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NXP Semiconductors S9S12G48F0MLFR

Part No.:
S9S12G48F0MLFR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
48-LQFP
Datasheet:
AetrixS9S12G48F0MLFR.pdf
Description:
IC MCU 16BIT 48KB FLASH 48LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,116

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Product details

Overview

S9S12G48F0MLFR from NXP Semiconductors is a 16-bit automotive-grade microcontroller in the S12G family, featuring 48 KB on-chip Flash with ECC, 4 KB SRAM, and integrated CAN 2.0B controller. It operates at up to 25 MHz core frequency, supports -40°C to 125°C ambient temperature, and includes 10-bit ADC (8-channel), PWM (8-channel), and BDM debug interface - deployed in engine control units and body electronics modules.

For engineers reviewing the S9S12G48F0MLFR datasheet, S9S12G48F0MLFR pinout, S9S12G48F0MLFR application, or S9S12G48F0MLFR equivalent, key selection criteria include AEC-Q100 Grade 1 qualification, 48 KB Flash with single-bit error correction, CAN bus integration, and compatibility with legacy S12 toolchains and development environments.

Technical Context

The S9S12G48F0MLFR implements the S12 CPU12 core with 16-bit data path and 24-bit addressing, executing instructions from internal Flash or external memory via expanded multiplexed bus mode. Its clock system combines an internal RC oscillator (1–8 MHz), external crystal input (1–32 MHz), and PLL for configurable system clock generation up to 50 MHz bus speed.

Peripheral integration includes a scalable Controller Area Network (MSCAN) module compliant with ISO 11898-1, a 16-bit Timer Module (TIM) with input capture/output compare, and a Pulse-Width Modulator (PWM) supporting center-aligned and edge-aligned modes with dead-time insertion - all accessible through the Port Integration Module (PIM) for flexible pin mapping.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture S12 CPU12 16-bit CISC core with 24-bit address space and 16 MB linear memory map
Flash Memory 48 KB on-chip Flash with ECC protection; enables robust firmware storage in automotive environments
SRAM 4 KB on-chip SRAM with retention during low-power stop modes
ADC 10-bit successive approximation ADC with 8 input channels and programmable sample time
CAN Interface One MSCAN 2.0B module supporting 1 Mbit/s data rate and message filtering with 16 message buffers
Operating Temperature -40°C to +125°C ambient; qualified per AEC-Q100 Grade 1 for under-hood automotive use
Package 64-pin LQFP (10 × 10 mm, 0.5 mm pitch); RoHS-compliant and lead-free

Pinout & Package

Package: 64-pin LQFP (10 × 10 mm, 0.5 mm pitch), thermally enhanced with exposed thermal pad (EP). Pinout conforms to MC9S12G48 device variant as defined in Appendix D of the MC9S12G Family Reference Manual Rev. 1.28.

Pin/Terminal Circuit Role Design Meaning
VDD, VDDA, VDDPLL Power supply inputs Separate domains for digital logic (VDD), analog peripherals (VDDA), and PLL circuitry (VDDPLL) reduce noise coupling
VSS, VSSA, VSSPLL Ground returns Dedicated ground pins per supply domain ensure stable reference and minimize ground bounce
XTAL, EXTAL Crystal oscillator terminals Supports fundamental-mode quartz crystals (1–32 MHz) for precise timing and CAN bit-rate accuracy
RESET Active-low reset input Asynchronous reset with internal pull-up; accepts external watchdog or power-on reset signals
PORTA[7:0] General-purpose I/O / ADC channel inputs Configurable as digital I/O or analog inputs for ADC0–ADC7; supports internal pull-ups
PORTB[7:0] General-purpose I/O / CAN TX/RX PB0/PB1 serve as CAN0_TX/CAN0_RX; other pins support interrupt-capable GPIO and PWM outputs
PORTC[7:0] General-purpose I/O / SCI/SPI PC0/PC1 = SCI0_TX/SCI0_RX; PC2/PC3 = SPI0_SCK/MOSI; supports peripheral multiplexing via PIM
PORTD[7:0] General-purpose I/O / PWM outputs PD0–PD7 support 8-channel PWM with independent duty-cycle and period registers

Key Features

Feature Design Value
On-chip Flash with ECC 48 KB Flash with single-bit error correction and double-bit error detection ensures firmware integrity in EMI-prone automotive systems
Integrated MSCAN 2.0B Full CAN protocol stack support including acceptance filtering, message buffering, and automatic retransmission without CPU overhead
Background Debug Module (BDM) Single-wire debug interface compatible with standard BDM tools; enables flash programming and real-time debugging without halting operation
Low-power stop/wake modes Stop mode current < 10 µA with wake-up via CAN, SCI, or external interrupt - critical for battery-powered body control modules
Port Integration Module (PIM) Dynamic signal routing allows remapping of peripheral functions (e.g., SCI, SPI, PWM) to multiple port pins, simplifying PCB layout and design reuse

Applications

Engine Control Unit (ECU) Body Control Module (BCM)

Use Scenario: Real-time monitoring of throttle position, coolant temperature, and oxygen sensor signals in gasoline engine management.

IC Role / Device Role / Timing Role: Primary MCU executing closed-loop fuel injection and ignition timing algorithms with deterministic 25 MHz instruction throughput.

Use Value: Integrated 10-bit ADC and CAN interface eliminate external signal conditioning and transceiver ICs, reducing BOM count by two components.

Use Scenario: Centralized control of door locks, interior lighting, and window lift motors in modern passenger vehicles.

IC Role / Device Role / Timing Role: System coordinator managing LIN slave nodes and relaying status over CAN backbone to dashboard cluster.

Use Value: AEC-Q100 Grade 1 qualification and 125°C operation enable direct mounting near fuse boxes without heatsinking.

Transmission Control Unit (TCU) Heating/Ventilation Control

Use Scenario: Closed-loop shift solenoid actuation and torque converter clutch control using PWM-driven valves.

IC Role / Device Role / Timing Role: Real-time controller with 8-channel PWM generating precise 20–500 Hz duty-cycle-modulated drive signals.

Use Value: Hardware PWM with dead-time insertion prevents shoot-through in H-bridge driver stages, eliminating need for external gate drivers.

Use Scenario: HVAC blower motor speed regulation and cabin temperature feedback loop in premium vehicle cabins.

IC Role / Device Role / Timing Role: Sensor fusion node aggregating NTC thermistor readings and controlling 3-phase inverter via SCI-triggered PWM updates.

Use Value: On-chip voltage regulator (VREG) supplies 5 V to external sensors, removing requirement for discrete LDO in subsystem design.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
S9S12G48F0VLF Same die, but in 64-pin QFP package with different moisture sensitivity level (MSL3 vs MSL3); identical electrical specs and pinout Identical functional scope; differs only in packaging and tape-and-reel configuration for surface-mount assembly Select when requiring alternate reel packaging or specific moisture barrier requirements for high-humidity manufacturing environments
MC9S12GC48CPVE Legacy mask set with same 48 KB Flash and peripheral set; lacks updated ECC implementation and some errata fixes present in S9S12G48F0MLFR Valid for cost-sensitive legacy designs where qualification recertification is not required Prefer S9S12G48F0MLFR for new designs due to enhanced Flash reliability and extended lifecycle support

Compared with S9S12G48F0VLF, the S9S12G48F0MLFR offers identical functionality in the same LQFP package but with updated mask revision and full AEC-Q100 requalification; versus MC9S12GC48CPVE, it delivers improved Flash ECC robustness and documented errata resolution for production-critical applications.

Availability

S9S12G48F0MLFR is available at Aetrix Electronics and suitable for engine control units, body control modules, and transmission control units requiring stable component supply across multi-year automotive production cycles.

Supply support for S9S12G48F0MLFR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The S9S12G48F0MLFR belongs to the MC9S12G family - a line of AEC-Q100-qualified 16-bit microcontrollers designed specifically for cost-sensitive, safety-aware automotive body and powertrain applications requiring long-term reliability and toolchain continuity.

FAQ

What is the maximum operating frequency of the S9S12G48F0MLFR?

The S9S12G48F0MLFR features a CPU12 core with a maximum internal bus frequency of 50 MHz, achieved via its internal PLL. The core executes instructions at up to 25 MHz, and the device supports external crystal inputs from 1 MHz to 32 MHz. All timing specifications in the datasheet - including CAN bit-rate accuracy and ADC conversion time - are validated at this rated frequency.

Does the S9S12G48F0MLFR support CAN FD?

No, the S9S12G48F0MLFR integrates the legacy MSCAN 2.0B module compliant with ISO 11898-1, supporting Classical CAN only (up to 1 Mbit/s). It does not implement CAN FD framing, arbitration, or data phase enhancements. For CAN FD capability, NXP recommends the S32K1xx series - not the S9S12G48F0MLFR.

Is the S9S12G48F0MLFR pin-compatible with other MC9S12G devices?

The S9S12G48F0MLFR shares the same 64-pin LQFP footprint and pinout as other MC9S12G48 and MC9S12G64 variants (e.g., S9S12G64F0MLFR), enabling hardware reuse across Flash-size variants. However, it is not pin-compatible with MC9S12G96 or higher-density members due to differing peripheral mappings and register configurations.

What debug interface does the S9S12G48F0MLFR provide?

The S9S12G48F0MLFR includes the Background Debug Module (BDM), a single-wire serial interface compliant with Motorola BDM specification. It supports flash programming, real-time register inspection, breakpoint setting, and memory read/write operations without requiring dedicated JTAG pins or external debug probes beyond standard BDM cables.

What is the Flash endurance and data retention specification for the S9S12G48F0MLFR?

The S9S12G48F0MLFR specifies 10,000 write/erase cycles for its 48 KB Flash memory and guarantees data retention for 10 years at 85°C ambient temperature. These values are measured per JEDEC JESD22-A117 and confirmed in the Electrical Characteristics section (Table A-14) of the MC9S12G Family Reference Manual Rev. 1.28.

S9S12G48F0MLFR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
48-LQFP
Series:
HCS12
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
12V1
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
48KB (48K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1.5K x 8
RAM Size:
4K x 8
Voltage - Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S12G48F0MLFR FAQ

1.How can I place an order for S9S12G48F0MLFR through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S12G48F0MLFR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of S9S12G48F0MLFR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S12G48F0MLFR is usually 5 days.

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S9S12G48F0MLFR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S12G48F0MLFR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S12G48F0MLFR?

For technical support, including S9S12G48F0MLFR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S12G48F0MLFR requirements.

6.How does Aetrix verify that S9S12G48F0MLFR is sourced from the original manufacturer or authorized distributors?

All S9S12G48F0MLFR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S12G48F0MLFR meets industry standards.

7.What is the process for return or replacement of S9S12G48F0MLFR?

All S9S12G48F0MLFR units undergo pre-shipment inspection (PSI). If there is an issue with S9S12G48F0MLFR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S12G48F0MLFR part is unused and in its original packaging.

Return procedure for S9S12G48F0MLFR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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