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NXP Semiconductors S9S12G48F1CLC

Part No.:
S9S12G48F1CLC
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
32-LQFP
Datasheet:
AetrixS9S12G48F1CLC.pdf
Description:
IC MCU 16BIT 48KB FLASH 32LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,674

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Product details

Overview

S9S12G48F1CLC from NXP Semiconductors is a 16-bit automotive-grade microcontroller featuring 48 KB on-chip Flash with ECC, 4 KB SRAM, and integrated CAN 2.0B controller. It operates at up to 25 MHz core frequency, supports -40°C to +125°C ambient temperature, and includes 10-bit ADC (8-channel), 8-bit DAC, PWM, and BDM debug interface - deployed in engine control units and body electronics modules.

For engineers reviewing the S9S12G48F1CLC datasheet, S9S12G48F1CLC pinout, S9S12G48F1CLC application, or S9S12G48F1CLC equivalent, key selection criteria include AEC-Q100 Grade 1 qualification, CAN bus integration, Flash memory endurance (100k erase/write cycles), and compatibility with S12 CPU12 instruction set for legacy code migration.

Technical Context

The S9S12G48F1CLC implements the S12 CPU12 core with 16-bit data path and von Neumann architecture, executing instructions from internal Flash or external memory via expanded multiplexed bus mode. Its clock system combines internal RC oscillator (1–8 MHz), external crystal (1–32 MHz), and PLL for configurable system clock up to 50 MHz.

Peripheral integration includes TIM16B8CV3 timer module with 8 input-capture/output-compare channels, S12MSCANV3 CAN controller supporting bit rates up to 1 Mbps, and ADC10B8CV2 with 8 analog inputs, 10-bit resolution, and conversion time of 7 µs per channel.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture S12 CPU12 16-bit CISC core with 24-bit address space and 16 MB linear memory map
Flash Memory 48 KB on-chip Flash with ECC protection and 100k erase/write cycle endurance
SRAM 4 KB on-chip SRAM with retention during stop mode
CAN Interface One S12MSCANV3 module compliant with ISO 11898-1, supporting CAN 2.0B protocol and 1 Mbps max bit rate
ADC ADC10B8CV2: 10-bit, 8-channel SAR converter with 7 µs conversion time and internal reference
DAC DAC_8B5V: 8-bit voltage-output DAC with 5 V full-scale range and monotonic response
Operating Temperature -40°C to +125°C ambient, qualified per AEC-Q100 Grade 1

Pinout & Package

LQFP-64 package (10 mm × 10 mm, 0.5 mm pitch) with exposed thermal pad; RoHS-compliant, lead-free finish.

Pin/Terminal Circuit Role Design Meaning
VDD, VDDA, VDDPLL Power supply rails Separate digital (VDD), analog (VDDA), and PLL (VDDPLL) supplies enable noise isolation for mixed-signal operation
VSS, VSSA, VSSPLL Ground terminals Dedicated digital (VSS), analog (VSSA), and PLL (VSSPLL) grounds minimize coupling between domains
RESET Active-low reset input Asynchronous reset with internal pull-up; accepts external debounced signal or watchdog timeout assertion
XTAL, EXTAL Crystal oscillator connections Supports fundamental-mode quartz crystals from 1–32 MHz; enables precise timing for CAN and communication peripherals
CANH, CANL CAN bus differential pair Direct connection to ISO 11898-compliant transceiver; integrated CAN controller handles arbitration, error handling, and message filtering
PT0–PT7 Timer I/O pins Configurable as input capture, output compare, or PWM outputs; support edge-triggered interrupts and gated time measurement
AD0–AD7 Analog input channels 8 single-ended or 4 differential analog inputs routed to ADC10B8CV2; support internal/external reference selection
BKGD Background debug pin Single-wire BDM interface for non-intrusive debugging, flash programming, and real-time register access

Key Features

Feature Design Value
On-chip Flash with ECC Enables reliable firmware execution in automotive environments by detecting and correcting single-bit errors in real time
AEC-Q100 Grade 1 qualification Validated for operation from -40°C to +125°C, meeting stringent reliability and lifetime requirements for under-hood applications
Integrated CAN 2.0B controller Reduces BOM count and PCB area by eliminating external CAN protocol handler; supports mailbox-based message buffering and automatic retransmission
Low-power stop/wait modes Current draw as low as 10 µA in stop mode with wake-up via CAN, IRQ, or RTC - critical for battery-powered modules
Background Debug Module (BDM) Enables in-circuit debugging without halting real-time peripherals, preserving CAN bus timing and sensor sampling integrity

Applications

Engine Control Unit (ECU) Body Control Module (BCM)

Use Scenario: Real-time monitoring of throttle position, coolant temperature, and oxygen sensor signals in gasoline engine management systems.

IC Role / Device Role / Timing Role: Primary MCU executing closed-loop fuel injection and ignition timing algorithms with deterministic interrupt latency.

Use Value: Integrated 10-bit ADC and CAN controller eliminate external signal conditioning and protocol ICs, reducing system cost and board space.

Use Scenario: Centralized control of door locks, window lifts, lighting, and HVAC functions in passenger vehicles.

IC Role / Device Role / Timing Role: System coordinator communicating over CAN with distributed nodes while managing local GPIO and PWM-driven actuators.

Use Value: 48 KB Flash accommodates multi-feature firmware with OTA update capability; AEC-Q100 Grade 1 ensures long-term reliability in cabin environments.

Transmission Control Unit (TCU) Advanced Driver Assistance Systems (ADAS) Sensor Interface

Use Scenario: Gear shift logic, clutch pressure control, and torque converter lockup management in automatic transmissions.

IC Role / Device Role / Timing Role: Safety-critical controller interfacing with solenoid drivers and vehicle speed sensors via dedicated timer and ADC resources.

Use Value: ECC-protected Flash and watchdog timers meet ASIL-B functional safety requirements without external safety monitors.

Use Scenario: Signal aggregation and preprocessing for radar or ultrasonic parking sensors before forwarding to central ADAS ECU.

IC Role / Device Role / Timing Role: Edge-processing node performing analog front-end conditioning, threshold detection, and CAN message formatting.

Use Value: Low-latency 7 µs ADC conversion and hardware-triggered sampling enable precise time-of-flight measurements for object detection.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
S9S12G48F0MLC Same die, but rated for -40°C to +85°C industrial temperature range (not AEC-Q100 qualified) Not suitable for under-hood automotive use; acceptable for non-automotive industrial control Select only if AEC-Q100 Grade 1 is not required and ambient temperature remains ≤85°C
MC9S12G48MALR Identical functionality and pinout, but in 64-pin QFP with wettable flank leads (RoHS-compliant, no Pb) Same automotive qualification; optimized for automated optical inspection (AOI) and solder joint reliability Preferred for high-volume automotive production requiring enhanced process yield and IPC Class 3 compliance

Compared with S9S12G48F1CLC, the S9S12G48F0MLC lacks automotive qualification and thermal margin, while the MC9S12G48MALR offers identical specs with improved manufacturability - making it a drop-in replacement for new designs targeting higher assembly yield.

Availability

S9S12G48F1CLC is available at Aetrix Electronics and suitable for engine control units, body control modules, and transmission control units requiring stable component supply across extended product lifecycles.

Supply support for S9S12G48F1CLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The MC9S12G family was designed specifically for cost-sensitive, high-reliability automotive applications requiring CAN connectivity, functional safety support, and long-term supply stability - with S9S12G48F1CLC targeting mid-tier powertrain and chassis control modules.

FAQ

What is the maximum operating frequency of the S9S12G48F1CLC?

The S9S12G48F1CLC supports a maximum core clock frequency of 25 MHz, achievable via its internal PLL when driven by an external 8 MHz crystal. The PLL allows flexible clock scaling for balancing performance and power consumption in automotive applications where deterministic timing is critical. This frequency applies to the CPU12 core execution speed, independent of peripheral clock domains.

Does the S9S12G48F1CLC support CAN FD?

No, the S9S12G48F1CLC integrates the S12MSCANV3 module, which implements classical CAN 2.0B protocol only - supporting data frames up to 8 bytes and bit rates up to 1 Mbps. It does not support CAN FD features such as variable bit rate, extended data length (up to 64 bytes), or CRC enhancements. For CAN FD, designers must select newer S32K or SPC5 families.

Is the S9S12G48F1CLC pin-compatible with other MC9S12G variants?

Yes, the S9S12G48F1CLC in LQFP-64 package shares identical pinout with all MC9S12G family members in the same 64-pin footprint, including S9S12G64F1CLC and S9S12G96F1CLC. Pin assignments for power, ground, CAN, BDM, and primary I/O are fully consistent - enabling hardware reuse across Flash size variants during design scaling.

What debug interface does the S9S12G48F1CLC provide?

The S9S12G48F1CLC uses the Background Debug Module (BDM) interface via the BKGD pin, supporting single-wire serial communication for flash programming, register read/write, and real-time breakpoint debugging. It requires an NXP-compatible BDM pod (e.g., USB-ML-12) and Codewarrior IDE - no JTAG port is present on this device.

What is the Flash endurance specification for the S9S12G48F1CLC?

The S9S12G48F1CLC guarantees 100,000 erase/write cycles for its 48 KB on-chip Flash memory, validated under AEC-Q100 stress conditions. Each sector can be erased independently, and ECC circuitry transparently corrects single-bit errors during read operations - ensuring data integrity over the full automotive service life.

S9S12G48F1CLC Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
32-LQFP
Series:
HCS12
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
12V1
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
48KB (48K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1.5K x 8
RAM Size:
4K x 8
Voltage - Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S12G48F1CLC FAQ

1.How can I place an order for S9S12G48F1CLC through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S12G48F1CLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S12G48F1CLC reliable?

The price and inventory of S9S12G48F1CLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S12G48F1CLC is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S12G48F1CLC transactions.

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S9S12G48F1CLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S12G48F1CLC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S12G48F1CLC?

For technical support, including S9S12G48F1CLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S12G48F1CLC requirements.

6.How does Aetrix verify that S9S12G48F1CLC is sourced from the original manufacturer or authorized distributors?

All S9S12G48F1CLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S12G48F1CLC meets industry standards.

7.What is the process for return or replacement of S9S12G48F1CLC?

All S9S12G48F1CLC units undergo pre-shipment inspection (PSI). If there is an issue with S9S12G48F1CLC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S12G48F1CLC part is unused and in its original packaging.

Return procedure for S9S12G48F1CLC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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