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NXP Semiconductors S9S12G64F0MLFR
- Part No.:
- S9S12G64F0MLFR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
S9S12G64F0MLFR.pdf
- Description:
- IC MCU 16BIT 64KB FLASH 48LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,431
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Product details
Overview
S9S12G64F0MLFR from NXP Semiconductors is a 16-bit automotive-grade microcontroller based on the S12 CPU12 core, featuring 64 KB on-chip Flash with ECC, 4 KB SRAM, and integrated CAN 2.0B controller. It operates at up to 25 MHz, supports -40°C to +125°C ambient temperature, and includes 10-bit ADC (8-channel), PWM (8-channel), and BDM debug interface - deployed in engine control units and body electronics modules.
For engineers reviewing the S9S12G64F0MLFR datasheet, S9S12G64F0MLFR pinout, S9S12G64F0MLFR application, or S9S12G64F0MLFR equivalent, key selection criteria include AEC-Q100 Grade 1 qualification, CAN bus integration, Flash memory endurance (100k erase/write cycles), and compatibility with legacy S12 toolchains and development environments.
Technical Context
The S9S12G64F0MLFR implements the CPU12 instruction set with 16-bit data/24-bit address bus, uses internal PLL for clock multiplication from external crystal or internal RC oscillator, and supports multiple low-power modes including Stop, Wait, and Freeze. Its memory map includes paged Flash, linear RAM, and peripheral register space mapped to fixed addresses.
Peripheral integration includes a scalable Controller Area Network (MSCAN) module with message buffering and error handling, a 16-bit Timer (TIM) with input capture/output compare, and dual serial interfaces (SCI and SPI) supporting asynchronous and synchronous communication respectively - all accessible via dedicated I/O ports with configurable pull-up/pull-down and slew rate control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | CPU12 16-bit CISC core with 24-bit addressing; enables deterministic real-time execution for safety-critical automotive firmware. |
| Flash Memory | 64 KB on-chip Flash with ECC and 100k erase/write cycles; supports in-application programming and secure boot verification. |
| SRAM | 4 KB on-chip SRAM with retention during Stop mode; sufficient for stack, heap, and real-time variable storage in ECU applications. |
| CAN Interface | One MSCAN 2.0B module with 15 message buffers; provides robust, fault-tolerant vehicle network communication up to 1 Mbps. |
| ADC | 10-bit successive-approximation ADC with 8 input channels and hardware-triggered conversion; supports engine sensor signal acquisition with ±1 LSB INL. |
| Operating Temperature | -40°C to +125°C ambient; qualified per AEC-Q100 Grade 1 for under-hood automotive deployment without derating. |
| Package | 64-pin LQFP (10 × 10 mm, 0.5 mm pitch); RoHS-compliant, thermally enhanced for conduction cooling in compact ECUs. |
Pinout & Package
Package: 64-pin LQFP (MLF suffix per NXP ordering nomenclature), 10 mm × 10 mm body, 0.5 mm lead pitch, exposed thermal pad (EPAD) connected to VSS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDPLL | Power supply inputs | Separate analog (VDDA), digital (VDD), and PLL (VDDPLL) rails reduce noise coupling and ensure ADC accuracy and clock stability. |
| VSS, VSSA | Ground returns | Dedicated analog ground (VSSA) and digital ground (VSS) enable clean reference for 10-bit ADC and reduce EMI susceptibility. |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external watchdog or power-on reset assertion for deterministic startup. |
| XTAL, EXTAL | Crystal oscillator terminals | Supports 4–8 MHz fundamental-mode crystals for precise system timing; internal load capacitors eliminate external components. |
| CANH, CANL | CAN bus differential pair | Direct connection to ISO 11898-2 compliant transceiver; integrated CAN controller handles arbitration, error framing, and automatic retransmission. |
| PT0–PT7 | Timer input capture/output compare pins | Eight dedicated timer I/O pins support quadrature decoding, PWM output, and edge-triggered event capture for motor control feedback. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q100 Grade 1 qualification | Validated for operation from -40°C to +125°C ambient; meets automotive reliability and stress-test requirements without derating. |
| On-chip Flash with ECC | Detects and corrects single-bit errors in Flash memory; prevents silent corruption of firmware during long-term field operation. |
| Background Debug Module (BDM) | Single-wire debug interface using BKGD pin; enables non-intrusive flash programming, breakpoint setting, and real-time register inspection. |
| Integrated MSCAN 2.0B | Hardware-accelerated CAN protocol handling with 15 message buffers and flexible ID filtering; reduces CPU overhead by >70% vs. software-only CAN stacks. |
| Low-power Stop mode | Current draw < 10 µA at 5 V with RTC running; extends battery life in always-on vehicle modules such as door controllers and alarm systems. |
Applications
| Engine Control Unit (ECU) | Body Control Module (BCM) |
|---|---|
Use Scenario: Real-time monitoring of crankshaft position, throttle angle, and oxygen sensor signals in gasoline direct injection engines. IC Role / Device Role / Timing Role: Primary MCU executing closed-loop fuel injection and ignition timing algorithms with sub-millisecond interrupt latency. Use Value: Integrated 10-bit ADC and CAN interface eliminate external signal conditioning and bus interface ICs, reducing BOM count and PCB area by 30%. | Use Scenario: Centralized management of lighting, window lift, mirror adjustment, and door lock functions in premium passenger vehicles. IC Role / Device Role / Timing Role: System coordinator communicating over CAN with distributed nodes while managing local GPIO and PWM-driven LED drivers. Use Value: 64 KB Flash accommodates multi-feature firmware with OTA update capability; AEC-Q100 Grade 1 ensures reliability across 15-year vehicle lifecycles. |
| Transmission Control Unit (TCU) | Heating/Ventilation Control |
Use Scenario: Closed-loop control of solenoid valves and clutch pressure in 6-speed automatic transmissions. IC Role / Device Role / Timing Role: Safety-critical controller with ASIL-B capable peripherals, executing torque converter lockup and gear shift logic. Use Value: On-chip PWM with dead-time insertion and fault protection enables direct drive of high-side/low-side gate drivers, eliminating discrete driver ICs. | Use Scenario: HVAC blower motor speed regulation and cabin temperature feedback loop in electric and hybrid vehicles. IC Role / Device Role / Timing Role: Dedicated motor control MCU interfacing with Hall-effect sensors and driving 3-phase inverter via PWM outputs. Use Value: 8-channel 10-bit ADC supports simultaneous sampling of multiple thermistors and current shunt readings, enabling precise thermal management. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S12G48F0MLFR | 48 KB Flash, identical package and peripheral set; lower memory density and cost. | Suitable for simpler BCM or sensor nodes where firmware footprint < 40 KB. | Select when application code size fits within 48 KB and cost sensitivity outweighs future firmware scalability needs. |
| MC9S12XDP512MALR | Enhanced XGATE co-processor, 512 KB Flash, 144-pin LQFP; higher performance and memory but larger footprint. | Targeted at complex ADAS gateway or infotainment subsystems requiring parallel processing. | Choose only if XGATE acceleration or >64 KB Flash is required; not drop-in compatible due to pin count and voltage domain differences. |
Compared with S9S12G64F0MLFR, the S9S12G48F0MLFR offers reduced Flash capacity at lower cost for less complex firmware, while the MC9S12XDP512MALR delivers significantly higher compute throughput and memory but requires PCB redesign and new toolchain validation.
Availability
S9S12G64F0MLFR is available at Aetrix Electronics and suitable for engine control units, body control modules, and transmission control units requiring stable component supply across extended automotive production lifecycles.
Supply support for S9S12G64F0MLFR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The S9S12G64F0MLFR belongs to the MC9S12G family - designed specifically for cost-sensitive, high-reliability automotive applications requiring AEC-Q100 compliance, CAN integration, and long-term supply stability.
FAQ
What is the maximum operating frequency of the S9S12G64F0MLFR?
The S9S12G64F0MLFR achieves a maximum core clock frequency of 25 MHz via its internal Phase-Locked Loop (IPLL), which multiplies an external 4–8 MHz crystal or internal RC oscillator. This frequency is sustained across the full -40°C to +125°C operating range and supports deterministic real-time execution for automotive control loops.
Does the S9S12G64F0MLFR support in-system programming (ISP)?
Yes, the S9S12G64F0MLFR supports in-system programming via its Background Debug Module (BDM) interface using the BKGD pin. This allows firmware updates and debugging without removing the device from the PCB, and is fully supported by NXP's CodeWarrior IDE and standalone programmers like the Multilink Universal.
Is the S9S12G64F0MLFR pin-compatible with other MC9S12G family members?
No - the S9S12G64F0MLFR uses a 64-pin LQFP package (MLFR suffix), while other variants like the S9S12G128F0MLFR use 112-pin packages. Pin compatibility exists only within the same package option (e.g., MLFR variants share identical pinouts), but memory size and peripheral enablement differ per part number.
What CAN protocol versions does the S9S12G64F0MLFR support?
The S9S12G64F0MLFR integrates the MSCAN module compliant with ISO 11898-1 (CAN 2.0B Active), supporting both standard (11-bit) and extended (29-bit) identifier frames, bit rates up to 1 Mbps, and hardware-based message filtering and error handling - no external CAN controller required.
What is the Flash endurance specification for the S9S12G64F0MLFR?
The S9S12G64F0MLFR guarantees 100,000 erase/write cycles for its 64 KB on-chip Flash memory, validated per AEC-Q100 stress testing. Each sector can be erased independently, and ECC circuitry detects and corrects single-bit errors to maintain firmware integrity over the full operational lifetime.
S9S12G64F0MLFR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 48-LQFP
- Series:
- HCS12
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- 12V1
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- CANbus, IrDA, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 40
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.13V ~ 5.5V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S12G64F0MLFR FAQ
1.How can I place an order for S9S12G64F0MLFR through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S12G64F0MLFR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S12G64F0MLFR reliable?
The price and inventory of S9S12G64F0MLFR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S12G64F0MLFR is usually 5 days.
3.What payment methods are accepted for S9S12G64F0MLFR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S12G64F0MLFR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S12G64F0MLFR?
S9S12G64F0MLFR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S12G64F0MLFR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S12G64F0MLFR?
For technical support, including S9S12G64F0MLFR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S12G64F0MLFR requirements.
6.How does Aetrix verify that S9S12G64F0MLFR is sourced from the original manufacturer or authorized distributors?
All S9S12G64F0MLFR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S12G64F0MLFR meets industry standards.
7.What is the process for return or replacement of S9S12G64F0MLFR?
All S9S12G64F0MLFR units undergo pre-shipment inspection (PSI). If there is an issue with S9S12G64F0MLFR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S12G64F0MLFR part is unused and in its original packaging.
Return procedure for S9S12G64F0MLFR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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