My Inquiry
My Account
NXP Semiconductors S9S12GN16F1MLCR
- Part No.:
- S9S12GN16F1MLCR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
S9S12GN16F1MLCR.pdf
- Description:
- IC MCU 16BIT 16KB FLASH 32LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,205
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S9S12GN16F1MLCR from NXP Semiconductors is a 16-bit automotive-grade microcontroller in the S12G family, featuring 16 KB on-chip Flash with ECC, 1 KB SRAM, and integrated CAN 2.0B controller. It operates at up to 25 MHz, supports -40°C to 125°C ambient temperature, and includes 8-channel 16-bit timer, 10-bit ADC (8-channel), and background debug interface. It is used in engine control modules for sensor signal acquisition and real-time actuator command execution.
For engineers reviewing the S9S12GN16F1MLCR datasheet, S9S12GN16F1MLCR pinout, S9S12GN16F1MLCR application, or S9S12GN16F1MLCR equivalent, key selection criteria include AEC-Q100 Grade 1 qualification, CAN bus integration, Flash memory endurance (>100k erase/write cycles), and compatibility with standard S12 development tools including CodeWarrior and P&E Multilink.
Technical Context
The S9S12GN16F1MLCR implements the S12 CPU12 core with 16-bit data path and 24-bit addressing, supporting both single-chip and expanded multiplexed bus modes. Its clock system combines internal RC oscillator (1–8 MHz), external crystal input (up to 32 MHz), and PLL-based frequency multiplication to achieve stable 25 MHz core operation.
Memory protection is enforced via on-chip security module with flash block locking and BDM disable capability. Peripheral integration includes scalable timer (TIM16B6CV3), pulse-width modulation (PWM8B8CV2), and serial interfaces (SCI, SPI, MSCAN) with configurable interrupt prioritization and wake-up-from-stop functionality.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | S12 CPU12 16-bit CISC core with 24-bit address bus and 16 MB linear memory map |
| Flash Memory | 16 KB on-chip Flash with ECC, >100k erase/write cycles, sector erase capability |
| RAM | 1 KB on-chip SRAM, battery-backed option available via external circuitry |
| Max Clock Frequency | 25 MHz core frequency derived from PLL; supports 1–8 MHz internal RC or external crystal input |
| Operating Temperature | -40°C to +125°C ambient, qualified per AEC-Q100 Grade 1 for automotive powertrain applications |
| ADC Resolution | 10-bit successive approximation ADC with 8 input channels, 12 µs conversion time, internal reference |
| CAN Interface | Scalable Controller Area Network (MSCAN) compliant with ISO 11898-1, supporting CAN 2.0B protocol with 32 message objects |
Pinout & Package
Package: 48-pin QFP (MLC), 7 mm × 7 mm, 0.5 mm pitch, RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDPLL | Power supply inputs | Separate digital (VDD), analog (VDDA), and PLL (VDDPLL) rails enable noise isolation for mixed-signal operation |
| VSS, VSSA, VSSPLL | Ground returns | Dedicated analog and PLL ground pins reduce coupling noise into sensitive ADC and clock domains |
| XTAL, EXTAL | Crystal oscillator terminals | Supports fundamental-mode quartz crystals up to 32 MHz for precise timing reference |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external reset sources or watchdog timeout assertion |
| PORTA[7:0] | General-purpose I/O / ADC inputs | 8-bit port with configurable direction, internal pull-ups, and shared ADC channel mapping (AD0–AD7) |
| PORTB[7:0] | General-purpose I/O / CAN signals | Includes CANRX/CANTX on PB0/PB1; supports high-speed CAN transceiver interface |
| PORTC[7:0] | General-purpose I/O / SCI/SPI | Shares SCI0TX/SCI0RX (PC0/PC1) and SPI MOSI/MISO/SCK (PC2–PC4) |
| PORTD[7:0] | General-purpose I/O / Timer/PWM | Maps to TIM channels (PT0–PT7) and PWM outputs (PP0–PP7) for motor control timing |
| PORTP[7:0] | General-purpose I/O / Background Debug | Includes BKGD pin (PP0) for single-wire BDM communication and programming |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q100 Grade 1 qualification | Validated for automotive powertrain use with full temperature range (-40°C to +125°C) and lifetime reliability testing |
| On-chip Flash with ECC | Enables error detection and correction during program execution, critical for fail-safe engine control logic |
| Integrated MSCAN 2.0B controller | Reduces external component count and PCB footprint by embedding CAN protocol handling in hardware |
| Background Debug Module (BDM) | Allows non-intrusive real-time debugging and flash programming via single-wire BKGD interface |
| Configurable low-power modes | Supports WAIT, STOP, and PSTOP modes with selective peripheral wake-up to extend battery life in idle states |
Applications
| Engine Control Unit (ECU) | Transmission Control Module (TCM) |
|---|---|
Use Scenario: Real-time processing of crankshaft/camshaft position, throttle angle, and oxygen sensor signals to compute fuel injection timing and spark advance. IC Role / Device Role / Timing Role: Primary MCU executing closed-loop combustion control algorithms with deterministic 25 MHz instruction throughput. Use Value: Integrated 10-bit ADC and CAN interface eliminate need for external signal conditioning and bus transceivers, reducing BOM cost and board area. | Use Scenario: Monitoring vehicle speed, gear selector position, and hydraulic pressure to manage solenoid-driven shift actuation and torque converter lockup. IC Role / Device Role / Timing Role: Real-time scheduler managing PWM outputs to transmission solenoids with sub-millisecond jitter tolerance. Use Value: 8-channel 16-bit timer and dedicated PWM module enable precise duty-cycle control across multiple solenoids without CPU overhead. |
| Body Control Module (BCM) | Electric Power Steering (EPS) |
Use Scenario: Centralized management of door locks, window lifts, lighting, and HVAC fan speed using discrete I/O and PWM outputs. IC Role / Device Role / Timing Role: System coordinator interfacing with LIN slaves and local sensors via PORTA–PORTD GPIO banks. Use Value: 48-pin QFP package provides sufficient I/O count (32+ GPIO) while maintaining compact footprint for space-constrained body electronics enclosures. | Use Scenario: Closed-loop torque assist calculation based on steering torque, vehicle speed, and motor current feedback for brushless DC motor control. IC Role / Device Role / Timing Role: Safety-critical MCU running ASIL-B compliant software with flash ECC and BDM debug access for validation. Use Value: AEC-Q100 Grade 1 qualification and on-chip security features meet functional safety requirements for EPS system certification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S12GN32F1MLCR | 32 KB Flash, same package and pinout; identical peripheral set and timing specs | Supports larger firmware images and more complex control algorithms without layout change | Select when future firmware growth or additional diagnostic features require >16 KB code space |
| MC9S12XEP100MALR | Enhanced XGATE co-processor, 1 MB Flash, 50 MHz core, LQFP-112 package | Higher performance and memory capacity suited for advanced ADAS gateway functions | Choose for next-generation platforms requiring multi-threaded real-time processing and CAN FD support |
Compared with S9S12GN32F1MLCR, the S9S12GN16F1MLCR offers identical I/O, timing, and CAN functionality at lower Flash density-ideal for cost-sensitive, functionally fixed ECUs. Against MC9S12XEP100MALR, it trades raw performance and scalability for smaller footprint, lower power, and simpler toolchain integration in legacy automotive designs.
Availability
S9S12GN16F1MLCR is available at Aetrix Electronics and suitable for engine control units, transmission control modules, and body control modules requiring stable component supply across extended automotive production lifecycles.
Supply support for S9S12GN16F1MLCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with over 30 years of microcontroller innovation.
The S12G family-including S9S12GN16F1MLCR-is designed specifically for cost-optimized, safety-conscious automotive powertrain and chassis control systems requiring AEC-Q100 compliance and long-term supply stability.
FAQ
What is the maximum operating frequency of the S9S12GN16F1MLCR?
The S9S12GN16F1MLCR achieves a maximum core clock frequency of 25 MHz using its internal PLL, which multiplies an external crystal (up to 32 MHz) or internal RC oscillator. This frequency enables deterministic real-time execution of engine control algorithms with sub-microsecond interrupt latency. The S9S12GN16F1MLCR maintains timing integrity across its full -40°C to +125°C operating range.
Does the S9S12GN16F1MLCR support CAN FD or only classical CAN?
The S9S12GN16F1MLCR integrates the MSCAN module compliant with ISO 11898-1 and supports only Classical CAN (CAN 2.0B), not CAN FD. It provides 32 message objects, programmable bit timing, and automatic retransmission. For CAN FD applications, designers should consider NXP's S32K series or MC9S12XEP100MALR, as the S9S12GN16F1MLCR does not implement the extended data length or higher bit rates required for CAN FD.
Is the S9S12GN16F1MLCR pin-compatible with other S12G family members?
Yes-the S9S12GN16F1MLCR is pin-compatible with S9S12GN32F1MLCR and S9S12GN48F1MLCR in the same 48-pin QFP (MLC) package. All share identical pin assignments, electrical characteristics, and peripheral mappings. This allows hardware reuse across variants differing only in Flash size (16 KB, 32 KB, or 48 KB), simplifying platform scaling and inventory management for automotive Tier 1 suppliers.
What debug interface does the S9S12GN16F1MLCR use?
The S9S12GN16F1MLCR uses the Background Debug Module (BDM) interface via the BKGD pin (PP0) for single-wire in-circuit debugging and flash programming. It supports standard BDM commands, real-time register inspection, breakpoint insertion, and non-intrusive trace-all compatible with P&E Multilink and NXP CodeWarrior IDE. No JTAG header or additional debug pins are required.
What is the Flash endurance specification for the S9S12GN16F1MLCR?
The S9S12GN16F1MLCR specifies Flash endurance of greater than 100,000 erase/write cycles per sector, verified under AEC-Q100 stress conditions. Each 16 KB Flash block is organized into 128 sectors (128 bytes each), enabling fine-grained updates for over-the-air (OTA) calibration data storage without compromising main application code integrity.
S9S12GN16F1MLCR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- HCS12
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- 12V1
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- IrDA, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 26
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 512 x 8
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.13V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S12GN16F1MLCR FAQ
1.How can I place an order for S9S12GN16F1MLCR through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S12GN16F1MLCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S12GN16F1MLCR reliable?
The price and inventory of S9S12GN16F1MLCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S12GN16F1MLCR is usually 5 days.
3.What payment methods are accepted for S9S12GN16F1MLCR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S12GN16F1MLCR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S12GN16F1MLCR?
S9S12GN16F1MLCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S12GN16F1MLCR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S12GN16F1MLCR?
For technical support, including S9S12GN16F1MLCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S12GN16F1MLCR requirements.
6.How does Aetrix verify that S9S12GN16F1MLCR is sourced from the original manufacturer or authorized distributors?
All S9S12GN16F1MLCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S12GN16F1MLCR meets industry standards.
7.What is the process for return or replacement of S9S12GN16F1MLCR?
All S9S12GN16F1MLCR units undergo pre-shipment inspection (PSI). If there is an issue with S9S12GN16F1MLCR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S12GN16F1MLCR part is unused and in its original packaging.
Return procedure for S9S12GN16F1MLCR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S9S12GN16F1MLCR Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
