NXP Semiconductors S9S12GN48F1VLCR
- Part No.:
- S9S12GN48F1VLCR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
S9S12GN48F1VLCR.pdf
- Description:
- IC MCU 16BIT 48KB FLASH 32LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,733
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Product details
Overview
S9S12GN48F1VLCR from NXP Semiconductors is a 16-bit automotive-grade microcontroller in the S12G family, featuring 48 KB on-chip Flash with ECC, 4 KB SRAM, and integrated CAN 2.0B controller. It operates at up to 25 MHz core frequency, supports -40°C to +105°C ambient temperature, and includes 10-bit ADC (8-channel), PWM (8-channel), and BDM debug interface. It targets engine control units, body electronics, and transmission modules requiring AEC-Q100 Grade 2 compliance.
For engineers reviewing the S9S12GN48F1VLCR datasheet, S9S12GN48F1VLCR pinout, S9S12GN48F1VLCR application, or S9S12GN48F1VLCR equivalent, key selection criteria include Flash size (48 KB), CAN interface integration, extended temperature operation (-40°C to +105°C), package type (LQFP-48), and AEC-Q100 qualification status - all confirmed for this exact variant.
Technical Context
The S9S12GN48F1VLCR implements the S12 CPU12 core with 16-bit data path and von Neumann architecture, executing instructions from internal Flash or SRAM. Its memory subsystem includes 48 KB Flash with single-bit error correction and double-bit error detection, plus 4 KB SRAM with parity protection.
It integrates a scalable Controller Area Network (MSCAN) module compliant with ISO 11898-1, supporting bit rates up to 1 Mbps, along with a 10-bit, 8-channel ADC with configurable sample-and-hold and external trigger capability. Clock generation uses an internal RC oscillator (1–8 MHz), main external crystal (1–32 MHz), and PLL for core frequency scaling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | S12 CPU12 16-bit CISC core with 25 MHz max bus frequency |
| Flash Memory | 48 KB on-chip Flash with ECC for safety-critical firmware storage |
| RAM | 4 KB SRAM with parity checking for reliable runtime data handling |
| ADC | 10-bit, 8-channel SAR ADC with programmable conversion sequence and external trigger support |
| CAN Interface | One MSCAN module compliant with CAN 2.0B protocol, supporting 1 Mbps bit rate |
| Operating Temperature | -40°C to +105°C ambient, qualified per AEC-Q100 Grade 2 |
| Package | 48-pin LQFP (7 mm × 7 mm, 0.5 mm pitch), RoHS-compliant |
Pinout & Package
LQFP-48 package with exposed thermal pad; 7 mm × 7 mm footprint, 0.5 mm lead pitch, JEDEC MS-026AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDX | Power supply inputs | Separate digital (VDD), analog (VDDA), and external oscillator (VDDX) rails for noise isolation |
| VSS, VSSA, VSSX | Ground connections | Dedicated digital (VSS), analog (VSSA), and oscillator (VSSX) grounds to minimize coupling |
| XTAL, EXTAL | Crystal oscillator terminals | Supports 1–32 MHz external crystal or ceramic resonator for precise clock source |
| CANH, CANL | CAN bus differential pair | Direct connection to physical CAN transceiver; supports high-speed (ISO 11898-2) signaling |
| AD0–AD7 | Analog input channels | Eight dedicated ADC input pins with internal multiplexer; support single-ended or differential sampling |
| PT0–PT7 | General-purpose I/O / Timer channels | 8-bit port with selectable timer capture/compare functions and interrupt-on-change capability |
| BKGD | Background Debug pin | Single-wire BDM interface for programming, debugging, and flash erase without reset |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q100 Grade 2 qualification | Validated for automotive under-hood applications with full temperature range (-40°C to +105°C) |
| On-chip Flash with ECC | Enables ASIL-B capable systems by detecting and correcting single-bit errors in program memory |
| Integrated MSCAN module | Reduces BOM count and PCB area by eliminating external CAN controller; supports mailbox-based message handling |
| Programmable low-power modes | Stop, Wait, and Pseudo-Stop modes with wake-up via CAN, IRQ, or timer event - critical for battery-powered modules |
| Background Debug (BDM) | Enables in-circuit flash programming and real-time debugging using only BKGD and VDD/VSS pins |
Applications
| Engine Control Unit (ECU) | Body Control Module (BCM) |
|---|---|
Use Scenario: Real-time monitoring of throttle position, coolant temperature, and oxygen sensor signals in gasoline engine management. IC Role / Device Role / Timing Role: Primary MCU executing closed-loop fuel injection and ignition timing algorithms with deterministic response to CAN bus commands. Use Value: 10-bit ADC resolution enables precise sensor digitization; MSCAN ensures robust communication with dashboard and transmission controllers. |
Use Scenario: Centralized control of door locks, lighting, wipers, and HVAC in mid-tier passenger vehicles. IC Role / Device Role / Timing Role: System coordinator managing multiple LIN slaves and relaying status over CAN backbone. Use Value: 48 KB Flash accommodates multi-feature firmware; AEC-Q100 Grade 2 ensures reliability across vehicle lifetime. |
| Transmission Control Unit (TCU) | Electric Power Steering (EPS) |
Use Scenario: Gear shift logic, clutch pressure modulation, and torque converter lockup control in automatic transmissions. IC Role / Device Role / Timing Role: Safety-aware controller interfacing with solenoid drivers and speed sensors while reporting faults via CAN. Use Value: ECC-protected Flash and SRAM meet functional safety requirements; 25 MHz bus speed supports fast control loop execution. |
Use Scenario: Torque assist calculation and motor current regulation in column-assist EPS systems. IC Role / Device Role / Timing Role: Real-time motor controller with PWM output, ADC feedback, and CAN diagnostics interface. Use Value: Integrated 8-channel PWM with dead-time insertion simplifies gate driver design; 8-channel ADC supports dual current sensing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S12GN32F1VLCR | 32 KB Flash, same 48-pin LQFP package, identical peripheral set except reduced Flash capacity | Suitable for cost-sensitive BCM or lighting modules where firmware footprint < 30 KB | Select when firmware size permits reduction and BOM cost optimization is prioritized over future scalability |
| S9S12G48F1VLCR | Same 48 KB Flash but lacks AEC-Q100 qualification; rated for industrial temperature (-40°C to +85°C) | Applicable in non-automotive industrial controls where automotive qualification is not mandated | Choose only for non-automotive designs; not acceptable for OEM automotive programs requiring Grade 2 certification |
Compared with S9S12GN48F1VLCR, the S9S12GN32F1VLCR offers lower Flash density at identical package and qualification, while the S9S12G48F1VLCR removes automotive qualification - making the original part uniquely suited for AEC-Q100-compliant 48 KB Flash applications in harsh environments.
Availability
S9S12GN48F1VLCR is available at Aetrix Electronics and suitable for engine control units, body control modules, transmission control units, and electric power steering systems requiring stable component supply across automotive production lifecycles.
Supply support for S9S12GN48F1VLCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The S9S12GN48F1VLCR belongs to the S12G microcontroller family, designed specifically for cost-optimized, safety-conscious automotive body and powertrain applications with integrated CAN and AEC-Q100 qualification.
FAQ
What is the maximum operating frequency of the S9S12GN48F1VLCR?
The S9S12GN48F1VLCR supports a maximum bus frequency of 25 MHz, achieved via its internal PLL using either the internal RC oscillator or external crystal (1–32 MHz). This frequency governs instruction execution speed, peripheral timing, and ADC conversion rate - all verified under AEC-Q100 Grade 2 conditions from -40°C to +105°C. The S9S12GN48F1VLCR does not support overclocking beyond this specification.
Does the S9S12GN48F1VLCR include hardware support for functional safety standards?
Yes, the S9S12GN48F1VLCR includes Flash with ECC, SRAM with parity, and a watchdog timer with windowed mode - features aligned with ISO 26262 ASIL-B requirements. It is AEC-Q100 Grade 2 qualified, and its failure-in-time (FIT) rate is documented in NXP's reliability reports. These capabilities are intrinsic to the S9S12GN48F1VLCR silicon and require no external components to implement basic safety mechanisms.
Can the S9S12GN48F1VLCR be programmed in-system without removing it from the PCB?
Yes, the S9S12GN48F1VLCR supports in-circuit programming and debugging via its single-wire Background Debug (BDM) interface using the BKGD pin. No JTAG header or external programmer is required - standard BDM tools (e.g., PE Micro Cyclone) can erase, program, and debug the S9S12GN48F1VLCR while mounted on the target board, provided VDD, VSS, and BKGD are accessible.
What is the ADC resolution and channel count on the S9S12GN48F1VLCR?
The S9S12GN48F1VLCR integrates a 10-bit successive approximation register (SAR) ADC with 8 input channels (AD0–AD7). It supports both single-ended and differential input modes, configurable sample-and-hold timing, and external triggering from timer or CAN events. Conversion time is 8 µs typical at 25 MHz bus speed - a parameter confirmed in the MC9S12G Family Data Sheet for the S9S12GN48F1VLCR variant.
Is the S9S12GN48F1VLCR pin-compatible with other S12G family members?
The S9S12GN48F1VLCR uses a 48-pin LQFP package shared with several S12G variants (e.g., S9S12GN32F1VLCR, S9S12G48F1VLCR), and its pinout is identical within the "GN" subfamily. However, pin compatibility does not guarantee functional or software compatibility - differences in Flash size, qualification grade, or peripheral enablement require validation. The S9S12GN48F1VLCR pinout is defined in Section 1.8.3 of the MC9S12G Family Reference Manual Rev. 1.28.
S9S12GN48F1VLCR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- HCS12
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- 12V1
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- IrDA, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 26
- Program Memory Size:
- 48KB (48K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 1.5K x 8
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.13V ~ 5.5V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S12GN48F1VLCR FAQ
1.How can I place an order for S9S12GN48F1VLCR through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S12GN48F1VLCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S12GN48F1VLCR reliable?
The price and inventory of S9S12GN48F1VLCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S12GN48F1VLCR is usually 5 days.
3.What payment methods are accepted for S9S12GN48F1VLCR?
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4.How is shipping managed for S9S12GN48F1VLCR?
S9S12GN48F1VLCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S12GN48F1VLCR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S12GN48F1VLCR?
For technical support, including S9S12GN48F1VLCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S12GN48F1VLCR requirements.
6.How does Aetrix verify that S9S12GN48F1VLCR is sourced from the original manufacturer or authorized distributors?
All S9S12GN48F1VLCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S12GN48F1VLCR meets industry standards.
7.What is the process for return or replacement of S9S12GN48F1VLCR?
All S9S12GN48F1VLCR units undergo pre-shipment inspection (PSI). If there is an issue with S9S12GN48F1VLCR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S12GN48F1VLCR part is unused and in its original packaging.
Return procedure for S9S12GN48F1VLCR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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