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NXP Semiconductors S9S12GN16F1CLC
- Part No.:
- S9S12GN16F1CLC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
S9S12GN16F1CLC.pdf
- Description:
- IC MCU 16BIT 16KB FLASH 32LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,414
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Product details
Overview
S9S12GN16F1CLC from NXP Semiconductors is a 16-bit automotive-grade microcontroller in the S12G family, featuring 16 KB on-chip Flash with ECC, 1 KB RAM, and integrated CAN 2.0B controller. It operates at up to 25 MHz core frequency, supports -40°C to +125°C ambient temperature, and includes 8-channel 16-bit timer, 10-bit ADC (8-channel), and BDM debug interface. It is used in engine control modules and body electronics where functional safety and robustness are required.
For engineers reviewing the S9S12GN16F1CLC datasheet, S9S12GN16F1CLC pinout, S9S12GN16F1CLC application, or S9S12GN16F1CLC equivalent, key selection criteria include AEC-Q100 Grade 1 qualification, CAN bus integration, Flash memory endurance (100k erase/write cycles), and availability of production-ready toolchain support including CodeWarrior and S32DS.
Technical Context
The S9S12GN16F1CLC implements the CPU12 core with 16-bit data path and Harvard architecture, executing instructions from internal Flash or external memory via expanded multiplexed bus. Its clock system combines internal RC oscillator (1–8 MHz), external crystal (1–32 MHz), and PLL for configurable system clock up to 25 MHz.
It integrates S12MSCANV3 for CAN 2.0B communication with message buffering and error handling, TIM16B6CV3 for input capture/output compare and PWM generation, and ADC10B8CV2 supporting single- or multi-channel conversions with software/hardware triggering and configurable resolution modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | CPU12 16-bit CISC core with 24-bit address space and 16 MB linear memory map |
| Flash Memory | 16 KB on-chip Flash with ECC protection and 100k erase/write cycle endurance |
| RAM | 1 KB on-chip SRAM with retention during stop mode |
| ADC | 10-bit, 8-channel SAR ADC with 12.5 µs conversion time and selectable reference (VDD or internal 2.5 V) |
| CAN Interface | One S12MSCANV3 module compliant with ISO 11898-1, supporting 1 Mbps baud rate and 64-message object buffer |
| Operating Temperature | -40°C to +125°C ambient, qualified per AEC-Q100 Grade 1 for automotive applications |
| Package | 48-pin LQFP (7 mm × 7 mm), lead-free and RoHS-compliant |
Pinout & Package
Package: 48-pin LQFP (7 mm × 7 mm), thermally enhanced, with exposed thermal pad (EP). Pin pitch: 0.5 mm. Compliant with JEDEC MO-220, RoHS and halogen-free requirements.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDX | Power supply inputs | VDD (digital core), VDDA (analog), VDDX (external bus) each require local 100 nF decoupling; separate supplies enable noise isolation |
| VSS, VSSA, VSSX | Ground returns | Digital, analog, and external bus grounds must be connected at single point near regulator to minimize ground bounce |
| XTAL, EXTAL | Crystal oscillator terminals | Supports fundamental-mode quartz crystals (1–8 MHz); internal load capacitors configurable via register |
| RESET | Active-low reset input | Asynchronous, Schmitt-triggered; internal pull-up enables reliable power-on reset without external components |
| PORTA[7:0] | General-purpose I/O with interrupt capability | PA0–PA7 support edge-sensitive IRQ, wake-up from stop mode, and peripheral function multiplexing (e.g., CAN RX/TX) |
| PORTB[7:0] | GPIO with timer and ADC functions | PB0–PB7 serve as timer input capture/compare outputs, ADC channel inputs, and standard digital I/O |
| CANRX, CANTX | CAN physical layer interface | Differential CAN bus signals routed directly to transceiver; require external termination (120 Ω) and ESD protection |
Key Features
| Feature | Design Value |
|---|---|
| On-chip Flash with ECC | Enables ASIL-B capable designs by detecting and correcting single-bit errors in program memory during runtime |
| Background Debug Module (BDM) | Single-wire debug interface supporting full-speed execution control, register inspection, and Flash programming without dedicated JTAG pins |
| Integrated CAN 2.0B Controller | Reduces BOM cost and PCB area by eliminating external CAN controller; supports automatic retransmission and error confinement |
| Low-power Stop Mode | Consumes <10 µA typical current while retaining RAM and wake-up capability via IRQ or CAN activity |
| 10-bit ADC with Hardware Triggering | Supports synchronized sampling across multiple channels using timer or CAN message events - critical for motor phase current sensing |
Applications
| Engine Control Unit (ECU) | Body Control Module (BCM) |
|---|---|
Use Scenario: Real-time monitoring of throttle position, coolant temperature, and oxygen sensor feedback in gasoline engine management systems. IC Role / Device Role / Timing Role: Primary MCU executing closed-loop fuel injection and ignition timing algorithms with deterministic 25 MHz instruction throughput. Use Value: Integrated CAN interface enables direct communication with transmission and ABS ECUs; AEC-Q100 Grade 1 ensures reliability under under-hood thermal stress. |
Use Scenario: Centralized control of door locks, lighting, wipers, and HVAC in mid-tier passenger vehicles. IC Role / Device Role / Timing Role: System coordinator managing distributed LIN nodes and driving discrete loads via GPIO and PWM outputs. Use Value: 16 KB Flash accommodates bootloader + application firmware; low-power stop mode extends battery life during vehicle sleep states. |
| Electric Power Steering (EPS) | Advanced Driver Assistance Systems (ADAS) Sensor Interface |
Use Scenario: Torque assist calculation and motor phase current regulation in column-assist EPS systems. IC Role / Device Role / Timing Role: Safety-critical controller performing ASIL-B level diagnostics and real-time motor control loop (<100 µs jitter). Use Value: On-chip ECC and BDM debug support simplify functional safety certification; 10-bit ADC provides sufficient resolution for current shunt sensing. |
Use Scenario: Signal conditioning and preprocessing of radar or ultrasonic sensor outputs before forwarding to domain controller. IC Role / Device Role / Timing Role: Edge-processing node converting analog sensor outputs to digital messages via CAN or SPI. Use Value: Hardware-triggered ADC allows precise synchronization with sensor excitation pulses; 8-channel input supports multi-sensor aggregation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S12GN32F1CLC | 32 KB Flash, same package and peripheral set; identical pinout and electrical specs | Required when application firmware exceeds 16 KB or future-proofing for feature expansion is needed | Select if firmware size growth is anticipated; no hardware change required |
| MC9S12XEP100MAL | 16-bit S12X core, 1 MB Flash, 50 MHz max, additional XGATE coprocessor and enhanced CAN FD support | Targeted at higher-complexity ADAS or gateway applications requiring parallel processing and faster bus speeds | Choose only when XGATE offload or CAN FD protocol is mandatory; not drop-in compatible |
Compared with S9S12GN16F1CLC, the S9S12GN32F1CLC offers scalable Flash capacity within identical footprint and qualification, while MC9S12XEP100MAL delivers higher performance and protocol flexibility at the cost of increased complexity and non-interchangeable packaging.
Availability
S9S12GN16F1CLC is available at Aetrix Electronics and suitable for engine control units, body electronics modules, and electric power steering systems requiring stable component supply across automotive production lifecycles.
Supply support for S9S12GN16F1CLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in microcontrollers and automotive electronics.
The S9S12GN16F1CLC belongs to the S12G family - designed specifically for cost-sensitive, high-reliability automotive body and powertrain applications requiring AEC-Q100 qualification and long-term supply stability.
FAQ
What is the maximum operating frequency of the S9S12GN16F1CLC?
The S9S12GN16F1CLC achieves a maximum core clock frequency of 25 MHz using its internal PLL, derived from either the internal RC oscillator or an external crystal (1–32 MHz). This frequency enables deterministic real-time control loops with sub-100 µs interrupt latency, validated across the full -40°C to +125°C temperature range specified for the S9S12GN16F1CLC.
Does the S9S12GN16F1CLC support CAN FD?
No, the S9S12GN16F1CLC integrates the S12MSCANV3 module compliant with CAN 2.0B only (ISO 11898-1), supporting data rates up to 1 Mbps and standard/extended identifiers. CAN FD capability is not present in this device; it requires migration to S12X or S32K families for FD support. The S9S12GN16F1CLC remains fully interoperable with legacy CAN networks.
What debug interface does the S9S12GN16F1CLC use?
The S9S12GN16F1CLC uses the Background Debug Module (BDM) interface - a single-wire, asynchronous serial protocol accessible via the BKGD pin. It supports full-speed debugging, Flash programming, register read/write, and breakpoint insertion without requiring JTAG pins or external debug adapters beyond a standard BDM pod. This interface is standardized across the S12G family including the S9S12GN16F1CLC.
Is the S9S12GN16F1CLC qualified for automotive applications?
Yes, the S9S12GN16F1CLC is qualified to AEC-Q100 Grade 1 (-40°C to +125°C), with full characterization across voltage, temperature, and lifetime stress testing. It includes built-in features essential for automotive use: Flash ECC, COP watchdog, BDM security lock, and production-tested ESD immunity (±2 kV HBM). These qualifications are documented in NXP's official S12G family release reports for the S9S12GN16F1CLC.
What is the Flash endurance specification for the S9S12GN16F1CLC?
The S9S12GN16F1CLC specifies 100,000 erase/write cycles for its 16 KB on-chip Flash memory, verified per JEDEC JESD22-A117. Each sector can be erased independently, and ECC logic ensures data integrity over the full lifetime. This endurance rating applies under rated operating conditions and is guaranteed for the S9S12GN16F1CLC across its qualified temperature range.
S9S12GN16F1CLC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- HCS12
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- 12V1
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- IrDA, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 26
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 512 x 8
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.13V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S12GN16F1CLC FAQ
1.How can I place an order for S9S12GN16F1CLC through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S12GN16F1CLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S12GN16F1CLC reliable?
The price and inventory of S9S12GN16F1CLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S12GN16F1CLC is usually 5 days.
3.What payment methods are accepted for S9S12GN16F1CLC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S12GN16F1CLC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S12GN16F1CLC?
S9S12GN16F1CLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S12GN16F1CLC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S12GN16F1CLC?
For technical support, including S9S12GN16F1CLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S12GN16F1CLC requirements.
6.How does Aetrix verify that S9S12GN16F1CLC is sourced from the original manufacturer or authorized distributors?
All S9S12GN16F1CLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S12GN16F1CLC meets industry standards.
7.What is the process for return or replacement of S9S12GN16F1CLC?
All S9S12GN16F1CLC units undergo pre-shipment inspection (PSI). If there is an issue with S9S12GN16F1CLC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S12GN16F1CLC part is unused and in its original packaging.
Return procedure for S9S12GN16F1CLC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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