My Inquiry
My Account
NXP Semiconductors S9S12G64F0VLH
- Part No.:
- S9S12G64F0VLH
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
S9S12G64F0VLH.pdf
- Description:
- IC MCU 16BIT 64KB FLASH 64LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,340
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S9S12G64F0VLH from NXP Semiconductors is a 16-bit automotive-grade microcontroller based on the S12 CPU12 core, featuring 64 KB on-chip Flash with ECC, 4 KB SRAM, and integrated CAN 2.0B controller. It operates at up to 25 MHz, supports -40°C to +105°C ambient temperature, and includes 10-bit ADC (8-channel), 8-bit DAC, PWM, and BDM debug interface - deployed in engine control units and body electronics modules.
For engineers reviewing the S9S12G64F0VLH datasheet, S9S12G64F0VLH pinout, S9S12G64F0VLH application, or S9S12G64F0VLH equivalent, key selection criteria include AEC-Q100 Grade 2 qualification, 64 KB Flash with ECC protection, 8-channel 10-bit ADC with external trigger support, and native CAN 2.0B compliance for automotive network integration.
Technical Context
The S9S12G64F0VLH implements the S12 CPU12 instruction set with 16-bit data path and 24-bit addressing, supporting both single-chip and expanded modes. Its memory subsystem integrates 64 KB Flash (with error correction), 4 KB SRAM, and 1 KB EEPROM emulation via Flash.
Peripherals include a scalable CAN 2.0B module (MSCAN), 8-channel 10-bit ADC with configurable sample-and-hold and external trigger inputs, 8-bit DAC with 5 V reference, 8-channel PWM with center-aligned mode, and dual serial interfaces (SCI and SPI). Clocking uses internal RC oscillator (1–8 MHz), external crystal (1–33 MHz), and PLL for up to 25 MHz system clock.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | S12 CPU12 16-bit CISC core with 24-bit address bus and 16-bit data bus - enables deterministic real-time control with legacy S12 software compatibility. |
| Flash Memory | 64 KB on-chip Flash with ECC and 100K write/erase cycles - ensures functional safety compliance and long-term reliability in automotive ECU firmware storage. |
| SRAM | 4 KB on-chip SRAM with retention during stop mode - supports low-power wake-up routines and critical variable storage without external memory. |
| ADC | 10-bit resolution, 8 input channels, 12.5 µs conversion time - suitable for precise analog sensor acquisition (e.g., throttle position, coolant temperature) in closed-loop control. |
| CAN Interface | Scalable Controller Area Network (MSCAN) compliant with ISO 11898-1, supporting CAN 2.0B protocol with 32 message buffers - enables robust vehicle network communication at up to 1 Mbps. |
| Operating Temperature | -40°C to +105°C ambient - qualified per AEC-Q100 Grade 2, enabling deployment in under-hood automotive environments. |
| Package | 64-pin LQFP (10 × 10 mm, 0.5 mm pitch) - provides mechanical stability and thermal performance for high-reliability PCB layouts. |
Pinout & Package
64-pin LQFP package (10 × 10 mm, 0.5 mm pitch) with exposed thermal pad; RoHS-compliant, moisture sensitivity level MSL3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDX | Power supply (digital, analog, XOSC) | Separate 5 V supplies ensure noise isolation between digital logic, analog peripherals, and crystal oscillator circuitry. |
| VSS, VSSA, VSSX | GND (digital, analog, XOSC) | Dedicated ground returns minimize coupling noise and improve ADC/DAC accuracy and oscillator stability. |
| XTAL, EXTAL | External crystal oscillator terminals | Supports 4–33 MHz crystals for precise timing; internal load capacitors eliminate need for external caps in many designs. |
| CANH, CANL | CAN bus differential pair | Direct connection to physical CAN transceiver; integrated CAN controller handles message filtering, buffering, and error handling. |
| AD0–AD7 | Analog input channels | 8 dedicated ADC inputs with programmable gain and sampling control - enable simultaneous multi-sensor monitoring without multiplexer overhead. |
| PT0–PT7 | Timer input capture/output compare pins | Support quadrature decoding, pulse-width measurement, and PWM output generation with hardware synchronization. |
Key Features
| Feature | Design Value |
|---|---|
| On-chip Flash with ECC | 64 KB Flash with single-bit error correction and double-bit error detection - meets ASIL-B functional safety requirements for automotive control applications. |
| Background Debug Module (BDM) | Single-wire debug interface supporting flash programming, real-time register inspection, and breakpoint execution - eliminates need for JTAG header space and simplifies production programming. |
| Integrated MSCAN Controller | Hardware-accelerated CAN 2.0B with 32 message buffers, automatic retransmission, and bus-off recovery - reduces CPU load and improves network determinism. |
| 10-bit ADC with External Trigger | 8-channel ADC with programmable sample rate, external trigger input (ETRIG0), and result FIFO - enables synchronized sampling across multiple sensors in engine timing-critical applications. |
| Low-Power Stop Mode | Current draw < 10 µA in stop mode with RTC and BDM wake-up capability - extends battery life in always-on vehicle modules like door controllers and telematics gateways. |
Applications
| Engine Control Unit (ECU) | Body Control Module (BCM) |
|---|---|
Use Scenario: Real-time management of fuel injection timing, spark advance, and air-fuel ratio using sensor feedback from MAP, TPS, and O2 sensors. IC Role / Device Role / Timing Role: Primary control MCU executing closed-loop PID algorithms with sub-millisecond interrupt latency and deterministic timer-triggered ADC sampling. Use Value: Integrated 10-bit ADC, CAN 2.0B, and AEC-Q100 Grade 2 qualification enable direct sensor interfacing and vehicle network integration without external signal conditioning or protocol translation. |
Use Scenario: Centralized control of lighting, power windows, door locks, and HVAC functions across multiple vehicle domains. IC Role / Device Role / Timing Role: System coordinator managing I/O expansion, LIN/CAN gateway functions, and non-safety-critical real-time tasks. Use Value: 64 KB Flash supports feature-rich firmware with OTA update capability; 4 KB SRAM enables multitasking OS services and event buffering for human-machine interaction. |
| Transmission Control Unit (TCU) | Advanced Driver Assistance Systems (ADAS) Sensor Interface |
Use Scenario: Gear shift scheduling, clutch pressure modulation, and torque converter lockup control using transmission speed, pressure, and temperature inputs. IC Role / Device Role / Timing Role: Safety-aware controller implementing fail-safe strategies and diagnostic monitoring with watchdog supervision and memory integrity checks. Use Value: ECC-protected Flash and BDM debug support simplify functional safety certification (ISO 26262 ASIL-B), while PWM outputs directly drive solenoid valves with precise duty-cycle control. |
Use Scenario: Signal conditioning and preprocessing of radar or ultrasonic sensor outputs before forwarding to central ADAS processor. IC Role / Device Role / Timing Role: Edge-processing node performing analog front-end digitization, basic filtering, and CAN message formatting. Use Value: 10-bit ADC with external trigger synchronization allows phase-aligned sampling across multiple sensors; CAN interface enables seamless integration into existing vehicle domain architecture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S12G48F0VLH | 48 KB Flash, identical peripheral set and pinout - no change to PCB layout or software driver layer. | Lower firmware footprint requirement; suitable for cost-sensitive BCM or lighting modules with reduced feature set. | Select when application firmware fits within 48 KB and full 64 KB margin is unnecessary - reduces BOM cost without sacrificing peripheral capability. |
| S9S12G128F0VLH | 128 KB Flash, same package and peripheral complement - requires no PCB redesign but increases code capacity headroom. | Required for complex applications with bootloader, diagnostics stack, and future feature expansion (e.g., OTA updates, cybersecurity modules). | Choose when long-term firmware scalability, ASIL-D readiness, or dual-bank Flash for safe firmware updates is required - maintains full hardware compatibility. |
Compared with S9S12G48F0VLH, the S9S12G64F0VLH provides 33% more Flash for enhanced diagnostics and calibration data storage; versus S9S12G128F0VLH, it offers optimal balance of cost, code density, and functional safety headroom for mid-tier automotive ECUs.
Availability
S9S12G64F0VLH is available at Aetrix Electronics and suitable for engine control units, body control modules, and transmission control systems requiring stable component supply, automotive qualification, and long-term lifecycle support.
Supply support for S9S12G64F0VLH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The MC9S12G family was designed specifically for cost-sensitive, high-reliability automotive applications - delivering AEC-Q100 qualified 16-bit MCU performance with integrated CAN, ADC, and Flash ECC in compact LQFP packages.
FAQ
What is the maximum operating frequency of the S9S12G64F0VLH?
The S9S12G64F0VLH achieves a maximum system clock frequency of 25 MHz using its internal Phase-Locked Loop (IPLL) with external crystal or internal RC oscillator input. This frequency is validated across the full -40°C to +105°C temperature range and supports deterministic real-time execution for automotive control loops. The S9S12G64F0VLH's CPU12 core maintains instruction timing consistency at this speed, enabling reliable timing-critical operations such as PWM generation and ADC sampling.
Does the S9S12G64F0VLH support CAN FD?
No, the S9S12G64F0VLH implements the MSCAN module compliant only with CAN 2.0B (ISO 11898-1), not CAN FD. It supports standard and extended frame formats at bit rates up to 1 Mbps but lacks the higher bandwidth, flexible data-length, and CRC enhancements of CAN FD. For CAN FD applications, designers must select newer NXP families such as S32K1 or S32K3. The S9S12G64F0VLH remains fully compatible with legacy vehicle networks relying on classical CAN.
What debug interface does the S9S12G64F0VLH use?
The S9S12G64F0VLH uses the Background Debug Module (BDM) interface - a single-wire, asynchronous serial protocol operating at up to 1 Mbps. It supports flash programming, real-time register and memory access, and breakpoint-based debugging without halting peripheral operation. Unlike JTAG, BDM requires only one dedicated pin (BKGD), reducing PCB routing complexity. All official NXP tools, including the Cyclone Pro and standalone BDM programmers, fully support the S9S12G64F0VLH.
Is the S9S12G64F0VLH qualified for automotive use?
Yes, the S9S12G64F0VLH is AEC-Q100 qualified to Grade 2 (-40°C to +105°C), with full documentation of stress test results, failure-in-time (FIT) rate, and manufacturing process controls. It includes built-in features required for automotive safety: Flash ECC, COP watchdog, clock monitor, and BDM security lock. NXP provides automotive-specific qualification reports and PPAP documentation for the S9S12G64F0VLH upon request through authorized distribution channels.
What is the EEPROM emulation capability of the S9S12G64F0VLH?
The S9S12G64F0VLH does not contain physical EEPROM but supports EEPROM emulation using a designated region of its 64 KB Flash memory. NXP provides the "EEPROM Emulation Driver" (EED) software library, which manages wear leveling, atomic writes, and data integrity across Flash sectors. This implementation delivers 100K write/erase cycles and retains data for 10+ years at 105°C - meeting automotive requirements for parameter storage (e.g., odometer, calibration offsets) without external memory.
S9S12G64F0VLH Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP
- Series:
- HCS12
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- 12V1
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- CANbus, IrDA, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 54
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.13V ~ 5.5V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S12G64F0VLH FAQ
1.How can I place an order for S9S12G64F0VLH through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S12G64F0VLH on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S12G64F0VLH reliable?
The price and inventory of S9S12G64F0VLH are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S12G64F0VLH is usually 5 days.
3.What payment methods are accepted for S9S12G64F0VLH?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S12G64F0VLH transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S12G64F0VLH?
S9S12G64F0VLH orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S12G64F0VLH order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S12G64F0VLH?
For technical support, including S9S12G64F0VLH datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S12G64F0VLH requirements.
6.How does Aetrix verify that S9S12G64F0VLH is sourced from the original manufacturer or authorized distributors?
All S9S12G64F0VLH products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S12G64F0VLH meets industry standards.
7.What is the process for return or replacement of S9S12G64F0VLH?
All S9S12G64F0VLH units undergo pre-shipment inspection (PSI). If there is an issue with S9S12G64F0VLH, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S12G64F0VLH part is unused and in its original packaging.
Return procedure for S9S12G64F0VLH:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S9S12G64F0VLH Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
