NXP Semiconductors S9S12DT12F1MPVE
- Part No.:
- S9S12DT12F1MPVE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 112-LQFP
- Datasheet:
-
S9S12DT12F1MPVE.pdf
- Description:
- IC MCU 16BIT 128KB FLASH 112LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,013
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S9S12DT12F1MPVE from NXP (formerly Freescale) is a 16-bit HCS12 microcontroller with 128 KB Flash, 8 KB RAM, and integrated CAN 2.0B controller, designed for automotive body control and industrial embedded applications requiring real-time I/O management, deterministic timing, and robust communication. It operates at up to 25 MHz bus frequency, supports 5V tolerant I/O, and includes dual ATD converters (10-bit, 16-channel), 8-channel PWM, and enhanced capture timer.
For engineers reviewing the S9S12DT12F1MPVE datasheet, S9S12DT12F1MPVE pinout, S9S12DT12F1MPVE application, or S9S12DT12F1MPVE equivalent, key selection criteria include CAN interface support, Flash memory size, 5V I/O compatibility, on-chip voltage regulator operation, and background debug capability via BKGD pin.
Technical Context
The S9S12DT12F1MPVE implements the HCS12 CPU12 core with 16-bit data path and 24-bit address space, executing instructions in single-cycle or multi-cycle modes depending on addressing mode. Its CRG block integrates PLL with programmable multiplication factor (K = 1–64) and selectable oscillator source (crystal, ceramic resonator, or external clock).
Memory subsystem includes 128 KB on-chip Flash organized in 1 KB sectors with row programming, 8 KB RAM, and 1 KB EEPROM with 100K write cycles. Peripheral integration features two independent MSCAN modules, dual 10-bit ATD converters with simultaneous sampling, and 8-channel 8-bit PWM with center-aligned and edge-aligned modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS12 16-bit CPU with 24-bit address bus and 16-MHz max internal clock (25 MHz bus speed) |
| Flash Memory | 128 KB on-chip Flash with 1 KB sector erase, 100K program/erase cycles, and 10-year data retention |
| RAM | 8 KB on-chip RAM, fully static, accessible during all operating modes including WAIT and STOP |
| CAN Interface | Dual MSCAN 2.0B-compliant controllers supporting 1 Mbit/s baud rate and message buffering with priority arbitration |
| ADC | Dual 10-bit ATD converters: ATD0 (8-channel) and ATD1 (8-channel), with 7 µs conversion time and configurable sample-and-hold |
| I/O Voltage Tolerance | 5V-tolerant digital I/O pins (VDDX = 5 V), enabling direct interfacing with legacy automotive sensors and actuators |
| Operating Temperature | –40°C to +125°C ambient range, qualified per AEC-Q100 Grade 1 for automotive under-hood use |
Pinout & Package
Package: 112-pin LQFP (16 × 16 mm, 0.4 mm pitch, case 987), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RESET | Active-low reset input | Asynchronous hardware reset with internal pull-up; initiates full register initialization and Flash security lock release |
| BKGD / TAGHI / MODC | Background debug pin | Single-wire BDM interface for non-intrusive debugging, flash programming, and real-time register inspection |
| PJ7 / TXCAN0 | CAN0 transmit output | CMOS-level CAN high-speed differential transmitter output, requires external transceiver (e.g., MC33883) |
| PJ6 / RXCAN0 | CAN0 receive input | CMOS-level CAN receiver input, compatible with ISO 11898-2 compliant transceivers |
| VREGEN | Voltage regulator enable | Active-high control for internal 5V-to-2.5V regulator; enables VDDR/VSSR supply for core logic when asserted |
| XFC | PLL loop filter capacitor connection | Analog node for external RC filter (typically 10 kΩ + 1 nF) stabilizing PLL feedback loop bandwidth and jitter performance |
Key Features
| Feature | Design Value |
|---|---|
| On-chip voltage regulator | Integrated 2.5 V regulator (VDDR) powered from 5 V VDDX, eliminating need for external LDO in single-rail 5 V systems |
| Dual MSCAN modules | Independent CAN 2.0B controllers with 16-message mailboxes each, supporting concurrent transmission/reception without CPU intervention |
| Background Debug Mode (BDM) | Single-pin debug interface supporting flash erase/program, register read/write, and breakpoint execution without dedicated JTAG header |
| Flash security protection | Programmable security byte prevents unauthorized read-out of Flash contents; unsecuring requires mass erase via BDM command |
| Low-power modes | STOP (100 nA typical), Pseudo-STOP (10 µA), and WAIT (1 mA) modes with selective peripheral wake-up via CAN, IRQ, or timer events |
Applications
| Automotive Body Control Module (BCM) | Industrial Motor Drive Controller |
|---|---|
Use Scenario: Centralized control of door locks, lighting, wipers, and HVAC in passenger vehicles using LIN and CAN networks. IC Role / Device Role / Timing Role: Main system MCU coordinating sensor inputs (switches, temp sensors), actuator outputs (relays, drivers), and CAN message routing. Use Value: Dual CAN interfaces enable separation of powertrain and body networks; 128 KB Flash accommodates firmware updates and diagnostic stacks. |
Use Scenario: Closed-loop speed and position control of BLDC motors in factory automation equipment with analog current sensing and encoder feedback. IC Role / Device Role / Timing Role: Real-time motor control unit executing FOC algorithms, generating PWM signals, and sampling ADC channels synchronously. Use Value: Dual ATD converters allow simultaneous sampling of phase currents and DC bus voltage; 8-channel PWM supports three-phase bridge + auxiliary control. |
| Commercial Vehicle Telematics Gateway | Off-Highway Equipment Monitor |
Use Scenario: Aggregation and translation of J1939 messages from engine ECU, transmission, and ABS into cellular/GPS telemetry streams. IC Role / Device Role / Timing Role: Protocol gateway MCU managing multiple CAN buses, serial interfaces (SCI), and external modem communication. Use Value: 5V-tolerant I/O simplifies interface to legacy J1939 nodes; 8 KB RAM supports dual CAN buffer queues and TCP/IP stack overhead. |
Use Scenario: Monitoring hydraulic pressure, temperature, and operator inputs in construction machinery with harsh EMC and thermal environments. IC Role / Device Role / Timing Role: Ruggedized monitoring controller performing analog signal conditioning, fault detection, and CAN-based alarm reporting. Use Value: AEC-Q100 Grade 1 qualification ensures reliability at 125°C junction temperature; integrated voltage regulator reduces external component count. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12DG128CPVE | Same HCS12 core, 128 KB Flash, but lacks integrated voltage regulator (requires external 2.5 V supply); no VREGEN pin | Requires additional LDO and PCB area; suitable where 2.5 V rail already exists | Select when board-level 2.5 V regulation is available and cost-per-BOM is prioritized over integration |
| S912XDP512J1MALR | Enhanced S12X core (pipeline, faster instruction throughput), 512 KB Flash, 32 KB RAM, but larger 144-pin LQFP package | Higher code density and memory headroom for complex diagnostics or OTA update handling | Select for next-generation platforms needing scalability beyond 128 KB Flash and higher computational throughput |
Compared with MC9S12DG128CPVE, the S9S12DT12F1MPVE reduces external power components via its on-chip regulator; compared with S912XDP512J1MALR, it offers lower cost and smaller footprint for established designs not requiring X-core performance or extended memory.
Availability
S9S12DT12F1MPVE is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, and off-highway equipment monitoring requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant sourcing.
Supply support for S9S12DT12F1MPVE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in automotive microcontrollers dating to Motorola's original 68HC11.
The S9S12DT12F1MPVE belongs to NXP's legacy HCS12 family, engineered specifically for cost-sensitive, high-reliability automotive body electronics and industrial control where deterministic real-time response and CAN integration are essential.
FAQ
What is the maximum bus frequency supported by the S9S12DT12F1MPVE?
The S9S12DT12F1MPVE supports a maximum bus frequency of 25 MHz, achieved via its on-chip PLL with programmable multiplication factor (K = 1–64) and external crystal or oscillator input. This frequency is maintained across the full –40°C to +125°C operating range and is validated in the device's electrical characteristics table under "Bus Clock Frequency".
Does the S9S12DT12F1MPVE include an integrated voltage regulator?
Yes, the S9S12DT12F1MPVE includes an integrated 5V-to-2.5V voltage regulator controlled by the VREGEN pin. When VREGEN is asserted high, the regulator supplies VDDR (core logic voltage); this eliminates the need for an external 2.5 V LDO in single-rail 5 V designs, reducing BOM count and PCB area.
How many CAN controllers are integrated into the S9S12DT12F1MPVE?
The S9S12DT12F1MPVE integrates two independent MSCAN 2.0B-compliant controllers (CAN0 and CAN1), each supporting up to 1 Mbit/s baud rate, 16-message mailboxes, and automatic retransmission. Pins PJ7/PJ6 and PM5/PM4 are assigned to CAN0 and CAN1 respectively, with dedicated TX/RX functions.
What is the Flash memory endurance specification for the S9S12DT12F1MPVE?
The S9S12DT12F1MPVE specifies 100,000 program/erase cycles for its 128 KB on-chip Flash memory, with guaranteed 10-year data retention at +85°C. These values are confirmed in the "NVM Reliability Characteristics" section of the official device user guide and apply to standard row-programming operations.
Is the S9S12DT12F1MPVE pin-compatible with other HCS12 derivatives like the MC9S12DJ64?
No, the S9S12DT12F1MPVE is not pin-compatible with the MC9S12DJ64. While both belong to the HCS12 family and share architectural similarities, the S9S12DT12F1MPVE uses a 112-pin LQFP package with distinct pin assignments-including dual CAN, expanded PWM, and VREGEN-whereas the MC9S12DJ64 is offered in 80-pin QFP and 112-pin LQFP variants with different peripheral mappings and no integrated regulator.
S9S12DT12F1MPVE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 112-LQFP
- Series:
- HCS12
- Packaging:
- Bulk
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Core Processor:
- HCS12
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- CANbus, I2C, SCI, SPI
- Peripherals:
- PWM, WDT
- Number of I/O:
- 91
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.35V ~ 5.25V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S12DT12F1MPVE FAQ
1.How can I place an order for S9S12DT12F1MPVE through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S12DT12F1MPVE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S12DT12F1MPVE reliable?
The price and inventory of S9S12DT12F1MPVE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S12DT12F1MPVE is usually 5 days.
3.What payment methods are accepted for S9S12DT12F1MPVE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S12DT12F1MPVE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S12DT12F1MPVE?
S9S12DT12F1MPVE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S12DT12F1MPVE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S12DT12F1MPVE?
For technical support, including S9S12DT12F1MPVE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S12DT12F1MPVE requirements.
6.How does Aetrix verify that S9S12DT12F1MPVE is sourced from the original manufacturer or authorized distributors?
All S9S12DT12F1MPVE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S12DT12F1MPVE meets industry standards.
7.What is the process for return or replacement of S9S12DT12F1MPVE?
All S9S12DT12F1MPVE units undergo pre-shipment inspection (PSI). If there is an issue with S9S12DT12F1MPVE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S12DT12F1MPVE part is unused and in its original packaging.
Return procedure for S9S12DT12F1MPVE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S9S12DT12F1MPVE Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

