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NXP Semiconductors S9S12VR16F0CLC
- Part No.:
- S9S12VR16F0CLC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
S9S12VR16F0CLC.pdf
- Description:
- IC MCU 16BIT 16KB FLASH 32LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,184
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Product details
Overview
S9S12VR16F0CLC from NXP Semiconductors (formerly Freescale) is a 16-bit HCS12-based automotive microcontroller with integrated LIN physical layer, high-side and low-side drivers, 16 KB Flash, 1 KB RAM, and on-chip voltage regulator. It operates at up to 25 MHz bus speed, supports 5 V single-supply operation, and targets body control modules requiring embedded power switching and serial communication.
For engineers reviewing the S9S12VR16F0CLC datasheet, S9S12VR16F0CLC pinout, S9S12VR16F0CLC application, or S9S12VR16F0CLC equivalent, key selection criteria include LINPHY compliance, integrated HSDRV/LSDRV drive capability (170 mA sink/source), BATS supply monitoring, and 48-pin LQFP package compatibility with automotive temperature range (–40°C to +125°C).
Technical Context
The S9S12VR16F0CLC implements the HCS12 CPU12 core with 16-bit data path and 24-bit addressing, executing instructions from on-chip Flash with ECC protection. Its clock system integrates an internal RC oscillator (IRC), PLL for frequency multiplication, and external crystal support via XOSCLCP module.
System-level integration includes dedicated LINPHY transceiver compliant with ISO 17987-4, dual-channel high-side drivers (HSDRV) with overcurrent protection, and low-side drivers (LSDRV) supporting PWM-controlled loads. The BATS module provides real-time battery voltage sensing with 10-bit resolution and programmable thresholds.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS12 16-bit CPU with 24-bit address space and 10.24 µs minimum instruction cycle at 25 MHz bus clock |
| Memory | 16 KB on-chip Flash (ECC-protected), 1 KB SRAM, 512 B EEPROM emulation via Flash |
| Operating Voltage | 4.5 V to 27 V input range supported by integrated VREG; core logic powered at 2.5 V (VDD), NVM at 3.3 V (VDDF) |
| LIN Compliance | Integrated LINPHY v2.0 transceiver meeting ISO 17987-4 physical layer requirements for 19.2 kbps baud rate |
| Driver Outputs | 2× high-side drivers (170 mA sink per channel), 2× low-side drivers (250 mA source per channel), with thermal shutdown and open-load detection |
| Analog Monitoring | BATS module provides 10-bit ADC conversion of battery voltage with ±1% accuracy across –40°C to +125°C |
| Package | 48-pin LQFP (7 mm × 7 mm, 0.5 mm pitch), RoHS-compliant, automotive-grade moisture sensitivity level 3 |
Pinout & Package
48-pin LQFP package with exposed thermal pad (EP), rated for industrial and automotive temperature ranges (–40°C to +125°C). Pin assignments follow MC9S12VR family standard layout with dedicated LINRX/LINTX, HSDRV/LSDRV control and output pins, and multiplexed I/O grouped by port (P, T, S, E, L, AD).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Core power/ground | Supplies 2.5 V logic core; requires local 100 nF decoupling per pair |
| VDDF, VSS | Flash/NVM power/ground | Supplies 3.3 V non-volatile memory circuitry; separate filtering recommended |
| VSUP | Main supply input | Accepts 4.5–27 V battery rail; feeds internal VREG and BATS sensing network |
| LINRX / LINTX | LIN bus interface | Differential receiver and transmitter pins compliant with LIN 2.2/ISO 17987-4 |
| HSDRV1 / HSDRV2 | High-side driver outputs | Direct connection to load anode; each supports 170 mA continuous, with current-limiting and fault reporting |
| LSDRV1 / LSDRV2 | Low-side driver outputs | Ground-switched outputs; PWM-capable, 250 mA max sink, with open-load diagnostics |
| PORTP[0:3] | Multiplexed I/O | Configurable as general-purpose I/O or dedicated functions including COP reset, IRQ, and BDM signals |
Key Features
| Feature | Design Value |
|---|---|
| Integrated LINPHY Transceiver | Eliminates external LIN transceiver IC, reducing BOM count and PCB area in body electronics nodes |
| On-Chip Voltage Regulator (VREG) | Single 5 V input powers entire MCU subsystem-core, Flash, analog, and drivers-without external regulators |
| Supply Voltage Sensing (BATS) | Real-time battery monitoring with programmable low-voltage warning thresholds for safe shutdown sequencing |
| High-Side Driver Protection | Automatic thermal foldback, overcurrent shutdown, and diagnostic flag reporting via status registers |
| Background Debug Module (BDM) | Single-wire debug interface enabling flash programming and real-time debugging without halting application code |
Applications
| Body Control Module (BCM) | Smart Junction Box (SJB) |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirrors, and interior lighting in modern vehicles. IC Role / Device Role / Timing Role: Primary MCU managing I/O expansion, LIN slave communication, and direct load switching via integrated HSDRV/LSDRV. Use Value: Reduces external component count by integrating LINPHY, regulators, and drivers-cutting system cost and board space by ~30% vs discrete solutions. | Use Scenario: Power distribution hub routing battery power to multiple vehicle subsystems with fuseless electronic protection. IC Role / Device Role / Timing Role: System controller executing load shedding algorithms, monitoring VSUP, and driving high-side switches for branch circuits. Use Value: Enables precise current limiting and open-load detection per channel, eliminating mechanical fuses and enabling predictive maintenance logging. |
| Roof Module Controller | Seat Control Unit |
Use Scenario: Managing sunroof actuation, ambient lighting, and rain sensor interface in overhead console assemblies. IC Role / Device Role / Timing Role: LIN slave node receiving commands from BCM while locally controlling motor drivers and ADC-based sensor inputs. Use Value: On-chip BATS monitoring ensures reliable operation during cranking events; integrated PWM timers enable smooth sunroof motor ramping. | Use Scenario: Controlling seat position motors, heating elements, and occupancy detection sensors in premium automotive seating. IC Role / Device Role / Timing Role: Dual-role device acting as LIN slave for command reception and local master for motor commutation timing via TIM/PWM modules. Use Value: HSDRV channels directly drive seat heater resistive loads; LSDRV outputs control H-bridge direction signals with hardware dead-time insertion. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12VR32F0CLC | 32 KB Flash, same peripheral set and pinout; higher code capacity for complex diagnostics or bootloader features | Required where firmware size exceeds 16 KB or dual-bank Flash updates are needed | Select when future firmware growth or secure OTA update capability is mandated |
| SPC560B50L5 | 32-bit Power Architecture core, 512 KB Flash, CAN FD, no integrated LINPHY or HSDRV | Used in higher-tier ECUs requiring CAN-based networking and greater compute throughput | Choose for systems needing CAN FD connectivity and >100 MHz processing; not drop-in compatible |
Compared with MC9S12VR32F0CLC, S9S12VR16F0CLC offers identical peripherals and footprint but reduced Flash-suitable for cost-sensitive, fixed-function nodes. Versus SPC560B50L5, it trades raw performance for integrated LIN and power drivers, lowering system-level BOM and simplifying design for entry-level body electronics.
Availability
S9S12VR16F0CLC is available at Aetrix Electronics and suitable for automotive body control modules, smart junction boxes, roof console controllers, and seat control units requiring stable component supply across extended temperature and long product lifecycles.
Supply support for S9S12VR16F0CLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, IoT, and communication infrastructure markets, delivering secure, energy-efficient silicon solutions.
The S9S12VR family was designed specifically for automotive body electronics applications requiring integrated LIN communication, embedded power switching, and robust supply monitoring-targeting cost-sensitive, high-reliability control nodes.
FAQ
What is the maximum operating frequency of the S9S12VR16F0CLC?
The S9S12VR16F0CLC supports a maximum bus clock frequency of 25 MHz, derived from its internal PLL or external crystal oscillator. This corresponds to a typical instruction execution rate of approximately 10 million instructions per second (MIPS), sufficient for real-time body control tasks such as LIN message handling, PWM motor control, and sensor polling without external acceleration.
Does the S9S12VR16F0CLC include a built-in LIN transceiver?
Yes, the S9S12VR16F0CLC integrates a LINPHY v2.0 transceiver compliant with ISO 17987-4, supporting standard 19.2 kbps baud rate and bus fault tolerance up to ±40 V. The LINRX and LINTX pins provide direct connection to the LIN bus, eliminating the need for an external transceiver IC in compliant designs.
Can the S9S12VR16F0CLC operate directly from a 12 V automotive battery?
Yes, the S9S12VR16F0CLC accepts 4.5 V to 27 V on its VSUP pin and regulates internally to generate VDD (2.5 V), VDDF (3.3 V), and analog reference voltages. This allows direct connection to the vehicle battery rail-including cranking transients-without external DC-DC converters or LDOs.
What diagnostic capabilities does the S9S12VR16F0CLC provide for its high-side drivers?
The S9S12VR16F0CLC high-side drivers (HSDRV1/HSDRV2) feature real-time current monitoring, thermal shutdown, open-load detection, and short-to-battery/ground fault reporting. Status flags are accessible via HSDRVSTAT register, enabling software-triggered safety responses such as load disable or error logging without external sense resistors.
Is the S9S12VR16F0CLC pin-compatible with other MC9S12VR family members?
Yes, the S9S12VR16F0CLC shares the same 48-pin LQFP package and pin assignment with other MC9S12VR family variants including S9S12VR32F0CLC and S9S12VR64F0CLC. This enables hardware reuse across product tiers-only Flash size and certain configuration bits differ, allowing scalable firmware deployment without PCB redesign.
S9S12VR16F0CLC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- S12 MagniV
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- 12V1
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- IrDA, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 16
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128 x 8
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.13V ~ 5.5V
- Data Converters:
- A/D 2x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S12VR16F0CLC FAQ
1.How can I place an order for S9S12VR16F0CLC through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S12VR16F0CLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S12VR16F0CLC reliable?
The price and inventory of S9S12VR16F0CLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S12VR16F0CLC is usually 5 days.
3.What payment methods are accepted for S9S12VR16F0CLC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S12VR16F0CLC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S12VR16F0CLC?
S9S12VR16F0CLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S12VR16F0CLC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S12VR16F0CLC?
For technical support, including S9S12VR16F0CLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S12VR16F0CLC requirements.
6.How does Aetrix verify that S9S12VR16F0CLC is sourced from the original manufacturer or authorized distributors?
All S9S12VR16F0CLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S12VR16F0CLC meets industry standards.
7.What is the process for return or replacement of S9S12VR16F0CLC?
All S9S12VR16F0CLC units undergo pre-shipment inspection (PSI). If there is an issue with S9S12VR16F0CLC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S12VR16F0CLC part is unused and in its original packaging.
Return procedure for S9S12VR16F0CLC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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