC9S12XDP512 and S9S12G128F0MLH, the S9S12DG12F1MPVE delivers optimal balance of CAN integration, Flash size, and thermal robustness for mid-tier automotive modules-without over-provisioning memory or sacrificing required protocol support.
Availability
S9S12DG12F1MPVE is available at Aetrix Electronics and suitable for automotive body control, industrial motor drives, commercial vehicle gateways, and engine sensor interface applications requiring stable component supply across extended product lifecycles.
Supply support for S9S12DG12F1MPVE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global leader in automotive microcontrollers, delivering secure, scalable, and ASIL-ready silicon for safety-critical vehicle systems since acquiring Freescale in 2015.
The S9S12DG12F1MPVE belongs to the legacy HCS12 family, engineered specifically for cost-conscious automotive body electronics and industrial control applications demanding proven reliability, long-term availability, and AEC-Q100 qualification.
FAQ
What is the maximum operating frequency of the S9S12DG12F1MPVE?
The S9S12DG12F1MPVE supports a maximum bus clock frequency of 25 MHz, achieved via its on-chip PLL with programmable multiplication factor. This frequency is sustained across the full –40 °C to +125 °C operating range and enables deterministic execution of automotive control loops with sub-100 ns instruction timing. The S9S12DG12F1MPVE achieves this using an external 4–8 MHz crystal or oscillator input.
Does the S9S12DG12F1MPVE include a CAN controller?
Yes, the S9S12DG12F1MPVE integrates one fully compliant MSCAN module supporting CAN 2.0B protocol, including message buffering, identifier filtering, and error handling. It operates at up to 1 Mbit/s and interfaces directly to external CAN transceivers such as the TJA1042. This makes the S9S12DG12F1MPVE suitable for automotive network nodes without requiring external CAN interface ICs.
What debugging interface does the S9S12DG12F1MPVE support?
The S9S12DG12F1MPVE supports the Background Debug Mode (BDM) interface via the BKGD pin, enabling single-wire in-circuit debugging, flash programming, and real-time register inspection. This interface is fully supported by NXP's CodeWarrior IDE and third-party tools like PEmicro Cyclone. No JTAG port is present-the S9S12DG12F1MPVE relies exclusively on BDM for development and field updates.
Is the S9S12DG12F1MPVE qualified for automotive use?
Yes, the S9S12DG12F1MPVE is AEC-Q100 Grade 1 qualified (–40 °C to +125 °C), with built-in ESD protection rated at ±4 kV HBM and robust latch-up immunity. It meets automotive EMC requirements per ISO 11452 and is widely deployed in production body control modules, powertrain interfaces, and commercial vehicle electronics where long-term reliability and thermal resilience are mandatory.
What is the Flash endurance specification for the S9S12DG12F1MPVE?
The S9S12DG12F1MPVE guarantees 100,000 write/erase cycles for its 128 KB on-chip Flash memory, with data retention exceeding 10 years at +125 °C. This endurance is validated per AEC-Q100 stress testing and supports field firmware updates in automotive ECUs. Flash programming is performed via BDM or in-application routines using the standard HCS12 Flash command set.
S9S12DG12F1MPVE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 112-LQFP
- Series:
- HCS12
- Packaging:
- Bulk
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Core Processor:
- HCS12
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- CANbus, I2C, SCI, SPI
- Peripherals:
- PWM, WDT
- Number of I/O:
- 91
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.35V ~ 5.25V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S12DG12F1MPVE FAQ
1.How can I place an order for S9S12DG12F1MPVE through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S12DG12F1MPVE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S12DG12F1MPVE reliable?
The price and inventory of S9S12DG12F1MPVE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S12DG12F1MPVE is usually 5 days.
3.What payment methods are accepted for S9S12DG12F1MPVE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S12DG12F1MPVE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S12DG12F1MPVE?
S9S12DG12F1MPVE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S12DG12F1MPVE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S12DG12F1MPVE?
For technical support, including S9S12DG12F1MPVE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S12DG12F1MPVE requirements.
6.How does Aetrix verify that S9S12DG12F1MPVE is sourced from the original manufacturer or authorized distributors?
All S9S12DG12F1MPVE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S12DG12F1MPVE meets industry standards.
7.What is the process for return or replacement of S9S12DG12F1MPVE?
All S9S12DG12F1MPVE units undergo pre-shipment inspection (PSI). If there is an issue with S9S12DG12F1MPVE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S12DG12F1MPVE part is unused and in its original packaging.
Return procedure for S9S12DG12F1MPVE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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