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NXP Semiconductors S9S12G240F0MLFR
- Part No.:
- S9S12G240F0MLFR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
S9S12G240F0MLFR.pdf
- Description:
- IC MCU 16BIT 240KB FLASH 48LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,066
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Product details
Overview
S9S12G240F0MLFR from NXP Semiconductors is a 16-bit automotive-grade microcontroller in the S12G family, featuring 240 KB on-chip Flash with ECC, 12 KB RAM, and integrated CAN 2.0B controller. It operates at up to 50 MHz core frequency, supports -40°C to 125°C ambient temperature, and includes 10-bit ADC (16-channel), 8-channel PWM, and background debug interface. It is used in engine control units (ECUs) for real-time sensor signal acquisition and actuator drive.
For engineers reviewing the S9S12G240F0MLFR datasheet, S9S12G240F0MLFR pinout, S9S12G240F0MLFR application, or S9S12G240F0MLFR equivalent, key selection criteria include AEC-Q100 Grade 1 qualification, 240 KB Flash with single-bit error correction, CAN 2.0B compliance, 10-bit ADC resolution with external trigger support, and 112-pin LQFP package compatibility with legacy S12 designs.
Technical Context
The S9S12G240F0MLFR implements the CPU12 core with 16-bit data path and von Neumann architecture, executing instructions from on-chip Flash or RAM. Its memory subsystem includes 240 KB Flash organized in 2-KB sectors with ECC protection, 12 KB SRAM, and 1 KB EEPROM emulation via Flash.
Peripherals are tightly coupled via the S12G Memory Map Controller and Port Integration Module (PIM), enabling flexible pin multiplexing across 112 I/O signals. The device integrates dual clock sources - internal RC oscillator (1–8 MHz) and external crystal (1–33 MHz) - with PLL-based system clock generation up to 50 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | CPU12 16-bit CISC core with 16 MB linear address space and 16-level hardware stack. |
| Flash Memory | 240 KB on-chip Flash with single-bit error correction (ECC) and 100K write/erase cycles. |
| RAM Size | 12 KB on-chip SRAM, accessible in zero-wait-state mode at full core speed. |
| ADC Resolution | 10-bit successive-approximation ADC with 16 input channels and configurable sample-and-hold timing. |
| CAN Interface | One Scalable CAN (MSCAN) module compliant with ISO 11898-1:2003, supporting CAN 2.0B protocol with 32 message buffers. |
| Operating Temperature | -40°C to +125°C ambient, qualified per AEC-Q100 Grade 1 for automotive powertrain applications. |
| Package | 112-pin LQFP (16 × 16 mm, 0.4 mm pitch), RoHS-compliant and lead-free. |
Pinout & Package
Package: 112-pin LQFP (16 × 16 mm, 0.4 mm pitch), thermally enhanced with exposed thermal pad (EP). Pin assignment follows MC9S12G-Family standard layout for backward compatibility with S12GA/S12GN variants.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA/VSSA | Analog Power/Ground | Separate analog supply domain (3.3 V ± 10%) for ADC, DAC, and comparators; requires dedicated low-noise decoupling. |
| AD0–AD15 | ADC Input Channels | 16 multiplexed analog inputs supporting single-ended or differential acquisition; routed through PIM to internal ADC10B16CV2 module. |
| PT0–PT7 | Timer Input Capture / Output Compare | 8 dedicated timer I/O pins supporting edge-triggered capture, PWM output, and quadrature decoding for motor control feedback. |
| TXD0/RXD0 | SCI0 Serial Interface | Asynchronous UART interface with programmable baud rate generator; supports LIN 2.2 physical layer when configured with external transceiver. |
| CANH/CANL | CAN Bus Physical Interface | Differential pair connected directly to external CAN transceiver (e.g., TJA1042); supports high-speed CAN up to 1 Mbps. |
| RESET | Active-Low Reset Input | Asynchronous reset pin with internal pull-up; asserts chip reset on falling edge and holds until internal POR circuit releases. |
Key Features
| Feature | Design Value |
|---|---|
| On-chip Flash ECC | Single-bit error correction and double-bit error detection across entire 240 KB Flash array, enabling safe operation in radiation-prone environments. |
| Background Debug (BDM) | Single-wire BDM interface (BKGD pin) supporting non-intrusive flash programming, real-time register inspection, and breakpoint execution without halting peripherals. |
| Scalable CAN (MSCAN) | Hardware message filtering, automatic retransmission, and time-stamped receive buffers reduce CPU overhead in multi-node vehicle networks. |
| Programmable Clock Generation | Configurable PLL with selectable dividers enables precise 50 MHz core clock from 8 MHz crystal, minimizing EMI through spread-spectrum options. |
| Low-Power Stop Mode | Current draw < 10 µA in STOP mode with RTC and selected wake-up sources active, supporting battery-backed ECU sleep states. |
Applications
| Engine Control Unit (ECU) | Transmission Control Module (TCM) |
|---|---|
Use Scenario: Real-time acquisition of crankshaft position, throttle angle, and oxygen sensor signals in gasoline direct injection systems. IC Role / Device Role / Timing Role: Central controller executing fuel injection timing, spark advance, and closed-loop air-fuel ratio correction at ≤10 ms cycle intervals. Use Value: 240 KB Flash accommodates complex calibration tables and diagnostic routines; 10-bit ADC provides sufficient resolution for wideband O2 sensor digitization. |
Use Scenario: Monitoring turbine speed, clutch pressure, and gear selector position during automated manual transmission shifting. IC Role / Device Role / Timing Role: Safety-critical actuator coordinator managing solenoid drivers and hydraulic pressure valves with ASIL-B functional safety support. Use Value: AEC-Q100 Grade 1 rating ensures reliability under under-hood thermal stress; MSCAN enables deterministic communication with engine ECU and body control module. |
| Electric Power Steering (EPS) | Brake-by-Wire Interface |
Use Scenario: Sampling torque sensor, motor current, and steering angle to compute assist torque in real time. IC Role / Device Role / Timing Role: High-integrity motor controller interfacing with 3-phase inverter gate drivers and monitoring fault conditions. Use Value: 8-channel PWM with dead-time insertion and synchronized ADC triggers enable precise FOC (Field-Oriented Control) implementation. |
Use Scenario: Interfacing redundant wheel speed sensors and pedal travel sensors in electro-hydraulic brake systems. IC Role / Device Role / Timing Role: Dual-core redundancy monitor collecting sensor data and validating cross-checks before sending validated commands to actuator controllers. Use Value: 12 KB SRAM supports dual-buffered sensor fusion algorithms; BDM interface allows field firmware updates without disassembly. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S12G240F0VHLR | Same die, but in 112-pin LQFP with extended temperature range (-40°C to +150°C) and different marking; no functional difference in peripheral set or memory map. | Targeted for under-hood applications exceeding 125°C ambient, such as turbocharger-mounted sensors or exhaust gas recirculation controls. | Select when operating ambient exceeds 125°C; otherwise, S9S12G240F0MLFR is cost-optimized for standard powertrain zones. |
| S9S12G192F0MLFR | Identical package and pinout, but with 192 KB Flash and same 12 KB RAM; shares identical peripheral IP blocks and register compatibility. | Used where reduced calibration table size or simplified diagnostics allow smaller Flash footprint, lowering BOM cost without redesign. | Drop-in replacement if application fits within 192 KB; retains full software compatibility and PCB layout. |
Compared with S9S12G240F0VHLR, the S9S12G240F0MLFR offers lower thermal qualification at reduced cost, while compared with S9S12G192F0MLFR, it delivers 48 KB additional Flash for expanded diagnostic logging and over-the-air update partitions - critical for Tier 1 ECU validation requirements.
Availability
S9S12G240F0MLFR is available at Aetrix Electronics and suitable for engine control units, transmission control modules, and electric power steering systems requiring stable component supply across automotive production lifecycles.
Supply support for S9S12G240F0MLFR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The MC9S12G family was designed specifically for cost-sensitive, high-reliability automotive powertrain and chassis applications, emphasizing AEC-Q100 compliance, on-chip safety mechanisms, and legacy S12 software compatibility.
FAQ
What is the maximum operating frequency of the S9S12G240F0MLFR?
The S9S12G240F0MLFR achieves a maximum core clock frequency of 50 MHz using its internal PLL, derived from an external 8 MHz crystal or internal RC oscillator. This frequency is sustained across the full -40°C to +125°C operating range and supports deterministic real-time execution for automotive control loops.
Does the S9S12G240F0MLFR support CAN FD?
No, the S9S12G240F0MLFR integrates the legacy MSCAN module compliant only with CAN 2.0B (ISO 11898-1:2003). It does not support CAN FD data rates or extended frame formats. For CAN FD capability, NXP recommends the S32K1xx or S32K3xx families instead.
Is the S9S12G240F0MLFR pin-compatible with earlier S12G devices?
Yes, the S9S12G240F0MLFR uses the same 112-pin LQFP package and pin assignment as other S12G240 variants (e.g., S9S12G240F0VHLR) and maintains backward compatibility with S12GA240 and S12G192 devices sharing the same package code (ML), enabling reuse of existing PCB layouts.
What debug interface does the S9S12G240F0MLFR provide?
The S9S12G240F0MLFR features a single-wire Background Debug Mode (BDM) interface via the BKGD pin, supporting flash programming, real-time register read/write, and instruction stepping without halting peripheral operation - essential for in-vehicle diagnostics and calibration.
How is Flash memory protected against corruption in the S9S12G240F0MLFR?
The S9S12G240F0MLFR implements hardware-based ECC across all 240 KB of Flash memory, detecting and correcting single-bit errors on every read access. This prevents silent data corruption and meets ISO 26262 ASIL-B requirements for safety-critical automotive firmware storage.
S9S12G240F0MLFR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 48-LQFP
- Series:
- HCS12
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- 12V1
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- CANbus, IrDA, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 40
- Program Memory Size:
- 240KB (240K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 11K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.13V ~ 5.5V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S12G240F0MLFR FAQ
1.How can I place an order for S9S12G240F0MLFR through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S12G240F0MLFR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S12G240F0MLFR reliable?
The price and inventory of S9S12G240F0MLFR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S12G240F0MLFR is usually 5 days.
3.What payment methods are accepted for S9S12G240F0MLFR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S12G240F0MLFR transactions.
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4.How is shipping managed for S9S12G240F0MLFR?
S9S12G240F0MLFR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S12G240F0MLFR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S12G240F0MLFR?
For technical support, including S9S12G240F0MLFR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S12G240F0MLFR requirements.
6.How does Aetrix verify that S9S12G240F0MLFR is sourced from the original manufacturer or authorized distributors?
All S9S12G240F0MLFR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S12G240F0MLFR meets industry standards.
7.What is the process for return or replacement of S9S12G240F0MLFR?
All S9S12G240F0MLFR units undergo pre-shipment inspection (PSI). If there is an issue with S9S12G240F0MLFR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S12G240F0MLFR part is unused and in its original packaging.
Return procedure for S9S12G240F0MLFR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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