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NXP Semiconductors S9S12G64F0VLFR

Part No.:
S9S12G64F0VLFR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
48-LQFP
Datasheet:
AetrixS9S12G64F0VLFR.pdf
Description:
IC MCU 16BIT 64KB FLASH 48LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,633

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Product details

Overview

S9S12G64F0VLFR from NXP Semiconductors is a 16-bit automotive-grade microcontroller in the S12G family, featuring 64 KB on-chip Flash with ECC, 4 KB SRAM, and integrated CAN 2.0B controller. It operates at up to 25 MHz core frequency, supports -40°C to +105°C ambient temperature, and includes 10-bit ADC (8-channel), PWM (8-channel), and BDM debug interface. It is used in engine control units (ECUs) for real-time sensor signal acquisition and actuator drive logic.

For engineers reviewing the S9S12G64F0VLFR datasheet, S9S12G64F0VLFR pinout, S9S12G64F0VLFR application, or S9S12G64F0VLFR equivalent, key selection criteria include AEC-Q100 Grade 2 qualification, 64 KB Flash with ECC protection, 8-channel 10-bit ADC with external trigger support, and native CAN 2.0B compliance for automotive network integration.

Technical Context

The S9S12G64F0VLFR implements the S12 CPU12 core with 16-bit data path and 24-bit address bus, executing instructions from on-chip Flash or RAM. Its clock system integrates an internal RC oscillator (1–8 MHz), main external crystal oscillator (1–33 MHz), and PLL for scalable system clock generation up to 50 MHz bus speed.

Memory protection is enforced via background debug module (BDM) security lock and flash security byte; peripheral modules-including TIM, PWM, SCI, SPI, MSCAN, and ADC-are memory-mapped and accessible via standard S12 addressing modes with configurable interrupt vectors and priority levels.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureS12 CPU12 16-bit CISC core with 24-bit addressing and 16-level hardware stack
Flash Memory64 KB on-chip Flash with ECC, 1K EEPROM emulation, and 100K write/erase cycles
SRAM4 KB on-chip SRAM with retention during stop mode
ADC10-bit successive-approximation ADC with 8 input channels, 12.5 µs conversion time, and external trigger capability
CAN InterfaceScalable Controller Area Network (MSCAN) module compliant with ISO 11898-1, supporting CAN 2.0B protocol with 32 message buffers
Operating Temperature-40°C to +105°C ambient, qualified per AEC-Q100 Grade 2 for under-hood automotive use
Supply Voltage4.5 V to 5.5 V single-supply operation with on-chip 5 V voltage regulator

Pinout & Package

Package: 64-pin LQFP (10 mm × 10 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDA, VDDXPower supply inputsDigital, analog, and external oscillator supply rails; require separate decoupling for noise immunity
VSS, VSSA, VSSXGround terminalsDigital, analog, and oscillator ground; must be connected to low-impedance common ground plane
XTAL, EXTALCrystal oscillator connectionsSupports 1–33 MHz external crystal; enables precise timing for CAN bit rate and ADC sampling clocks
RESETActive-low reset inputAsynchronous reset with internal pull-up; initiates cold start sequence and clears all registers
PORTA[7:0]General-purpose I/O with ADC channel mappingPA0–PA7 serve as ADC inputs AD0–AD7 and support digital read/write with programmable pull-ups
PORTB[7:0]General-purpose I/O with CAN TX/RX and SCI functionsPB0/PB1 are dedicated CAN TX/RX; PB2–PB3 support SCI0 transmit/receive; others configurable as GPIO
PORTC[7:0]General-purpose I/O with PWM and timer capturePC0–PC7 map to PWM0–PWM7 outputs and TIM channel inputs; support edge-triggered interrupts
PORTD[7:0]General-purpose I/O with SPI and BDM interfacePD0–PD2 are SPI MOSI/MISO/SCK; PD3 is BDM BKGD pin; others configurable as GPIO with interrupt capability

Key Features

FeatureDesign Value
On-chip Flash with ECCEnables reliable code storage in harsh automotive environments by detecting and correcting single-bit errors in real time
Integrated MSCAN ModuleProvides full CAN 2.0B protocol handling without external transceiver logic-reduces BOM count and PCB footprint
Background Debug Module (BDM)Allows non-intrusive in-circuit debugging via single-wire BKGD interface, supporting flash programming and real-time register inspection
10-bit ADC with External TriggerSupports synchronized sampling across multiple sensors using external event signals (e.g., crankshaft position pulse), critical for engine timing accuracy
AEC-Q100 Grade 2 QualificationValidated for continuous operation at 105°C junction temperature, meeting automotive reliability and lifetime requirements

Applications

Engine Control Unit (ECU)Transmission Control Module (TCM)

Use Scenario: Real-time acquisition of throttle position, coolant temperature, and oxygen sensor signals in gasoline direct injection systems.

IC Role / Device Role / Timing Role: Central controller executing closed-loop fuel injection and spark timing algorithms with sub-millisecond latency.

Use Value: 64 KB Flash stores complex calibration maps; 10-bit ADC resolves sensor resolution down to 4.88 mV per LSB at 5 V reference.

Use Scenario: Monitoring turbine speed, clutch pressure, and gear selector position in 6-speed automatic transmissions.

IC Role / Device Role / Timing Role: Actuator driver coordinating solenoid valve timing and torque converter lock-up based on CAN bus commands from ECU.

Use Value: Native MSCAN interface ensures deterministic message scheduling with <10 µs jitter, meeting ASAM MCD-2 MC timing constraints.

Body Control Module (BCM)Electric Power Steering (EPS)

Use Scenario: Managing door lock actuators, window lift motors, and interior lighting via LIN and CAN networks.

IC Role / Device Role / Timing Role: Low-power coordinator interfacing with LIN slaves while maintaining CAN gateway functionality.

Use Value: Stop-mode current draw <10 µA enables battery-conscious always-on monitoring without parasitic drain.

Use Scenario: Processing torque sensor feedback and motor phase currents to generate assist torque commands in real time.

IC Role / Device Role / Timing Role: Safety-critical controller implementing ASIL-B compliant motor control loops with dual-core redundancy support.

Use Value: On-chip 4 KB SRAM provides dedicated buffer space for PID computation and fault logging without external memory access delay.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S9S12G48F0VLFR48 KB Flash, identical package and peripheral set except reduced program memorySuitable for cost-sensitive ECUs with smaller firmware footprints and fewer calibration tablesSelect when application firmware size remains below 42 KB and no future feature expansion is planned
MC9S12G128F0VLFR128 KB Flash, same pinout and peripheral complement, higher memory densityRequired for advanced diagnostics, OTA update storage, or multi-variant software builds in Tier-1 ECU platformsChoose when future-proofing against firmware growth or integrating UDS diagnostic stacks exceeding 80 KB

Compared with S9S12G48F0VLFR, the S9S12G64F0VLFR provides 16 KB additional Flash for extended calibration data and diagnostic routines; versus MC9S12G128F0VLFR, it reduces die cost and power consumption while retaining full peripheral compatibility for mid-tier automotive control tasks.

Availability

S9S12G64F0VLFR is available at Aetrix Electronics and suitable for engine control units, transmission control modules, and body control modules requiring stable component supply across automotive production lifecycles.

Supply support for S9S12G64F0VLFR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The S9S12G64F0VLFR belongs to the MC9S12G family-designed specifically for cost-optimized, high-reliability automotive control applications requiring AEC-Q100 qualification, integrated CAN, and robust flash memory integrity.

FAQ

What is the maximum operating frequency of the S9S12G64F0VLFR?

The S9S12G64F0VLFR supports a maximum core frequency of 25 MHz, with bus speeds scalable up to 50 MHz using the internal PLL. This allows deterministic execution of time-critical automotive control loops while maintaining compatibility with standard 5 V logic interfaces and external peripherals such as CAN transceivers and ADC drivers. The PLL configuration is fully software-controllable via the CPMU module registers.

Does the S9S12G64F0VLFR support CAN FD?

No, the S9S12G64F0VLFR implements the legacy MSCAN module compliant only with CAN 2.0A/B protocols-not CAN FD. It supports bit rates up to 1 Mbps with programmable timing registers but lacks the arbitration field extension, flexible data-rate switching, and increased payload length required for CAN FD. For CAN FD applications, designers should consider NXP's S32K series or standalone CAN FD controllers.

How is flash memory protected against corruption in the S9S12G64F0VLFR?

The S9S12G64F0VLFR uses on-chip ECC (Error Correction Code) across its 64 KB Flash array to detect and correct single-bit errors in real time during read operations. Additionally, flash security is enforced via a programmable security byte that disables read/write access to memory when set, preventing unauthorized firmware extraction. The BDM interface also supports secure flash programming with password-protected unlock sequences.

What debug interface does the S9S12G64F0VLFR provide?

The S9S12G64F0VLFR features the Background Debug Module (BDM) interface, accessed via the BKGD pin (PD3) and using a single-wire serial protocol. It supports full in-circuit debugging-including breakpoint setting, register inspection, memory read/write, and flash programming-without halting real-time peripheral operation. No JTAG port is present; BDM is the sole standardized debug method for this device.

Is the S9S12G64F0VLFR pin-compatible with other MC9S12G family members?

Yes, the S9S12G64F0VLFR is pin-compatible with other 64-pin LQFP variants in the MC9S12G family-including S9S12G48F0VLFR and S9S12G128F0VLFR-sharing identical pin assignments, electrical characteristics, and peripheral mappings. This enables drop-in replacement across memory variants without PCB redesign, provided the target application fits within the respective Flash and RAM limits of each part.

S9S12G64F0VLFR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
48-LQFP
Series:
HCS12
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
12V1
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
4K x 8
Voltage - Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S12G64F0VLFR FAQ

1.How can I place an order for S9S12G64F0VLFR through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S12G64F0VLFR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S12G64F0VLFR reliable?

The price and inventory of S9S12G64F0VLFR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S12G64F0VLFR is usually 5 days.

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S9S12G64F0VLFR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S12G64F0VLFR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S12G64F0VLFR?

For technical support, including S9S12G64F0VLFR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S12G64F0VLFR requirements.

6.How does Aetrix verify that S9S12G64F0VLFR is sourced from the original manufacturer or authorized distributors?

All S9S12G64F0VLFR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S12G64F0VLFR meets industry standards.

7.What is the process for return or replacement of S9S12G64F0VLFR?

All S9S12G64F0VLFR units undergo pre-shipment inspection (PSI). If there is an issue with S9S12G64F0VLFR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S12G64F0VLFR part is unused and in its original packaging.

Return procedure for S9S12G64F0VLFR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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