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NXP Semiconductors S9S12G48F1CLCR

Part No.:
S9S12G48F1CLCR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
32-LQFP
Datasheet:
AetrixS9S12G48F1CLCR.pdf
Description:
IC MCU 16BIT 48KB FLASH 32LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,703

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Product details

Overview

S9S12G48F1CLCR from NXP Semiconductors is a 16-bit automotive-grade microcontroller featuring 48 KB on-chip Flash with ECC, 4 KB SRAM, and integrated CAN 2.0B controller. It operates at up to 25 MHz core frequency, supports -40°C to +125°C ambient temperature, and includes 10-bit ADC (8-channel), 8-bit DAC, PWM, and BDM debug interface. It is used in engine control units, body electronics, and transmission control modules.

For engineers reviewing the S9S12G48F1CLCR datasheet, S9S12G48F1CLCR pinout, S9S12G48F1CLCR application, or S9S12G48F1CLCR equivalent, key selection criteria include AEC-Q100 Grade 1 qualification, 48 KB Flash with ECC protection, CAN 2.0B compliance, and support for background debug via single-wire BKGD pin.

Technical Context

The S9S12G48F1CLCR implements the S12 CPU12 core with 16-bit data path and 24-bit addressing, executing instructions in 1–3 bus cycles. Its clock system integrates an internal RC oscillator (1–8 MHz), external crystal input (1–32 MHz), and PLL for scalable system clock generation up to 50 MHz bus speed.

Memory subsystem includes 48 KB Flash organized in 1-KB sectors with ECC error detection/correction, 4 KB SRAM, and 512 B EEPROM emulation via Flash. Peripheral integration follows the MC9S12G family architecture: TIM16B8CV3 timer module, S12MSCANV3 CAN controller, ADC10B8CV2, and S12PWM8B8CV2 PWM unit.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureS12 CPU12 16-bit CISC core with 24-bit address space and 1–3 cycle instruction execution
Flash Memory48 KB with ECC protection-enables reliable code storage and runtime error correction in automotive environments
SRAM4 KB on-chip RAM for real-time variable storage and stack operations without external memory access
CAN InterfaceOne S12MSCANV3 module supporting CAN 2.0B protocol with 32 message buffers and programmable bit timing
ADC10-bit successive-approximation ADC with 8 input channels, 12.5 µs conversion time, and configurable reference voltage
Operating Temperature-40°C to +125°C ambient-qualified per AEC-Q100 Grade 1 for under-hood automotive applications
Package64-pin LQFP (10 mm × 10 mm, 0.5 mm pitch)-compatible with standard surface-mount reflow processes

Pinout & Package

Package: 64-pin LQFP (10 mm × 10 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level MSL3.

Pin/TerminalCircuit RoleDesign Meaning
BKGDBackground Debug PinSingle-wire bidirectional interface for programming, debugging, and flash erase via BDM protocol
VDD, VDDA, VDDXPower Supply InputsSeparate digital (VDD), analog (VDDA), and external oscillator (VDDX) rails ensure noise isolation and stable operation
VSS, VSSA, VSSXGround TerminalsDedicated digital ground (VSS), analog ground (VSSA), and oscillator ground (VSSX) minimize coupling noise
RESETActive-Low Reset InputAsynchronous reset assertion clears CPU registers and initiates boot sequence from vector table at 0xFFFE
XTAL, EXTALCrystal Oscillator TerminalsSupports fundamental-mode quartz crystals (1–32 MHz) for precise clock source with low jitter
CANH, CANLCAN Bus Differential PairDirect connection to ISO 11898-2 compliant transceiver; supports 1 Mbps CAN FD-ready physical layer

Key Features

FeatureDesign Value
AEC-Q100 Grade 1 QualificationValidated for continuous operation at 125°C junction temperature-meets automotive reliability requirements
On-Chip Flash ECCSingle-bit error correction and double-bit error detection prevents silent data corruption in safety-critical firmware
Integrated CAN 2.0B ControllerHardware message filtering, automatic retransmission, and bus-off recovery reduce CPU overhead in networked ECUs
Background Debug Module (BDM)Real-time debugging and flash programming via single-pin interface-no JTAG header required
Configurable ADC ReferenceInternal 5 V reference or external VREFH/VREFL inputs enable flexible sensor signal conditioning across voltage domains

Applications

Engine Control Unit (ECU)Body Control Module (BCM)

Use Scenario: Real-time monitoring of crankshaft position, throttle angle, and oxygen sensor signals in gasoline direct injection systems.

IC Role / Device Role / Timing Role: Primary MCU executing closed-loop fuel injection and spark timing algorithms with deterministic interrupt latency.

Use Value: 10-bit ADC with hardware-triggered sampling ensures sub-microsecond timing alignment between sensor capture and actuator output.

Use Scenario: Centralized management of door locks, window lifts, lighting, and HVAC controls in premium vehicle platforms.

IC Role / Device Role / Timing Role: System coordinator interfacing with LIN slaves and CAN gateway, handling power sequencing and fault logging.

Use Value: Integrated CAN controller and 4 KB SRAM enable concurrent message buffering and diagnostic response without external memory.

Transmission Control Unit (TCU)Advanced Driver Assistance Systems (ADAS) Sensor Interface

Use Scenario: Closed-loop control of solenoid valves and pressure sensors in 8-speed automatic transmissions.

IC Role / Device Role / Timing Role: Safety-aware controller with ASIL-B capable peripherals managing torque converter lockup and gear shift logic.

Use Value: Flash ECC and AEC-Q100 Grade 1 qualification ensure functional integrity during thermal transients and EMI exposure.

Use Scenario: Signal conditioning and preprocessing of radar or camera sensor outputs before forwarding to domain controller.

IC Role / Device Role / Timing Role: Edge-processing node performing analog front-end digitization and basic feature extraction.

Use Value: 8-bit DAC and PWM modules allow local calibration of sensor bias and active compensation circuits without host intervention.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S12G48F1MLCSame core, Flash, and peripherals but in 64-pin QFP package with wider 0.8 mm pitch and extended temperature range (-40°C to +150°C)Targeted at higher-temperature under-hood locations where LQFP thermal dissipation is insufficientSelect when board-level thermal design cannot maintain LQFP junction temperature below 125°C
S9S12G48F0MLFIdentical functionality but with 0 KB user-accessible EEPROM emulation (vs. 512 B in S9S12G48F1CLCR) and no internal voltage regulatorUsed in cost-sensitive modules where external power management IC handles regulation and EEPROM is implemented externallyChoose when system already includes dedicated PMIC and non-volatile parameter storage is handled off-chip

Compared with MC9S12G48F1MLC and S9S12G48F0MLF, the S9S12G48F1CLCR provides optimal balance of thermal performance, integrated EEPROM emulation, and compact LQFP packaging for mid-tier automotive ECUs requiring AEC-Q100 Grade 1 compliance without over-specifying package or memory.

Availability

S9S12G48F1CLCR is available at Aetrix Electronics and suitable for engine control units, body electronics modules, and transmission control applications requiring stable component supply across automotive production lifecycles.

Supply support for S9S12G48F1CLCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The MC9S12G family was designed specifically for cost-optimized, high-reliability automotive electronic control units requiring CAN connectivity, robust flash memory, and AEC-Q100 qualification.

FAQ

What is the maximum operating frequency of the S9S12G48F1CLCR?

The S9S12G48F1CLCR supports a maximum bus frequency of 50 MHz, achieved via its internal PLL that multiplies the external crystal or internal RC oscillator input. The core executes instructions at up to 25 MHz, with each instruction completing in 1–3 bus cycles depending on addressing mode and operand size. This timing enables deterministic real-time control in automotive applications such as engine management and transmission control where S9S12G48F1CLCR is commonly deployed.

Does the S9S12G48F1CLCR include hardware-based error correction for Flash memory?

Yes, the S9S12G48F1CLCR includes built-in ECC (Error Correction Code) circuitry for its 48 KB on-chip Flash memory. It provides single-bit error correction and double-bit error detection per 64-bit word, ensuring data integrity during program execution and firmware updates. This capability is critical for automotive applications where latent Flash errors could compromise functional safety, and it is explicitly enabled and managed by the S9S12G48F1CLCR's Flash controller without requiring software overhead.

How many CAN controllers does the S9S12G48F1CLCR integrate?

The S9S12G48F1CLCR integrates one fully compliant CAN 2.0B controller (S12MSCANV3 module) with 32 message buffers, programmable bit timing, and hardware acceptance filtering. It supports data rates up to 1 Mbps and includes bus-off recovery, automatic retransmission, and wake-up-on-CAN functionality. No additional CAN controllers are present on-die; multi-CAN designs require external transceivers or companion ICs. This single-controller configuration is typical for entry-to-mid-tier automotive ECUs where S9S12G48F1CLCR is applied.

What debug interface does the S9S12G48F1CLCR support?

The S9S12G48F1CLCR supports the Background Debug Mode (BDM) interface via the BKGD pin-a single-wire, half-duplex serial protocol compatible with standard NXP BDM tools. It enables full read/write memory access, register inspection, breakpoint setting, and Flash programming without halting real-time operation. Unlike JTAG or SWD, BDM requires no dedicated debug pins beyond BKGD and ground, simplifying PCB layout. This interface is natively supported by S9S12G48F1CLCR's S12SBDMV1 module and documented in the MC9S12G Family Reference Manual.

Is the S9S12G48F1CLCR qualified for automotive use?

Yes, the S9S12G48F1CLCR is qualified per AEC-Q100 Grade 1, specifying operation from -40°C to +125°C ambient temperature and passing stress tests including HTOL, TC, and ESD. It meets automotive reliability standards for engine bay and cabin-mounted ECUs. The device also includes features essential for automotive safety: Flash ECC, COP watchdog, and memory protection logic-all validated in the S9S12G48F1CLCR's production test flow and referenced in NXP's official qualification reports.

S9S12G48F1CLCR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
32-LQFP
Series:
HCS12
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
12V1
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
48KB (48K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1.5K x 8
RAM Size:
4K x 8
Voltage - Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S12G48F1CLCR FAQ

1.How can I place an order for S9S12G48F1CLCR through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S12G48F1CLCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S12G48F1CLCR reliable?

The price and inventory of S9S12G48F1CLCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S12G48F1CLCR is usually 5 days.

3.What payment methods are accepted for S9S12G48F1CLCR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S12G48F1CLCR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S9S12G48F1CLCR?

S9S12G48F1CLCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S12G48F1CLCR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S12G48F1CLCR?

For technical support, including S9S12G48F1CLCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S12G48F1CLCR requirements.

6.How does Aetrix verify that S9S12G48F1CLCR is sourced from the original manufacturer or authorized distributors?

All S9S12G48F1CLCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S12G48F1CLCR meets industry standards.

7.What is the process for return or replacement of S9S12G48F1CLCR?

All S9S12G48F1CLCR units undergo pre-shipment inspection (PSI). If there is an issue with S9S12G48F1CLCR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S12G48F1CLCR part is unused and in its original packaging.

Return procedure for S9S12G48F1CLCR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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