My Inquiry
My Account
NXP Semiconductors S9S12G96F0MLF
- Part No.:
- S9S12G96F0MLF
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
S9S12G96F0MLF.pdf
- Description:
- IC MCU 16BIT 96KB FLASH 48LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,172
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S9S12G96F0MLF from NXP Semiconductors is a 16-bit automotive-grade microcontroller based on the S12 CPU12 core, featuring 96 KB on-chip Flash with ECC, 8 KB SRAM, and integrated CAN 2.0B controller. It operates at up to 25 MHz, supports -40°C to +125°C ambient temperature, and includes 10-bit ADC (16-channel), 8-bit DAC, PWM, SCI, SPI, and BDM debug interface - deployed in engine control units and body electronics modules.
For engineers reviewing the S9S12G96F0MLF datasheet, S9S12G96F0MLF pinout, S9S12G96F0MLF application, or S9S12G96F0MLF equivalent, key selection criteria include AEC-Q100 Grade 1 qualification, 96 KB Flash with error correction, CAN bus integration, 10-bit ADC resolution with external trigger support, and compatibility with standard S12 development tools including CodeWarrior and P&E Multilink.
Technical Context
The S9S12G96F0MLF implements the legacy S12 CPU12 architecture with 16-bit data path and 24-bit address space, executing instructions in single-cycle or multi-cycle modes depending on addressing mode. Its memory subsystem includes 96 KB of user-programmable Flash organized in 1-KB sectors with ECC protection, plus 8 KB of SRAM with parity checking.
Peripheral integration follows the MC9S12G family architecture: a single MSCAN module supporting CAN 2.0B protocol with 15 message buffers, a 16-channel 10-bit ADC with configurable sample-and-hold and external trigger inputs (ETRIG0–ETRIG3), and dual serial interfaces (SCI and SPI) with independent baud rate generators and FIFO buffering.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | S12 CPU12 16-bit CISC core with 24-bit address bus and 16-MHz–25-MHz operation |
| Flash Memory | 96 KB on-chip Flash with ECC, sector-erasable, 100K write/erase cycles, retention >20 years |
| RAM | 8 KB on-chip SRAM with parity checking, accessible in all operating modes |
| ADC | 10-bit successive approximation ADC with 16 input channels, 12.5 µs conversion time, external trigger support |
| CAN Interface | Single MSCAN module compliant with ISO 11898-1, supporting CAN 2.0B protocol with 15 message buffers |
| Operating Temperature | -40°C to +125°C ambient, qualified per AEC-Q100 Grade 1 for automotive powertrain and chassis applications |
| Package | 64-pin LQFP (10 mm × 10 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3 |
Pinout & Package
Package: 64-pin LQFP (10 mm × 10 mm, 0.5 mm pitch), thermally enhanced with exposed thermal pad (EP). Pinout conforms to MC9S12G96 device mapping per Appendix D of MC9S12G Family Reference Manual Rev.1.28.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDPLL | Power supply rails | Separate digital (VDD), analog (VDDA), and PLL (VDDPLL) supplies enable noise isolation for ADC and clock generation |
| VSS, VSSA, VSSPLL | Ground terminals | Dedicated analog (VSSA) and PLL (VSSPLL) grounds reduce coupling noise into sensitive circuits |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external reset sources or watchdog timeout assertion |
| XTAL, EXTAL | Crystal oscillator interface | Supports 4–32 MHz crystal or external clock source for main system clock generation |
| MSCAN_TX, MSCAN_RX | CAN physical layer interface | Differential CAN bus transceiver pins requiring external high-speed CAN driver (e.g., TJA1042) |
| PT0–PT7 | Timer input capture/output compare | 8-channel 16-bit timer module with input capture, output compare, and PWM generation capability |
| AD0–AD15 | ADC input multiplexing | 16 dedicated analog input pins mapped to 10-bit ADC; AD0–AD7 also serve as general-purpose I/O |
| BKGD | Background Debug pin | Single-wire BDM interface for flash programming, real-time debugging, and breakpoint control |
Key Features
| Feature | Design Value |
|---|---|
| On-chip Flash with ECC | 96 KB Flash with single-bit error correction and double-bit error detection ensures firmware integrity in harsh EMI environments |
| AEC-Q100 Grade 1 Qualification | Validated for operation from -40°C to +125°C, meeting automotive reliability and lifetime requirements for non-safety-critical ECUs |
| Integrated MSCAN Module | Hardware-accelerated CAN 2.0B controller with 15 message buffers reduces CPU overhead and guarantees deterministic message handling |
| 10-bit ADC with External Trigger | 16-channel ADC supports synchronized sampling via ETRIG0–ETRIG3 signals, enabling precise timing-critical measurements (e.g., crankshaft position) |
| Background Debug (BDM) | Single-pin BKGD interface enables full flash programming, register inspection, and real-time breakpoint control without halting peripheral operation |
Applications
| Engine Control Unit (ECU) | Body Control Module (BCM) |
|---|---|
|
Use Scenario: Real-time monitoring of throttle position, coolant temperature, and oxygen sensor feedback in gasoline direct injection systems. IC Role / Device Role / Timing Role: Primary engine management MCU executing closed-loop fuel injection and spark timing algorithms at 10 ms intervals. Use Value: 96 KB Flash accommodates complex calibration tables and diagnostics; MSCAN ensures robust communication with transmission and ABS modules. |
Use Scenario: Centralized control of door locks, window lifts, interior lighting, and mirror adjustment in mid-tier passenger vehicles. IC Role / Device Role / Timing Role: Standalone BCM processor managing multiple LIN slave nodes and local sensor inputs with <50 ms response latency. Use Value: 10-bit ADC resolves cabin temperature to ±0.5°C; 8 KB SRAM supports concurrent task scheduling for comfort functions. |
| Transmission Control Unit (TCU) | Steering Column Module |
|
Use Scenario: Gear shift logic, clutch pressure control, and torque converter lockup management in 6-speed automatic transmissions. IC Role / Device Role / Timing Role: Safety-relevant controller interfacing with hydraulic solenoids and speed sensors using deterministic interrupt-driven execution. Use Value: AEC-Q100 Grade 1 rating ensures reliability under under-hood thermal stress; CAN interface synchronizes shift events with engine ECU. |
Use Scenario: Integration of steering angle sensing, wiper/washer activation, and turn signal cancellation logic within the steering column assembly. IC Role / Device Role / Timing Role: Dedicated sub-system MCU handling analog sensor conditioning (potentiometer, Hall effect) and discrete actuator drive. Use Value: Dedicated VDDA/VSSA rails minimize ADC noise; PT0–PT7 timer channels support precise pulse-width measurement for rotary encoder inputs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S12G128F0MLF | 128 KB Flash, same package and peripheral set; no change in RAM, ADC, or CAN configuration | Required where larger calibration data sets or future firmware expansion is anticipated | Select when >96 KB code space is needed without altering hardware layout or toolchain |
| MC9S12XDP512MAG | XGATE co-processor, 512 KB Flash, 32 KB RAM, enhanced CAN FD readiness; different pinout and larger package (112-pin MAPBGA) | Targeted at next-generation powertrain systems requiring higher throughput and CAN FD migration path | Choose only if architectural scalability and XGATE offload justify PCB redesign and qualification effort |
Compared with S9S12G96F0MLF, the S9S12G128F0MLF offers seamless Flash upgrade within identical footprint and tooling, while the MC9S12XDP512MAG introduces architectural divergence with XGATE acceleration and CAN FD readiness - making it suitable only for new designs targeting long-term platform evolution.
Availability
S9S12G96F0MLF is available at Aetrix Electronics and suitable for engine control units, body control modules, and transmission control units requiring stable component supply across extended automotive production lifecycles.
Supply support for S9S12G96F0MLF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The MC9S12G family, including S9S12G96F0MLF, was designed specifically for cost-sensitive automotive body and powertrain applications requiring AEC-Q100 compliance, robust Flash reliability, and mature toolchain support.
FAQ
What is the maximum operating frequency of the S9S12G96F0MLF?
The S9S12G96F0MLF supports a maximum core clock frequency of 25 MHz, achievable via its internal Phase-Locked Loop (IPLL) when driven by a 4–8 MHz crystal or external clock source. This frequency enables deterministic execution of automotive control loops with cycle times under 10 µs per instruction in optimized code paths. The S9S12G96F0MLF maintains timing compliance across its full -40°C to +125°C operating range.
Does the S9S12G96F0MLF support CAN FD?
No, the S9S12G96F0MLF integrates the legacy MSCAN module compliant only with CAN 2.0B (ISO 11898-1), not CAN FD. It supports bit rates up to 1 Mbps and 15 message buffers but lacks the variable data length, CRC extension, and arbitration enhancements defined in ISO 11898-1:2015. For CAN FD, designers must select newer families such as S32K1 or S32K3.
What debug interface does the S9S12G96F0MLF use?
The S9S12G96F0MLF uses the Background Debug Mode (BDM) interface via the BKGD pin, supporting single-wire communication for flash programming, register read/write, and breakpoint insertion. It is compatible with standard BDM tools including P&E Multilink Universal, Segger J-Link (with BDM firmware), and NXP's own DEMO9S12G128 evaluation board debugger.
Is the S9S12G96F0MLF pin-compatible with other MC9S12G devices?
Yes, the S9S12G96F0MLF in the 64-pin LQFP package shares identical pinout with other MC9S12G family members in the same package option, including S9S12G48F0MLF and S9S12G128F0MLF. This allows hardware reuse across variants differing only in Flash size, provided peripheral usage aligns with the target device's resource mapping.
What is the Flash endurance specification for the S9S12G96F0MLF?
The S9S12G96F0MLF specifies 100,000 write/erase cycles per Flash sector and data retention exceeding 20 years at +85°C. Each 1-KB sector can be erased independently, and ECC circuitry detects and corrects single-bit errors during read operations - critical for maintaining firmware integrity in automotive field deployments.
S9S12G96F0MLF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 48-LQFP
- Series:
- HCS12
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- 12V1
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- CANbus, IrDA, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 40
- Program Memory Size:
- 96KB (96K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 3K x 8
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.13V ~ 5.5V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S12G96F0MLF FAQ
1.How can I place an order for S9S12G96F0MLF through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S12G96F0MLF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S12G96F0MLF reliable?
The price and inventory of S9S12G96F0MLF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S12G96F0MLF is usually 5 days.
3.What payment methods are accepted for S9S12G96F0MLF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S12G96F0MLF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S12G96F0MLF?
S9S12G96F0MLF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S12G96F0MLF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S12G96F0MLF?
For technical support, including S9S12G96F0MLF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S12G96F0MLF requirements.
6.How does Aetrix verify that S9S12G96F0MLF is sourced from the original manufacturer or authorized distributors?
All S9S12G96F0MLF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S12G96F0MLF meets industry standards.
7.What is the process for return or replacement of S9S12G96F0MLF?
All S9S12G96F0MLF units undergo pre-shipment inspection (PSI). If there is an issue with S9S12G96F0MLF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S12G96F0MLF part is unused and in its original packaging.
Return procedure for S9S12G96F0MLF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S9S12G96F0MLF Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
