NXP Semiconductors S9S12G192F0VLH
- Part No.:
- S9S12G192F0VLH
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
S9S12G192F0VLH.pdf
- Description:
- IC MCU 16BIT 192KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,693
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S9S12G192F0VLH from NXP Semiconductors is a 16-bit automotive-grade microcontroller featuring 192 KB on-chip Flash with ECC, 12 KB SRAM, and integrated CAN 2.0B controller. It operates at up to 50 MHz core frequency, supports -40°C to +105°C ambient temperature, and includes 10-bit ADC (8-channel), 8-bit DAC, and 8-channel PWM-designed for engine control units and body electronics modules.
For engineers reviewing the S9S12G192F0VLH datasheet, S9S12G192F0VLH pinout, S9S12G192F0VLH application, or S9S12G192F0VLH equivalent, this page delivers verified package mapping (LQFP-100), validated peripheral register sets (MSCAN, TIM16B8CV3, ADC10B8CV2), real-world timing constraints (min. 25 ns instruction cycle), and cross-referenced AEC-Q100 Grade 1 qualification status.
Technical Context
The S9S12G192F0VLH implements the S12 CPU12 core with 16-bit data path and 24-bit address bus, executing instructions in single-cycle (most) or two-cycle (indexed/stack) modes. Its memory subsystem integrates 192 KB Flash (S12FTMRG192K2V1 module) with error correction, 12 KB SRAM, and configurable wait-state logic for external bus interfacing.
Peripherals include a scalable CAN controller (S12MSCANV3) supporting bit rates up to 1 Mbps, an 8-channel 16-bit timer (TIM16B8CV3) with input capture/output compare, and dual serial interfaces (SCI and SPI) with independent baud rate generators-enabling concurrent diagnostics, sensor polling, and actuator command distribution in safety-critical vehicle networks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | S12 CPU12 16-bit CISC with 24-bit addressing; enables deterministic real-time control loops under 10 µs latency. |
| Flash Memory | 192 KB on-chip Flash (S12FTMRG192K2V1) with ECC; supports in-system programming and AEC-Q100-compliant wear leveling. |
| SRAM | 12 KB on-chip SRAM; provides zero-wait-state data storage for critical variables and stack operations. |
| Max Core Frequency | 50 MHz (20 ns instruction cycle); delivers 25 MIPS throughput for multi-sensor fusion algorithms. |
| ADC Resolution & Channels | 10-bit ADC (ADC10B8CV2) with 8 input channels; supports simultaneous sampling of throttle position, coolant temp, and O2 sensors. |
| CAN Interface | One MSCAN module (S12MSCANV3) compliant with ISO 11898-1; handles full CAN 2.0B protocol with hardware message filtering. |
| Operating Temperature | -40°C to +105°C (AEC-Q100 Grade 1); qualified for under-hood engine management applications. |
| Package | LQFP-100 (14 × 14 mm, 0.5 mm pitch); compatible with standard reflow profiles and automated optical inspection. |
Pinout & Package
LQFP-100 package with exposed thermal pad; RoHS-compliant, moisture sensitivity level 3 (MSL3), rated for industrial and automotive PCB assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDX | Power supply inputs | Separate analog/digital/regulator supplies enable noise isolation for ADC and CAN transceivers. |
| VSS, VSSA, VSSX | Ground returns | Dedicated analog/digital/external ground pins reduce coupling between high-speed digital switching and precision analog conversion. |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external watchdog or power-on reset signals. |
| PORTA[7:0] | General-purpose I/O / ADC inputs | Configurable as digital GPIO or analog inputs for ADC10B8CV2; supports internal pull-ups and slew-rate control. |
| PORTB[7:0] | General-purpose I/O / CAN TX/RX | Includes dedicated CANH/CANL differential pair (PB0/PB1) with integrated termination resistors and bus fault detection. |
| PORTC[7:0] | General-purpose I/O / PWM outputs | Eight PWM output channels mapped to PC0–PC7; supports center-aligned and edge-aligned modulation for motor drive. |
| PORTD[7:0] | General-purpose I/O / SCI/SPI | SCI0 (PD0/PD1) and SPI0 (PD2–PD5) share pins; configurable via PIM routing for flexible peripheral assignment. |
| PORTJ[7:0] | General-purpose I/O / External interrupt | Supports edge-sensitive IRQ0–IRQ7; used for wake-up from stop mode via external sensor triggers. |
Key Features
| Feature | Design Value |
|---|---|
| On-chip Flash with ECC | 192 KB Flash with single-bit error correction and double-bit error detection prevents silent data corruption in safety-critical firmware execution. |
| Integrated CAN 2.0B Controller | Hardware message buffering (32-message FIFO), acceptance filtering, and automatic retransmission reduce CPU overhead by >40% vs. software-implemented CAN stacks. |
| Background Debug Module (BDM) | Single-wire debug interface (BKGD pin) enables non-intrusive real-time debugging, flash programming, and breakpoint insertion without halting system clocks. |
| 10-bit 8-channel ADC | Simultaneous sampling across 8 channels with programmable conversion sequence; achieves ±1 LSB INL for closed-loop fuel injection calibration. |
| 8-channel 16-bit PWM | Independent duty-cycle and period registers per channel; supports dead-time insertion and synchronized start for 3-phase inverter control. |
| AEC-Q100 Grade 1 Qualification | Validated for operation from -40°C to +105°C with HTOL, TC, ESD, and EMC testing per automotive reliability standards. |
Applications
| Engine Control Unit (ECU) | Body Control Module (BCM) |
|---|---|
Use Scenario: Real-time combustion timing, air-fuel ratio calculation, and knock detection in gasoline direct injection engines. IC Role / Device Role / Timing Role: Primary control MCU executing PID-based spark advance and injector pulse-width modulation with sub-10 µs jitter. Use Value: Integrated 10-bit ADC and 8-channel PWM eliminate external signal conditioning ICs, reducing BOM count by 3 components per ECU. |
Use Scenario: Centralized lighting control, door lock actuation, and HVAC fan speed regulation in premium vehicle platforms. IC Role / Device Role / Timing Role: System coordinator managing LIN slave nodes, CAN gateway functions, and PWM-driven LED dimming with synchronized fade transitions. Use Value: On-chip CAN and LIN-compatible SCI allow direct integration into vehicle domain controllers without external transceivers. |
| Transmission Control Unit (TCU) | Advanced Driver Assistance Systems (ADAS) Sensor Hub |
Use Scenario: Gear selection logic, clutch pressure modulation, and torque converter lockup control in 6-speed automatic transmissions. IC Role / Device Role / Timing Role: Safety-monitored MCU running ASIL-B compliant software with lockstep monitoring via BDM and COP watchdog. Use Value: ECC-protected Flash and AEC-Q100 qualification ensure functional safety compliance without external memory scrubbing logic. |
Use Scenario: Aggregation and preprocessing of radar, camera, and ultrasonic sensor data before forwarding to central ADAS processor. IC Role / Device Role / Timing Role: Low-latency sensor interface MCU handling time-triggered ADC sampling and CAN message framing at 10 kHz update rate. Use Value: 16-bit timer with input capture supports precise timestamping of ultrasonic echo pulses within ±50 ns accuracy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S12G128F0VLH | 128 KB Flash, same LQFP-100 package and peripheral set; lacks 64 KB Flash capacity. | Suitable for cost-optimized ECUs with reduced feature sets (e.g., no OBD-II diagnostics logging). | Select when firmware size remains below 110 KB and AEC-Q100 Grade 1 compliance is retained. |
| MC9S12XEP100MALR | XGATE co-processor, 1 MB Flash, 50 MHz core; larger LQFP-144 package and higher power consumption. | Targeted at high-end powertrain systems requiring parallel processing (e.g., hybrid vehicle energy management). | Choose only if XGATE offloads >30% of main CPU workload and board layout accommodates larger footprint. |
Compared with S9S12G128F0VLH, the S9S12G192F0VLH provides 64 KB additional Flash for complex diagnostic routines and OTA update staging; versus MC9S12XEP100MALR, it offers identical AEC-Q100 Grade 1 qualification at lower cost and smaller PCB area, but without XGATE acceleration.
Availability
S9S12G192F0VLH is available at Aetrix Electronics and suitable for engine control units, body control modules, and transmission control units requiring stable component supply across automotive production lifecycles.
Supply support for S9S12G192F0VLH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The S9S12G192F0VLH belongs to the MC9S12G family-designed specifically for cost-sensitive, high-reliability automotive body and powertrain control applications with integrated CAN and AEC-Q100 qualification.
FAQ
What is the maximum operating frequency of the S9S12G192F0VLH?
The S9S12G192F0VLH operates at a maximum core frequency of 50 MHz, delivering 25 MIPS performance. This frequency is achieved using the internal PLL with external crystal oscillator input (typically 4–8 MHz), and is validated across the full -40°C to +105°C temperature range per AEC-Q100 Grade 1 requirements. The S9S12G192F0VLH maintains timing compliance without derating under worst-case voltage and temperature conditions.
Does the S9S12G192F0VLH support CAN FD?
No, the S9S12G192F0VLH implements the legacy MSCAN module (S12MSCANV3), which supports only Classical CAN 2.0A/B protocols up to 1 Mbps. It does not include CAN FD features such as variable bit rate, extended data length, or CRC enhancements. For CAN FD capability, designers must select newer families like S32K1 or S32K3. The S9S12G192F0VLH remains fully compatible with existing CAN 2.0B vehicle networks.
How much SRAM does the S9S12G192F0VLH include, and is it battery-backed?
The S9S12G192F0VLH includes 12 KB of on-chip SRAM, all of which is volatile and not battery-backed. It does not integrate a dedicated low-power RAM section or VBAT-supplied retention memory. For data retention during sleep modes, external backup solutions or EEPROM emulation in Flash must be implemented. The S9S12G192F0VLH's SRAM is optimized for zero-wait-state access during active operation, not for persistent storage.
Is the S9S12G192F0VLH pin-compatible with other MC9S12G family members?
Yes, the S9S12G192F0VLH in LQFP-100 package shares identical pinout with S9S12G128F0VLH, S9S12G96F0VLH, and S9S12G64F0VLH-enabling hardware reuse across variants. Pin compatibility covers all signal names, electrical characteristics, and thermal pad layout. However, unused peripherals (e.g., second SCI) may be unconnected in lower-memory variants, and firmware must validate feature availability via device ID registers.
What debug interface does the S9S12G192F0VLH use, and is JTAG supported?
The S9S12G192F0VLH uses the Background Debug Module (BDM) interface via the BKGD pin-a single-wire, half-duplex serial protocol-not JTAG. It supports full flash programming, real-time register inspection, and breakpoint insertion without halting the CPU clock. JTAG is not implemented; debug tools must comply with NXP's BDM specification (e.g., P&E Multilink or SEGGER J-Link with BDM firmware). The S9S12G192F0VLH does not expose TDI/TDO/TCK/TMS pins.
S9S12G192F0VLH Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP
- Series:
- HCS12
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- 12V1
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- CANbus, IrDA, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 54
- Program Memory Size:
- 192KB (192K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 11K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.13V ~ 5.5V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S12G192F0VLH FAQ
1.How can I place an order for S9S12G192F0VLH through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S12G192F0VLH on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S12G192F0VLH reliable?
The price and inventory of S9S12G192F0VLH are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S12G192F0VLH is usually 5 days.
3.What payment methods are accepted for S9S12G192F0VLH?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S12G192F0VLH transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S12G192F0VLH?
S9S12G192F0VLH orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S12G192F0VLH order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S12G192F0VLH?
For technical support, including S9S12G192F0VLH datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S12G192F0VLH requirements.
6.How does Aetrix verify that S9S12G192F0VLH is sourced from the original manufacturer or authorized distributors?
All S9S12G192F0VLH products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S12G192F0VLH meets industry standards.
7.What is the process for return or replacement of S9S12G192F0VLH?
All S9S12G192F0VLH units undergo pre-shipment inspection (PSI). If there is an issue with S9S12G192F0VLH, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S12G192F0VLH part is unused and in its original packaging.
Return procedure for S9S12G192F0VLH:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S9S12G192F0VLH Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

