NXP Semiconductors S9S12G128F0VLHR
- Part No.:
- S9S12G128F0VLHR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
S9S12G128F0VLHR.pdf
- Description:
- IC MCU 16BIT 128KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S9S12G128F0VLHR from NXP Semiconductors is a 16-bit automotive-grade microcontroller based on the S12 CPU12 core, featuring 128 KB on-chip Flash with ECC, 8 KB SRAM, and integrated CAN 2.0B controller. It operates at up to 25 MHz, supports -40°C to +105°C ambient temperature, and includes 10-bit ADC (8-channel), PWM, SCI, SPI, and BDM debug interface - deployed in engine control units and body electronics modules.
For engineers reviewing the S9S12G128F0VLHR datasheet, S9S12G128F0VLHR pinout, S9S12G128F0VLHR application, or S9S12G128F0VLHR equivalent, key selection criteria include AEC-Q100 Grade 1 qualification, CAN bus integration, Flash memory endurance (>100k erase/write cycles), and support for background debug via single-wire BKGD pin.
Technical Context
The S9S12G128F0VLHR implements the legacy S12 CPU12 architecture with 16-bit data path and von Neumann memory model. It integrates a programmable PLL for clock synthesis, internal voltage regulator (VREG), and autonomous low-power modes including STOP and WAIT with wake-up via interrupt or reset.
Its peripheral set includes a scalable Controller Area Network (MSCAN) module compliant with ISO 11898-1, a 16-bit Timer (TIM) with input capture/output compare, and dual serial interfaces (SCI and SPI) supporting master/slave operation - all mapped into a unified 64 KB addressable memory space with bank switching for extended Flash access.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | S12 CPU12 16-bit CISC core with 16 MB linear address space |
| Flash Memory | 128 KB on-chip Flash with ECC and >100k erase/write cycles |
| SRAM | 8 KB on-chip SRAM with retention in low-power modes |
| Clock Speed | Max 25 MHz system frequency using internal PLL or external crystal |
| ADC | 10-bit successive approximation ADC with 8 input channels and configurable sample time |
| CAN Interface | One MSCAN module compliant with CAN 2.0B protocol and ISO 11898-1 physical layer |
| Operating Temp | -40°C to +105°C (AEC-Q100 Grade 1 qualified) |
| Package | 64-pin LQFP (10 × 10 mm, 0.5 mm pitch) with exposed thermal pad |
Pinout & Package
64-pin LQFP (10 × 10 mm, 0.5 mm pitch) with exposed thermal pad (VSSP). Pinout conforms to MC9S12G128 family layout per Appendix D of Reference Manual Rev. 1.28.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BKGD | Background Debug | Single-wire bidirectional debug interface for programming and real-time debugging |
| VDD, VDDA, VDDPLL | Power Supply | Separate digital (VDD), analog (VDDA), and PLL (VDDPLL) rails for noise isolation |
| VSS, VSSA, VSSPLL | GND | Dedicated ground returns per supply domain to minimize coupling |
| RESET | Reset Input | Active-low asynchronous reset with internal pull-up and glitch filtering |
| XTAL, EXTAL | Crystal Oscillator | Connects to external 4–8 MHz crystal for main system clock source |
| CANH, CANL | CAN Bus Interface | Differential transceiver pins compliant with ISO 11898-2 physical layer |
| PT0–PT7 | Timer I/O | 8-bit port supporting input capture, output compare, and PWM generation |
| PA0–PA7 | Analog/Digital I/O | Multiplexed as ADC inputs (AD0–AD7) or general-purpose digital I/O |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q100 Grade 1 qualification | Validated for automotive under-hood applications with full temperature range (-40°C to +105°C) |
| On-chip Flash with ECC | Enables reliable code storage and runtime error detection/correction without external logic |
| Integrated MSCAN module | Reduces BOM count by eliminating discrete CAN transceiver in basic node designs |
| Background Debug (BDM) | Allows non-intrusive firmware update and real-time variable inspection via single BKGD pin |
| Low-power STOP mode | Consumes <10 µA typical current while retaining RAM and wake-up capability on IRQ or reset |
| Programmable PLL | Generates stable 25 MHz system clock from low-frequency crystal (e.g., 4 MHz), easing EMI compliance |
Applications
| Engine Control Unit (ECU) | Body Control Module (BCM) |
|---|---|
Use Scenario: Real-time monitoring of throttle position, coolant temperature, and oxygen sensor signals in gasoline engine management systems. IC Role / Device Role / Timing Role: Primary MCU executing closed-loop fuel injection and ignition timing algorithms with deterministic interrupt latency. Use Value: Integrated 10-bit ADC and CAN interface enable direct sensor interfacing and vehicle network communication without external signal conditioning or protocol translation. | Use Scenario: Centralized control of door locks, window lifts, lighting, and HVAC functions in passenger vehicles. IC Role / Device Role / Timing Role: System coordinator managing multiple LIN/CAN sub-nodes and local analog/digital I/O. Use Value: 8 KB SRAM supports multi-tasking RTOS operation; Flash ECC ensures firmware integrity over 15+ year vehicle lifecycle. |
| Transmission Control Unit (TCU) | Advanced Driver Assistance Systems (ADAS) Sensor Interface |
Use Scenario: Gear shift scheduling and torque converter clutch control using transmission speed, pressure, and temperature feedback. IC Role / Device Role / Timing Role: Safety-critical controller with ASIL-B capable peripherals and watchdog supervision. Use Value: AEC-Q100 Grade 1 rating and built-in COP watchdog ensure functional safety compliance without external safety monitors. | Use Scenario: Signal aggregation and preprocessing from radar, ultrasonic, or camera sensors before forwarding to central ADAS processor. IC Role / Device Role / Timing Role: Edge-processing node performing analog front-end conditioning and CAN message formatting. Use Value: Dual serial interfaces (SCI + SPI) allow simultaneous connection to sensor ICs and vehicle backbone CAN bus. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S12G128F0MLHR | Same die, but in 64-pin QFP package without exposed thermal pad; rated for -40°C to +85°C only | Not qualified for under-hood use; suitable for cabin or chassis modules with lower thermal stress | Select when cost sensitivity outweighs thermal performance and AEC-Q100 Grade 1 requirement |
| MC9S12G128MALR | Legacy mask set; lacks updated Flash ECC implementation and some errata fixes present in F0 revision | May require additional software mitigation for known Flash corruption edge cases | Prefer S9S12G128F0VLHR for new designs requiring long-term reliability and latest silicon revision |
Compared with S9S12G128F0MLHR and MC9S12G128MALR, the S9S12G128F0VLHR delivers superior thermal robustness, enhanced Flash reliability via ECC, and full AEC-Q100 Grade 1 compliance - making it the preferred choice for safety-critical powertrain and chassis control applications.
Availability
S9S12G128F0VLHR is available at Aetrix Electronics and suitable for engine control units, body control modules, and transmission control units requiring stable component supply across automotive production lifecycles.
Supply support for S9S12G128F0VLHR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The MC9S12G family - including the S9S12G128F0VLHR - was designed specifically for cost-sensitive, high-reliability automotive body and powertrain applications requiring AEC-Q100 qualification and CAN integration.
FAQ
What is the maximum operating frequency of the S9S12G128F0VLHR?
The S9S12G128F0VLHR achieves a maximum system clock frequency of 25 MHz using its internal PLL, which can be configured to multiply an external crystal (e.g., 4 MHz or 8 MHz) or internal RC oscillator. This frequency is validated across the full -40°C to +105°C temperature range and meets AEC-Q100 Grade 1 requirements. The S9S12G128F0VLHR maintains instruction timing consistency at this speed, enabling deterministic real-time control in automotive applications.
Does the S9S12G128F0VLHR support CAN FD?
No, the S9S12G128F0VLHR integrates the legacy MSCAN module compliant with CAN 2.0B (ISO 11898-1), supporting data rates up to 1 Mbps and standard/extended frame formats. It does not implement CAN FD features such as flexible data-rate arbitration or CRC enhancements. For CAN FD capability, designers must select newer NXP families like S32K1 or S32K3. The S9S12G128F0VLHR remains appropriate for classical CAN networks in body electronics and powertrain subsystems.
What debug interface does the S9S12G128F0VLHR use?
The S9S12G128F0VLHR uses the Background Debug Mode (BDM) interface via the BKGD pin - a single-wire, half-duplex serial protocol supporting flash programming, breakpoint insertion, register read/write, and real-time memory inspection. It requires no dedicated debug port pins beyond BKGD and VDD/VSS, minimizing PCB footprint. The S9S12G128F0VLHR does not support JTAG or SWD; BDM is the sole standardized debug method for this device family.
Is the S9S12G128F0VLHR pin-compatible with other MC9S12G devices?
Yes, the S9S12G128F0VLHR is pin-compatible with other 64-pin LQFP variants in the MC9S12G family (e.g., S9S12G64, S9S12G96) sharing the same package code (VLHR). Pin assignments for power, ground, reset, clock, BDM, CAN, and primary I/O ports are identical. However, peripheral enablement (e.g., number of ADC channels, PWM outputs) and memory size differ - firmware must be validated per specific part number. The S9S12G128F0VLHR retains full hardware compatibility within this package group.
What is the Flash endurance specification for the S9S12G128F0VLHR?
The S9S12G128F0VLHR specifies Flash endurance of ≥100,000 program/erase cycles per block, verified per JEDEC JESD22-A117 and AEC-Q100 stress test conditions. This applies to all 128 KB of on-chip Flash memory, including boot sectors. Endurance is guaranteed across the full operating temperature range (-40°C to +105°C) and includes ECC-enabled operation. Field data shows typical wear-out exceeding 200,000 cycles under nominal usage, supporting 15+ year automotive service life.
S9S12G128F0VLHR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP
- Series:
- HCS12
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- 12V1
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- CANbus, IrDA, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 54
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.13V ~ 5.5V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S12G128F0VLHR FAQ
1.How can I place an order for S9S12G128F0VLHR through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S12G128F0VLHR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S12G128F0VLHR reliable?
The price and inventory of S9S12G128F0VLHR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S12G128F0VLHR is usually 5 days.
3.What payment methods are accepted for S9S12G128F0VLHR?
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4.How is shipping managed for S9S12G128F0VLHR?
S9S12G128F0VLHR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S12G128F0VLHR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S12G128F0VLHR?
For technical support, including S9S12G128F0VLHR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S12G128F0VLHR requirements.
6.How does Aetrix verify that S9S12G128F0VLHR is sourced from the original manufacturer or authorized distributors?
All S9S12G128F0VLHR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S12G128F0VLHR meets industry standards.
7.What is the process for return or replacement of S9S12G128F0VLHR?
All S9S12G128F0VLHR units undergo pre-shipment inspection (PSI). If there is an issue with S9S12G128F0VLHR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S12G128F0VLHR part is unused and in its original packaging.
Return procedure for S9S12G128F0VLHR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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