My Inquiry
My Account
NXP Semiconductors S9S12GN16F1VLCR
- Part No.:
- S9S12GN16F1VLCR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
S9S12GN16F1VLCR.pdf
- Description:
- IC MCU 16BIT 16KB FLASH 32LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,598
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S9S12GN16F1VLCR from NXP Semiconductors is a 16-bit automotive-grade MCU in the S12G family, featuring 16 KB on-chip Flash with ECC, 1 KB SRAM, and integrated CAN 2.0B controller. It operates at up to 25 MHz core frequency, supports 5 V I/O, and includes 10-bit ADC (8-channel), PWM, SCI, SPI, and BDM debug interface. It targets engine control units, body electronics, and industrial motor controllers requiring AEC-Q100 Grade 2 qualification.
For engineers reviewing the S9S12GN16F1VLCR datasheet, S9S12GN16F1VLCR pinout, S9S12GN16F1VLCR application, or S9S12GN16F1VLCR equivalent, key selection criteria include its 48-pin LQFP package, 5 V tolerant I/O, internal voltage regulator, CAN bus support, and qualification for -40°C to +105°C ambient operation in safety-critical embedded systems.
Technical Context
The S9S12GN16F1VLCR implements the S12 CPU12 core with 16-bit data path and von Neumann architecture, executing instructions from on-chip Flash or external memory via expanded multiplexed bus. Its clock system integrates an internal RC oscillator (1–8 MHz), external crystal input (1–32 MHz), and PLL for stable 25 MHz operation.
System integrity features include COP watchdog timer, low-voltage detection, and background debug module (BDM) supporting real-time in-circuit debugging without halting execution. Memory protection is enforced via flash security byte and BDM lock mechanism to prevent unauthorized access.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | S12 CPU12 16-bit CISC core with 25 MHz max frequency - enables deterministic real-time control loops in automotive timing-critical applications. |
| Memory | 16 KB Flash (with ECC), 1 KB SRAM, 512 B EEPROM - sufficient for compact engine management firmware with data logging and calibration storage. |
| ADC | 10-bit SAR ADC with 8 input channels, 12.5 µs conversion time - supports analog sensor interfacing (e.g., throttle position, coolant temperature) with single-cycle sampling. |
| CAN Interface | Scalable Controller Area Network (MSCAN) module compliant with ISO 11898-1:2003 - provides robust, fault-tolerant serial communication for vehicle network nodes. |
| I/O Voltage | 5 V tolerant digital I/O with internal 5 V regulator - eliminates need for external level-shifting when interfacing with legacy automotive sensors and actuators. |
| Operating Temperature | -40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood deployment in passenger vehicles without additional thermal derating. |
| Package | 48-pin LQFP (7 mm × 7 mm, 0.5 mm pitch) - compatible with standard SMT reflow profiles and supports high-density PCB layouts in space-constrained ECUs. |
Pinout & Package
48-pin LQFP (Leadless Quad Flat Package), 7 mm × 7 mm body, 0.5 mm lead pitch, exposed thermal pad (VSS), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDPLL | Power supply inputs | Dedicated domains for digital logic (VDD), analog subsystem (VDDA), and PLL circuitry (VDDPLL) - enable noise isolation and stable ADC/CAN operation. |
| VSS, VSSA, VSSPLL | Ground returns | Separate ground planes per power domain reduce coupling noise and improve signal integrity for mixed-signal operation. |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external reset sources or microcontroller-initiated reset via COP timeout. |
| PORTA[7:0] | General-purpose I/O / ADC channel inputs | Configurable as digital I/O or analog inputs AD0–AD7 - supports direct connection of potentiometers, thermistors, and Hall-effect sensors. |
| PORTB[3:0] | CAN transceiver interface | TXCAN, RXCAN, CANRXD, CANTXD pins - connect directly to ISO 11898-compliant CAN physical layer transceivers (e.g., TJA1042). |
| PORTC[3:0] | PWM outputs / SCI signals | Four PWM channels (PWMA0–PWMA3) and full-duplex SCI interface (TXD/RXD) - enable motor speed control and diagnostic UART communication. |
| PORTD[7:0] | General-purpose I/O / SPI interface | Supports SPI master/slave mode (MISO/MOSI/SCK/SS) and up to 8 GPIOs - used for EEPROM, sensor, or display interface expansion. |
| PORTP[7:0] | Background Debug (BKGD) | Single-wire BDM interface - allows programming, breakpoint setting, and register inspection using standard NXP BDM tools (e.g., Multilink Universal). |
Key Features
| Feature | Design Value |
|---|---|
| On-chip Flash with ECC | 16 KB Flash with error-correcting code detects and corrects single-bit errors - ensures firmware reliability over 15+ year automotive service life. |
| Integrated MSCAN Module | Full CAN 2.0B protocol stack implemented in hardware with 16 message buffers - reduces CPU load and guarantees deterministic message transmission timing. |
| Internal Voltage Regulator | On-die 5 V regulator supplies core logic and I/O - simplifies power design by eliminating external 5 V LDO for MCU operation. |
| Background Debug Module (BDM) | Single-pin, non-intrusive debug interface supporting flash programming and real-time variable monitoring - accelerates ECU development and field diagnostics. |
| AEC-Q100 Grade 2 Qualification | Validated for operation from -40°C to +105°C with extended reliability testing (HTOL, TC, ESD) - meets OEM requirements for powertrain and chassis modules. |
Applications
| Engine Control Unit (ECU) | Body Control Module (BCM) |
|---|---|
|
Use Scenario: Real-time monitoring of crankshaft position, throttle angle, and oxygen sensor feedback to compute fuel injection timing and spark advance. IC Role / Device Role / Timing Role: Primary control MCU executing closed-loop combustion algorithms with sub-millisecond interrupt latency. Use Value: Integrated 10-bit ADC, PWM timers, and CAN interface enable direct sensor-to-actuator control without external glue logic. |
Use Scenario: Centralized management of door locks, window lifts, interior lighting, and mirror adjustment via LIN/CAN gateway functions. IC Role / Device Role / Timing Role: System coordinator handling multi-protocol communication (SCI for diagnostics, CAN for gateway, PWM for motor drivers). Use Value: 5 V I/O tolerance and AEC-Q100 qualification allow direct integration with 12 V automotive power infrastructure. |
| Industrial Motor Drive | Two-Wheeler Instrument Cluster |
|
Use Scenario: Closed-loop speed regulation of BLDC motors in HVAC blowers or pump systems using hall sensor feedback and 3-phase PWM generation. IC Role / Device Role / Timing Role: Motion controller managing commutation sequencing, current sensing, and fault shutdown within <50 µs response window. Use Value: Hardware PWM with dead-time insertion and ADC-triggered sampling ensure precise motor phase alignment and torque ripple reduction. |
Use Scenario: Display driver and telemetry aggregator in motorcycle dashboards, receiving speed, RPM, and battery voltage via CAN from engine ECU. IC Role / Device Role / Timing Role: Embedded host processor rendering analog gauges via PWM-driven stepper motors and driving segmented LCD via SPI. Use Value: On-chip 1 KB SRAM and 16 KB Flash accommodate boot loader, gauge animation logic, and CAN message buffering without external memory. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S12GN32F1VLCR | 32 KB Flash, same 48-pin LQFP package and peripheral set - doubles program memory for larger control algorithms or OTA update partitions. | Preferred where firmware complexity exceeds 16 KB or dual-bank flash updates are required. | Select when future firmware growth or secure bootloader implementation demands >16 KB executable space. |
| MC9S12XEP100MAL | XEP series with 1 MB Flash, 50 MHz core, enhanced CAN FD support, and XGATE co-processor - significantly higher performance and memory capacity. | Targeted at advanced ADAS or gateway ECUs requiring multi-CAN domain routing and real-time OS support. | Choose only if S12G's 25 MHz/16 KB limit is insufficient; requires PCB redesign due to 112-pin LQFP package. |
Compared with S9S12GN16F1VLCR, the S9S12GN32F1VLCR offers scalable memory within identical footprint and qualification, while MC9S12XEP100MAL delivers architectural headroom at cost and layout complexity premium - making S9S12GN16F1VLCR optimal for cost-sensitive, thermally constrained AEC-Q100 Grade 2 applications.
Availability
S9S12GN16F1VLCR is available at Aetrix Electronics and suitable for engine control units, body electronics modules, and industrial motor drives requiring stable component supply across long production lifecycles and automotive qualification compliance.
Supply support for S9S12GN16F1VLCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in microcontrollers, RF, and edge processing.
The S9S12GN16F1VLCR belongs to NXP's S12G MCU product line, designed specifically for cost-optimized, AEC-Q100-compliant automotive body and powertrain control applications demanding robustness, low power, and proven field reliability.
FAQ
What is the maximum operating frequency of the S9S12GN16F1VLCR?
The S9S12GN16F1VLCR operates at a maximum core frequency of 25 MHz, achieved via its internal PLL locked to either the internal RC oscillator or an external crystal source. This frequency is fully supported across the full -40°C to +105°C temperature range and meets AEC-Q100 Grade 2 electrical specifications. The S9S12GN16F1VLCR maintains timing compliance under worst-case voltage and temperature conditions without derating.
Does the S9S12GN16F1VLCR support CAN FD?
No, the S9S12GN16F1VLCR implements the legacy MSCAN module compliant with CAN 2.0B (ISO 11898-1:2003), supporting data rates up to 1 Mbps but not CAN FD frame format or bit-rate switching. For CAN FD capability, NXP recommends the S32K1xx or S32K3xx families. The S9S12GN16F1VLCR remains suitable for conventional automotive networks where CAN 2.0B suffices.
What debug interface does the S9S12GN16F1VLCR use?
The S9S12GN16F1VLCR uses the Background Debug Module (BDM) interface, accessed via a single BKGD pin and dedicated VDD/VSS connections. It supports flash programming, real-time register inspection, and breakpoint-based debugging using standard NXP-compatible tools such as the PE Micro Multilink or SEGGER J-Link with BDM firmware. No JTAG port is present on the S9S12GN16F1VLCR.
Is the S9S12GN16F1VLCR pin-compatible with other S12G family members?
Yes, the S9S12GN16F1VLCR shares identical pinout and package (48-pin LQFP) with S9S12GN32F1VLCR, S9S12GNA16F1VLCR, and S9S12GNA32F1VLCR - enabling drop-in replacement for memory or feature upgrades without PCB revision. However, it is not pin-compatible with larger S12G variants (e.g., 64 KB or 96 KB Flash) which use 64-pin or 112-pin packages.
What is the purpose of the internal voltage regulator in the S9S12GN16F1VLCR?
The internal voltage regulator in the S9S12GN16F1VLCR generates a stable 5 V supply from the main 5 V rail to power the core logic, I/O buffers, and internal peripherals - eliminating the need for an external 5 V LDO in most designs. This simplifies power architecture, reduces BOM count, and improves system-level efficiency by avoiding cascaded regulation losses typical in multi-rail MCU implementations.
S9S12GN16F1VLCR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- HCS12
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- 12V1
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- IrDA, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 26
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 512 x 8
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.13V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S12GN16F1VLCR FAQ
1.How can I place an order for S9S12GN16F1VLCR through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S12GN16F1VLCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S12GN16F1VLCR reliable?
The price and inventory of S9S12GN16F1VLCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S12GN16F1VLCR is usually 5 days.
3.What payment methods are accepted for S9S12GN16F1VLCR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S12GN16F1VLCR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S12GN16F1VLCR?
S9S12GN16F1VLCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S12GN16F1VLCR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S12GN16F1VLCR?
For technical support, including S9S12GN16F1VLCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S12GN16F1VLCR requirements.
6.How does Aetrix verify that S9S12GN16F1VLCR is sourced from the original manufacturer or authorized distributors?
All S9S12GN16F1VLCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S12GN16F1VLCR meets industry standards.
7.What is the process for return or replacement of S9S12GN16F1VLCR?
All S9S12GN16F1VLCR units undergo pre-shipment inspection (PSI). If there is an issue with S9S12GN16F1VLCR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S12GN16F1VLCR part is unused and in its original packaging.
Return procedure for S9S12GN16F1VLCR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S9S12GN16F1VLCR Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
