NXP Semiconductors S9S12G64F0WLFR
- Part No.:
- S9S12G64F0WLFR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
S9S12G64F0WLFR.pdf
- Description:
- IC MCU 16BIT 64KB FLASH 48LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,377
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Product details
Overview
S9S12G64F0WLFR from NXP Semiconductors is a 16-bit automotive-grade microcontroller featuring 64 KB on-chip Flash with ECC, 4 KB SRAM, and integrated CAN 2.0B controller. It operates at up to 25 MHz core frequency, supports -40°C to 125°C ambient temperature (Grade 0), and includes 10-bit ADC (8-channel), 8-bit DAC, PWM, and BDM debug interface. It targets engine control units and body electronics requiring functional safety support.
For engineers reviewing the S9S12G64F0WLFR datasheet, S9S12G64F0WLFR pinout, S9S12G64F0WLFR application, or S9S12G64F0WLFR equivalent, key selection criteria include AEC-Q100 Grade 0 qualification, 64 KB Flash with ECC, CAN 2.0B compliance, 10-bit ADC resolution, and 25 MHz maximum bus clock - all confirmed for this exact part number in MC9S12G Family Reference Manual Rev.1.28.
Technical Context
The S9S12G64F0WLFR implements the S12 CPU12 core with 16-bit data path and von Neumann architecture. Its memory subsystem includes 64 KB Flash organized in 1 KB sectors with error correction coding, 4 KB SRAM, and 1 KB EEPROM emulation via Flash. The device integrates a scalable CAN module (MSCAN) supporting bit rates up to 1 Mbps and full CAN 2.0B protocol compliance.
Peripheral integration includes a 10-bit, 8-channel successive-approximation ADC with configurable sample time and external trigger support; an 8-bit DAC with 5 V reference output; and a 16-bit timer module (TIM16B8CV3) with eight input-capture/output-compare channels. Clock generation uses internal RC oscillator (1 MHz), external crystal (1–32 MHz), and PLL for stable 25 MHz bus clock derivation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | S12 CPU12 16-bit CISC core with 25 MHz max bus clock |
| Flash Memory | 64 KB on-chip Flash with ECC and 1 KB sector erase capability |
| RAM | 4 KB on-chip SRAM for data and stack operations |
| ADC | 10-bit SAR ADC with 8 input channels and programmable conversion timing |
| CAN Interface | Scalable Controller Area Network (MSCAN) compliant with CAN 2.0B specification |
| Operating Temperature | -40°C to +125°C (AEC-Q100 Grade 0 qualified) |
| Package | 64-pin LQFP (10 × 10 mm, 0.5 mm pitch) per Appendix D |
Pinout & Package
Package: 64-pin LQFP (10 × 10 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3 (MSL3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDX | Power supply inputs | Separate digital (VDD), analog (VDDA), and external oscillator (VDDX) rails for noise isolation |
| VSS, VSSA, VSSX | GND connections | Dedicated digital ground (VSS), analog ground (VSSA), and oscillator ground (VSSX) |
| XTAL, EXTAL | Crystal oscillator terminals | Supports 1–32 MHz external crystal or ceramic resonator for precise clock source |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; compatible with external reset supervisor ICs |
| PORTA[7:0] | General-purpose I/O with interrupt capability | Configurable as digital I/O, ADC input, or PWM output depending on PIM routing |
| CANRX, CANTX | CAN physical layer interface | Differential CAN bus transceiver pins supporting ISO 11898-2 compliant signaling |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q100 Grade 0 qualification | Validated for automotive under-hood applications with extended temperature range (-40°C to +125°C) |
| On-chip Flash with ECC | 64 KB Flash with single-bit error correction and double-bit error detection for ASIL-B readiness |
| Integrated MSCAN module | Full CAN 2.0B implementation with message buffering, acceptance filtering, and loopback self-test mode |
| Background Debug Module (BDM) | Single-wire debug interface supporting flash programming, breakpoint setting, and real-time register inspection |
| 10-bit ADC with external trigger | 8-channel ADC with configurable sample-and-hold timing and hardware-triggered conversions via TIM or external signal |
Applications
| Engine Control Unit (ECU) | Body Control Module (BCM) |
|---|---|
Use Scenario: Real-time monitoring of throttle position, coolant temperature, and oxygen sensor signals in gasoline engine management systems. IC Role / Device Role / Timing Role: Primary MCU executing closed-loop fuel injection and ignition timing algorithms with deterministic 25 MHz bus clock. Use Value: Integrated 10-bit ADC and CAN 2.0B enable direct sensor interfacing and vehicle network communication without external components. | Use Scenario: Centralized control of door locks, lighting, wipers, and HVAC functions in modern passenger vehicles. IC Role / Device Role / Timing Role: System controller managing multiple low-speed peripherals via GPIO and serial interfaces while maintaining CAN diagnostics. Use Value: 64 KB Flash with ECC ensures firmware integrity over 15+ year vehicle lifecycle; Grade 0 rating guarantees operation in harsh cabin environments. |
| Transmission Control Unit (TCU) | Advanced Driver Assistance Systems (ADAS) Sensor Interface |
Use Scenario: Gear shift logic, solenoid driver timing, and torque converter clutch control in automatic transmissions. IC Role / Device Role / Timing Role: Safety-critical controller coordinating hydraulic actuation with engine torque requests via CAN FD-capable MSCAN. Use Value: BDM debug support enables in-vehicle calibration updates; 4 KB SRAM accommodates real-time control buffers and fault logging. | Use Scenario: Signal conditioning and preprocessing of radar or ultrasonic sensor outputs before forwarding to ADAS domain controller. IC Role / Device Role / Timing Role: Edge-processing node performing analog front-end digitization and time-stamped CAN message packaging. Use Value: 8-bit DAC provides calibrated reference voltage for sensor biasing; 16-bit TIM module enables precise pulse-width measurement of echo returns. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12G128F0VLHR | 128 KB Flash, same 64-pin LQFP package, identical peripheral set and AEC-Q100 Grade 0 rating | Higher firmware complexity, OTA update partitioning, or future feature expansion requirements | Select when >64 KB code space is required without changing PCB layout |
| S9S12G48F0WLFR | 48 KB Flash, otherwise identical pinout, temperature grade, and peripheral configuration | Cost-sensitive applications with smaller firmware footprint and no need for future scalability | Choose for lower BOM cost where 48 KB Flash suffices and software size is verified |
Compared with S9S12G64F0WLFR, the MC9S12G128F0VLHR offers double Flash capacity in identical packaging for long-term design flexibility, while the S9S12G48F0WLFR reduces non-recurring engineering cost by trimming Flash without altering hardware integration or thermal design.
Availability
S9S12G64F0WLFR is available at Aetrix Electronics and suitable for engine control units, body control modules, and transmission control systems requiring stable component supply across automotive production lifecycles.
Supply support for S9S12G64F0WLFR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The MC9S12G family was designed specifically for cost-optimized, AEC-Q100-compliant automotive body and powertrain control applications, emphasizing robustness, integrated CAN, and long-lifecycle support.
FAQ
What is the maximum operating frequency of the S9S12G64F0WLFR?
The S9S12G64F0WLFR supports a maximum bus clock frequency of 25 MHz, derived from its internal PLL locked to either the internal RC oscillator (1 MHz) or an external crystal (1–32 MHz). This frequency governs instruction execution speed, peripheral timing, and CAN bit rate generation. All timing specifications in the MC9S12G Family Reference Manual Rev.1.28 assume operation at this rated bus clock, and the S9S12G64F0WLFR is validated for stable operation across its full -40°C to +125°C temperature range at 25 MHz.
Does the S9S12G64F0WLFR include built-in error correction for Flash memory?
Yes, the S9S12G64F0WLFR includes on-chip Flash memory with Error Correction Code (ECC) support, as documented in Chapter 1.3.2 and Appendix A of the MC9S12G Family Reference Manual Rev.1.28. This ECC implementation detects double-bit errors and corrects single-bit errors in real time during read operations, enhancing reliability for automotive safety-critical applications. The 64 KB Flash is organized into 1 KB sectors, each protected by dedicated ECC bits stored in associated spare memory locations.
Is the S9S12G64F0WLFR qualified for automotive use?
Yes, the S9S12G64F0WLFR is AEC-Q100 qualified to Grade 0, meaning it is certified for operation from -40°C to +125°C ambient temperature and meets rigorous stress test requirements for automotive under-hood and cabin applications. This qualification is explicitly stated in Appendix C ("Ordering and Shipping Information") and Appendix A ("Electrical Characteristics") of the MC9S12G Family Reference Manual Rev.1.28, and the "W" in the part number denotes the Grade 0 temperature option.
What debug interface does the S9S12G64F0WLFR support?
The S9S12G64F0WLFR supports the Background Debug Module (BDM) interface, a single-wire, asynchronous serial protocol defined in Chapter 7 of the MC9S12G Family Reference Manual Rev.1.28. BDM enables non-intrusive flash programming, real-time register and memory inspection, breakpoint insertion, and instruction tracing without requiring dedicated JTAG pins. It uses the BKGD pin (Pin 1) and shares no resources with user I/O, making it ideal for production programming and field diagnostics.
Which CAN protocol version is implemented in the S9S12G64F0WLFR?
The S9S12G64F0WLFR implements the Scalable Controller Area Network (MSCAN) module compliant with CAN 2.0B specification, supporting both standard (11-bit) and extended (29-bit) identifier frames, as confirmed in Chapter 18 of the MC9S12G Family Reference Manual Rev.1.28. It delivers full protocol handling including message buffering, acceptance filtering, automatic retransmission, and bus-off recovery - all without CPU intervention - enabling deterministic real-time communication in automotive networks.
S9S12G64F0WLFR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 48-LQFP
- Series:
- HCS12
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- 12V1
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- CANbus, IrDA, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 40
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.13V ~ 5.5V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 150°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S12G64F0WLFR FAQ
1.How can I place an order for S9S12G64F0WLFR through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S12G64F0WLFR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S12G64F0WLFR reliable?
The price and inventory of S9S12G64F0WLFR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S12G64F0WLFR is usually 5 days.
3.What payment methods are accepted for S9S12G64F0WLFR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S12G64F0WLFR transactions.
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4.How is shipping managed for S9S12G64F0WLFR?
S9S12G64F0WLFR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S12G64F0WLFR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S12G64F0WLFR?
For technical support, including S9S12G64F0WLFR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S12G64F0WLFR requirements.
6.How does Aetrix verify that S9S12G64F0WLFR is sourced from the original manufacturer or authorized distributors?
All S9S12G64F0WLFR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S12G64F0WLFR meets industry standards.
7.What is the process for return or replacement of S9S12G64F0WLFR?
All S9S12G64F0WLFR units undergo pre-shipment inspection (PSI). If there is an issue with S9S12G64F0WLFR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S12G64F0WLFR part is unused and in its original packaging.
Return procedure for S9S12G64F0WLFR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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