NXP Semiconductors S9S12G48F0WLFR
- Part No.:
- S9S12G48F0WLFR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
S9S12G48F0WLFR.pdf
- Description:
- IC MCU 16BIT 48KB FLASH 48LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S9S12G48F0WLFR from NXP Semiconductors is a 16-bit automotive-grade microcontroller in the S12G family, featuring 48 KB on-chip Flash with ECC, 4 KB SRAM, and integrated CAN 2.0B controller. It operates at up to 25 MHz core frequency, supports -40°C to 125°C ambient temperature (Grade 0), and includes 10-bit ADC (8-channel), PWM, SCI, SPI, and BDM debug interface. It targets engine control units, body electronics, and transmission modules requiring ASIL-B capable MCU solutions.
For engineers reviewing the S9S12G48F0WLFR datasheet, S9S12G48F0WLFR pinout, S9S12G48F0WLFR application, or S9S12G48F0WLFR equivalent, key selection criteria include AEC-Q100 Grade 0 qualification, CAN bus integration, Flash ECC support, 25 MHz max CPU speed, and 64-pin LQFP package compatibility with legacy S12 designs.
Technical Context
The S9S12G48F0WLFR implements the S12 CPU12 core with 16-bit data path and von Neumann architecture, executing instructions from internal Flash or external memory via expanded address bus. Its clock system combines internal RC oscillator (1 MHz), main external crystal (1–32 MHz), and PLL for stable 25 MHz core clock generation.
System integrity features include COP watchdog timer, low-voltage detection, and background debug module (BDM) with single-wire serial interface. Memory protection is enforced via security byte and flash block locking, while CAN module supports programmable message objects and hardware filtering for real-time automotive networking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | S12 CPU12 16-bit CISC core with 25 MHz max operation |
| Flash Memory | 48 KB on-chip Flash with ECC and 100K write/erase cycles |
| RAM | 4 KB on-chip SRAM with retention in stop mode |
| ADC | 10-bit successive approximation ADC with 8 input channels and 12 µs conversion time |
| CAN Interface | Scalable Controller Area Network (MSCAN) supporting CAN 2.0B protocol with 16 message buffers |
| Operating Temp | AEC-Q100 Grade 0: -40°C to +125°C ambient |
| Supply Voltage | 4.5 V to 5.5 V nominal; on-chip 5 V regulator supplies internal logic |
| Package | 64-pin LQFP (10 × 10 mm, 0.5 mm pitch), RoHS-compliant |
Pinout & Package
64-pin LQFP (10 × 10 mm, 0.5 mm pitch) with exposed thermal pad. Pin functions conform to MC9S12G Family Pin Assignment Overview (Section 1.8.4 of Rev.1.28 Reference Manual).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDX | Power supply inputs | Separate digital, analog, and external interface power domains; decoupling required per datasheet layout guidelines |
| VSS, VSSA, VSSX | Ground returns | Dedicated analog/digital ground pins minimize noise coupling into ADC and CAN circuits |
| XTAL, EXTAL | Crystal oscillator terminals | Support 1–32 MHz external crystal; internal load capacitors configurable via register |
| CANH, CANL | CAN bus differential pair | Direct connection to ISO 11898-2 compliant transceiver; integrated CAN controller handles arbitration and error handling |
| PA0–PA7 | Port A general-purpose I/O | Configurable as GPIO, ADC input, or PWM output; internal pull-ups enabled by default |
| BKGD | Background debug pin | Single-wire BDM interface for programming and real-time debugging without halting CPU |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q100 Grade 0 qualification | Validated for automotive under-hood applications with full temperature range (-40°C to +125°C) |
| On-chip Flash with ECC | Enables reliable code storage and runtime correction of single-bit errors in safety-critical firmware |
| Integrated MSCAN module | Reduces BOM count and PCB area by eliminating external CAN controller; supports wake-on-CAN |
| Background Debug Module (BDM) | Allows non-intrusive firmware update and real-time variable inspection during vehicle operation |
| Programmable COP watchdog | Configurable timeout (1 ms to 2 s) with windowed mode for fail-safe reset in engine control loops |
| Low-power stop/wait modes | Current draw < 10 µA in stop mode; fast wake-up (< 4 µs) from CAN or IRQ events |
Applications
| Engine Control Unit (ECU) | Body Control Module (BCM) |
|---|---|
Use Scenario: Real-time fuel injection timing, spark advance calculation, and OBD-II diagnostics in gasoline engines. IC Role / Device Role / Timing Role: Primary MCU executing closed-loop control algorithms with deterministic 25 MHz instruction throughput and CAN-based sensor/actuator communication. Use Value: Integrated MSCAN and AEC-Q100 Grade 0 ensure robust operation in high-EMI engine bays while reducing external component count. | Use Scenario: Centralized management of door locks, lighting, wipers, and HVAC in mid-tier passenger vehicles. IC Role / Device Role / Timing Role: System coordinator interfacing with LIN slaves and CAN gateway; executes state machines with precise timing via 16-bit TIM module. Use Value: 48 KB Flash accommodates multi-feature firmware; 4 KB SRAM enables local data buffering without external memory. |
| Transmission Control Unit (TCU) | Advanced Driver Assistance Systems (ADAS) Sensor Interface |
Use Scenario: Gear shift scheduling, clutch pressure modulation, and torque converter lockup control in automatic transmissions. IC Role / Device Role / Timing Role: Safety-relevant controller with COP watchdog and Flash ECC; processes analog throttle/pressure signals via 10-bit ADC. Use Value: Grade 0 temperature rating and built-in voltage monitoring meet ASIL-B functional safety requirements per ISO 26262. | Use Scenario: Signal conditioning and preprocessing of radar or camera sensor outputs before forwarding to domain controller. IC Role / Device Role / Timing Role: Edge node processor handling time-critical ADC sampling, CAN message formatting, and BDM-enabled field updates. Use Value: Low-latency interrupt response (< 1.2 µs) and deterministic PWM generation enable precise sensor synchronization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S12G48F0MLFR | Same silicon, but rated for -40°C to 105°C (Grade 1) instead of Grade 0 | Suitable for cabin-mounted modules where ambient temperature does not exceed 105°C | Select when full under-hood Grade 0 qualification is not required; lower cost and wider availability |
| MC9S12G48MALR | Identical functionality and pinout, but packaged in 64-pin QFP (not LQFP); no exposed thermal pad | Compatible with legacy PCB layouts using QFP footprint; slightly higher thermal resistance | Choose for backward compatibility with existing QFP-based designs; verify thermal performance in target enclosure |
Compared with S9S12G48F0WLFR, the S9S12G48F0MLFR offers identical feature set at reduced temperature grade, while MC9S12G48MALR maintains full electrical compatibility in a legacy QFP package-enabling migration paths without firmware changes but requiring mechanical layout review.
Availability
S9S12G48F0WLFR is available at Aetrix Electronics and suitable for engine control units, body control modules, and transmission control units requiring stable component supply across automotive production lifecycles.
Supply support for S9S12G48F0WLFR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The MC9S12G family-including S9S12G48F0WLFR-is designed for cost-sensitive, safety-aware automotive applications such as powertrain, chassis, and body electronics, emphasizing AEC-Q100 compliance, Flash reliability, and CAN integration.
FAQ
What is the maximum operating frequency of the S9S12G48F0WLFR?
The S9S12G48F0WLFR supports a maximum core clock frequency of 25 MHz, achieved via its internal Phase-Locked Loop (IPLL) driven by an external crystal (1–32 MHz) or internal RC oscillator. This frequency enables deterministic execution of automotive control algorithms with cycle-accurate timing, and is validated across the full -40°C to +125°C operating range specified for the S9S12G48F0WLFR.
Does the S9S12G48F0WLFR include hardware support for CAN communication?
Yes, the S9S12G48F0WLFR integrates the Scalable Controller Area Network (MSCAN) module compliant with CAN 2.0B specification. It provides 16 message buffers, hardware acceptance filtering, and automatic retransmission-enabling direct connection to ISO 11898-2 transceivers. This eliminates the need for external CAN controllers in designs using the S9S12G48F0WLFR.
What debug interface does the S9S12G48F0WLFR support?
The S9S12G48F0WLFR supports the Background Debug Module (BDM) interface via the BKGD pin, enabling single-wire in-circuit debugging, flash programming, and real-time variable inspection without halting CPU execution. This interface is fully compatible with standard BDM tools and is documented in Chapter 7 of the MC9S12G Family Reference Manual Rev.1.28 for the S9S12G48F0WLFR.
Is the S9S12G48F0WLFR qualified for automotive use?
Yes, the S9S12G48F0WLFR is AEC-Q100 qualified to Grade 0 (-40°C to +125°C), making it suitable for under-hood automotive applications including engine control, transmission systems, and chassis electronics. Its Flash memory includes ECC, and it features COP watchdog, low-voltage detection, and secure boot-all aligned with ASIL-B functional safety requirements referenced in ISO 26262 for the S9S12G48F0WLFR.
What package type is used for the S9S12G48F0WLFR?
The S9S12G48F0WLFR is supplied in a 64-pin LQFP package (10 × 10 mm, 0.5 mm pitch) with an exposed thermal pad. This package is specified in Appendix D of the MC9S12G Family Reference Manual Rev.1.28 and supports standard surface-mount assembly processes. The thermal pad must be soldered to a dedicated PCB copper pour for optimal heat dissipation in high-duty-cycle automotive applications using the S9S12G48F0WLFR.
S9S12G48F0WLFR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 48-LQFP
- Series:
- HCS12
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- 12V1
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- CANbus, IrDA, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 40
- Program Memory Size:
- 48KB (48K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 1.5K x 8
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.13V ~ 5.5V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 150°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S12G48F0WLFR FAQ
1.How can I place an order for S9S12G48F0WLFR through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S12G48F0WLFR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S12G48F0WLFR reliable?
The price and inventory of S9S12G48F0WLFR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S12G48F0WLFR is usually 5 days.
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S9S12G48F0WLFR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S12G48F0WLFR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S12G48F0WLFR?
For technical support, including S9S12G48F0WLFR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S12G48F0WLFR requirements.
6.How does Aetrix verify that S9S12G48F0WLFR is sourced from the original manufacturer or authorized distributors?
All S9S12G48F0WLFR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S12G48F0WLFR meets industry standards.
7.What is the process for return or replacement of S9S12G48F0WLFR?
All S9S12G48F0WLFR units undergo pre-shipment inspection (PSI). If there is an issue with S9S12G48F0WLFR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S12G48F0WLFR part is unused and in its original packaging.
Return procedure for S9S12G48F0WLFR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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